Abstract: A thermoplastic composition includes a functionalized poly(arylene ether) and a copolymer of (a) ethylene or an ?-olefin, and (b) an alkyl(meth)acrylate. Optional components in the composition include an impact modifier and a flame retardant. The composition is useful for fabricating wire and cable insulation.

Abstract: A curable composition includes a poly(arylene ether) and a fused alicyclic (meth)acrylate monomer. Also described are a method of preparing the composition, a cured composition derived from the curable composition, and an article comprising the cured composition. The composition is useful, for example, as a bulk molding compound.

Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.

Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Abstract: A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.

Abstract: A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.

Abstract: A functionalized poly(arylene ether) having a pendant carbon—carbon double bond is prepared by reacting the hydroxy end group of a poly(arylene ether) with a polyisocyanate compound to produce a urethane-capped poly(arylene ether) having pendant isocyanate functionality, which is then reacted with a polyfunctional compound having a carbon—carbon double bond and a hydroxy, thiol, or amino group. The functionalized poly(arylene ether) is useful as a component of a curable composition in which its carbon—carbon double bond copolymerizes with one or more olefinically unsaturated comonomers.

Abstract: An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications.

Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), and alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

Abstract: The invention relates to a method of forming a polyphenylene ether resin containing residual aliphatic unsaturation. A polyphenylene ether is reacted with a capping agent in a solvent to form the polyphenylene ether resin containing residual aliphatic unsaturation, which is precipitated from solution by combining the solution with an antisolvent. The precipitated polyphenylene ether resin containing residual aliphatic unsaturation has lower levels of residual impurities than the same compound isolated by devolatilization.

Abstract: A curable composition includes a functionalized poly(arylene ether); an alkenyl aromatic monomer; an acryloyl monomer; and a polymeric additive having a glass transition temperature less than or equal to 100° C. and a Young's modulus less than or equal to 1000 megapascals at 25° C. The polymeric additive is soluble in the combined functionalized poly(arylene ether), alkenyl aromatic monomer, and acryloyl monomer at a temperature less than or equal to 50° C. The composition exhibits low shrinkage on curing and improved surface smoothness. It is useful, for example, in the manufacture of automotive body panels.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A curable resin composition including a poly(arylene ether), an allylic monomer, and an acryloyl monomer may be formulated as a powder. The resin composition exhibits improved toughness, and it is useful in thermoset processing applications where use of powdered resins is preferred.

Abstract: A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an alkoxylated acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, and heat resistance.

Abstract: A powder coating composition comprises at least one thermosetting resin such as epoxy resins, carboxy- or hydroxy-functional polyesters; hydroxy-, carboxyl- or glycidyl-functional acrylic resins; and/or hydroxy- or carboxyl-functional fluoropolymers, fluorochloropolymers or fluoroacrylic polymers blended with a at least one poly(phenylene ether) and at least one curing agent for the thermosetting resin.

Abstract: The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.

Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.

Abstract: A curable composition includes a functionalized poly(arylene ether) an olefinically unsaturated monomer, and a nanofiller. Methods of preparing and curing the composition, as well as uses for the cured composition, are described.

Abstract: A method of preparing a capped poly(arylene ether) resin includes reacting a capping agent with a blend of two or more poly(arylene ether) resins having different intrinsic viscosities. Cured compositions prepared from these capped poly(arylene ether) resins exhibit improved balances of stiffness, toughness, and dielectric properties compared to compositions with two or more separately capped and isolated poly(arylene ether) resins.