Patents by Inventor Gabe Cherian

Gabe Cherian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7617945
    Abstract: The invention covers a number of alternative improvements to the prior art pull-tab used to open container such as soda cans. One improvement is by forming the nose of the pull tab at a certain angle to the body of the tab, thus allowing the user to tilt the tab thus lifting the pull tip higher and providing more room for the user to insert the finger tip under the pull tip thus making it easier to open the container. Another improvement is by rotating the pull tab a certain angle and making it follow a caming surface thus lifting the pull tip and again providing more room to insert the finger tip and making it easier to open the container.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: November 17, 2009
    Inventor: Gabe Cherian
  • Patent number: 7598758
    Abstract: Described are methods of using probes, for making electrical contact to high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe working tips stretch outwardly and create the desirable wipe or scrub. Described also are the probes themselves that are used for the above methods. In this divisional application, the emphasis is on the first group.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: October 6, 2009
    Inventor: Gabe Cherian
  • Publication number: 20090240776
    Abstract: The Mother invention, XML1, covers certain improvements to the Internet methods of handling “stray” email messages, which are sent to old “invalid” email addresses. It provides means and methods to salvage such stray messages. It proposes to establish a depository data center, which could be referred to as the XMAIL™ Center, with appropriate infrastructure, to store information in database files, correlating old “invalid” email addresses of participating users to their corresponding new “valid” email addresses. On demand and according to the wishes of the participants, the XMAIL™ Center can provide the necessary information to help in forwarding/delivering such stray messages to their intended recipients. The present invention combines the above XMAIL™ approach with the prior art spam filters and sniffing filters, in order to improve the effectiveness of the system and to create certain additional efficiencies in the total email traffic system.
    Type: Application
    Filed: February 10, 2009
    Publication date: September 24, 2009
    Inventor: GABE CHERIAN
  • Publication number: 20090207575
    Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environmental conditions such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.
    Type: Application
    Filed: August 24, 2008
    Publication date: August 20, 2009
    Inventor: GABE CHERIAN
  • Publication number: 20090181560
    Abstract: The present invention relates generally to interconnections between electrical and electronic devices, such as integrated circuit packages, chips, wafers, substrates or printed circuit boards or similar electronic devices. The invention relates more specifically to springs, used to make connections to electrical elements and to applications of such springs in connectors or interconnection devices. More particularly the springs can be located adjacent to each other on small effective center distances to accommodate high-density electronic devices. Furthermore, the invention relates to connectors that comprise combs that are used in conjunction with such springs, to create and to control the wiping or scrubbing action, which can promote good electrical connection. Moreover, the invention uses such combs that are thermally matched to the electronic devices to improve the performance during thermal cycling procedures.
    Type: Application
    Filed: March 1, 2009
    Publication date: July 16, 2009
    Inventor: GABE CHERIAN
  • Patent number: 7517225
    Abstract: The present invention relates generally to interconnections between electronic devices, such as integrated circuit packages, chips, wafers, substrates or printed circuit boards or similar electronic devices; the invention relates more specifically to springs or equivalent means, used to make connections to electrical elements and to applications of such springs in connectors or interconnection devices. More particularly the springs or equivalent means can be located adjacent to each other on small effective center distances to accommodate high-density electronic devices; furthermore, the present invention relates to combs that are used in conjunction with such springs or equivalent means, to create and to control the wiping or scrubbing action, which can promote good electrical connection. Moreover, the present invention uses such combs that are thermally matched to the electronic devices to improve the performance during thermal cycling procedures.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: April 14, 2009
    Inventor: Gabe Cherian
  • Publication number: 20090032915
    Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.
    Type: Application
    Filed: May 27, 2008
    Publication date: February 5, 2009
    Inventors: Gabe Cherian, Don Saunders
  • Patent number: 7433201
    Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environments such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: October 7, 2008
    Inventor: Gabe Cherian
  • Patent number: 7377469
    Abstract: The invention discloses systems for mounting heat shields onto a spacecraft. It shows a number of ways to attach heat shield tiles in a way that allows for and accommodates the thermal expansion and contraction of the tiles without overstressing them and without loosing them due to delamination of adhesives. Shown also are various fasteners, which are flexible in several directions and which should preferably be oriented to provide the least resistance to the expected deformations of the tiles.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: May 27, 2008
    Inventor: Gabe Cherian
  • Publication number: 20080003849
    Abstract: The present invention relates generally to interconnections between electronic devices, such as integrated circuit packages, chips, wafers, substrates or printed circuit boards or similar electronic devices. The invention relates more specifically to springs or equivalent means, used to make connections to electrical elements and to applications of such springs in connectors or interconnection devices. More particularly the springs or equivalent means can be located adjacent to each other on small effective center distances to accommodate high-density electronic devices. Furthermore, the present invention relates to combs that are used in conjunction with such springs or equivalent means, to create and to control the wiping or scrubbing action, which can promote good electrical connection. Moreover, the present invention uses such combs that are thermally matched to the electronic devices to improve the performance during thermal cycling procedures.
    Type: Application
    Filed: July 2, 2007
    Publication date: January 3, 2008
    Inventor: Gabe Cherian
  • Publication number: 20070284706
    Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general. For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with. For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.
    Type: Application
    Filed: March 22, 2007
    Publication date: December 13, 2007
    Inventor: Gabe Cherian
  • Publication number: 20070255803
    Abstract: The invention covers certain improvements to the Internet methods of handling “stray” email messages, which are sent to old “invalid” email addresses. It provides means and methods to salvage such stray messages. It proposes to establish a depository center, to store information in database files, to be referred to as the XMAIL™ Database, correlating old “invalid” addresses of participating users to their corresponding new “valid” addresses. Also a new host computer, to be referred to as the XMAIL™, would be created to handle the XMAIL™ Database and the stray mail procedure. On demand and according to the wishes of the participants, the XMAIL™ center can provide the necessary information to help in forwarding/delivering such stray messages to their intended recipients. Also on demand, the new addresses can be given to, or withheld from, the senders, to honor the wishes of the participating recipients.
    Type: Application
    Filed: April 26, 2007
    Publication date: November 1, 2007
    Inventor: GABE CHERIAN
  • Publication number: 20070210816
    Abstract: Described are methods of using probes, for making electrical contact to high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe working tips stretch outwardly and create the desirable wipe or scrub. Described also are the probes themselves that are used for the above methods. In this divisional application, the emphasis is on the first group.
    Type: Application
    Filed: May 24, 2007
    Publication date: September 13, 2007
    Inventor: Gabe Cherian
  • Patent number: 7254889
    Abstract: A spring system arrangement and a related connector are disclosed. The purpose is to allow the use of contact springs, such as coil contact springs, with relatively large size body, to be located on a small center distance, i.e. pitch, and to electrically connect with contact pads of high density electronic devices, having a small device pitch. The device pitch can be smaller than the diameter of the spring body itself. In order to achieve this desired small spring pitch and high density, the contact springs are located in a nested head-to-toe and/or staggered orientation. Furthermore, the connectors utilize guide plates, referred to as combs, to accurately control the alignment of the contact springs tips to the contact pads of the electronic devices.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: August 14, 2007
    Inventor: Gabe Cherian
  • Publication number: 20070167052
    Abstract: The 3-way light bulb has a solder blob on its middle contact ring, where said blob usually has a rough, uneven surface, and frequently does protrude beyond the general surface of the bulb middle contact ring. The solder blob interferes with the conventional socket middle contact element, which is rigid, and prevents the system from creating a good, permanent and reliable electrical connection between the socket and the bulb. Potential flicker and discomfort to the user can occur as a result. Also, the operating life of the bulb as well as the power consumption can be affected. The proposed flexible middle contact spring can alleviate most of these problems.
    Type: Application
    Filed: March 30, 2007
    Publication date: July 19, 2007
    Inventor: Gabe Cherian
  • Patent number: 7227369
    Abstract: Described are methods of using probes, for making electrical contact to high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe working tips stretch outwardly and create the desirable wipe or scrub. Described also are the probes themselves that are used for the above methods.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: June 5, 2007
    Inventor: Gabe Cherian
  • Patent number: 7198505
    Abstract: Improvements to a 3-way light bulb socket are shown. The major improvement is to replace or complement the rigid middle contact element of the socket with an elastic/flexible contact spring. The 3-way light bulb has a solder blob on its middle contact ring, where said blob usually has a rough, uneven surface, and frequently does protrude beyond the general surface of the bulb middle contact ring. The solder blob interferes with the conventional socket middle contact element, which is rigid, and prevents the system from creating a good, permanent and reliable electrical connection between the socket and the bulb. Potential flicker and discomfort to the user can occur as a result. Also, the operating life of the bulb as well as the power consumption can be affected. The proposed flexible middle contact spring can alleviate most of these problems.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: April 3, 2007
    Inventor: Gabe Cherian
  • Patent number: D579771
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: November 4, 2008
    Inventor: Gabe Cherian
  • Patent number: D600116
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: September 15, 2009
    Inventor: Gabe Cherian
  • Patent number: D602776
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: October 27, 2009
    Inventor: Gabe Cherian