Abstract: Replaceable snap-together wires, headphones, headband and plug comprise a modular stereo headphone apparatus. Sealed headphones are provided with walled receptacles to receive mating removable clips secured to the ends of connecting wires. Each clip is molded to the wire insulation and around the wire ends which protrude slightly beyond the clip. Each clip is provided with a protruding movable lever arm with an indent for mating with a protrusion inside a receptacle shaped to fit the clip. Wires from the sound system within each headphone protrude through each receptacle wall to mate in proper polarity with wires in the inserted clip. A flexible headband is provided along its length with either a groove or tabs to receive a headphone connecting wire removably secured to the headband. At each headband end a sleeve receives a protrusion from one headphone adjustably secured to the headband with a spring-loaded pin in the sleeve engaging notches in the headphone protrusion.