Abstract: An electroplating apparatus for high-speed electroplating a cathodic strip of metal passed therethrough. The apparatus includes an elongated cell subdivided into a plurality of sub-cells defined by bottom and side walls and slotted partition walls for passage of the strip from one sub-cell to the next. Each sub-cell is provided with a pair of anodes, and means are provided for circulating electrolyte continuously in and through each sub-cell. The elongated cell is mounted within a surrounding sump tank which functions to collect and remove the overflowing electrolyte. The anode pairs present in each sub-cell are preferably activated in time sequence, proceeding from one end to the other of the cell.