Patents by Inventor Garry P. Liddell

Garry P. Liddell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8066358
    Abstract: A fluid interconnect for a fluid enclosure includes an overmolded sealing surface of a thermoplastic elastomeric material, the sealing surface having an opening, the sealing surface overmolded upon a thermoplastic surface of a fluid enclosure; and a wall of the thermoplastic elastomeric material connected to the sealing surface, the wall enclosing a pathway, the pathway communicating with the opening at a first end; and a layer connected to the wall, the layer closing the pathway at a second end.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: November 29, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Holli C. Ogle, Ralph L. Stathem, Steven Lunceford, Garry P. Liddell
  • Publication number: 20080180493
    Abstract: A fluid interconnect for a fluid enclosure includes an overmolded sealing surface of a thermoplastic elastomeric material, the sealing surface having an opening, the sealing surface overmolded upon a thermoplastic surface of a fluid enclosure; and a wall of the thermoplastic elastomeric material connected to the sealing surface, the wall enclosing a pathway, the pathway communicating with the opening at a first end; and a layer connected to the wall, the layer closing the pathway at a second end.
    Type: Application
    Filed: January 30, 2007
    Publication date: July 31, 2008
    Inventors: Holli C. Ogle, Ralph L. Stathem, Steven Lunceford, Garry P. Liddell
  • Patent number: 5223787
    Abstract: A high-speed, low-profile logic analyzer test probe has a body of insulating material molded directly onto a narrow elongate substrate having electrical circuitry disposed thereon. The molded insulating material has a notch formed therein for exposing a conductive surface formed on the substrate. The exposed conductive surface is used for making a ground connection between the substrate and the ground of a device under test. The probe may be adapted for use in probe holder for multichannel probing wherein the probe holder has an electrically conductive chip disposed within the probe holder housing for providing the shortest possible ground connections between the ground pins on the device under test and the ground connections on the probes.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: June 29, 1993
    Assignee: Tektronix, Inc.
    Inventors: Monty Smith, Garry P. Liddell, James E. Trimble, David G. Payne