Abstract: An optical device, and a method of producing the device, are disclosed. The device comprises a substrate having a near-zero, or negative, coefficient of thermal expansion and an optical component affixed to the substrate with a fusion seal, the seal being the fused product of a low melting glass flit having a positive CTE and a mill addition of a glass-ceramic having an effective negative CTE.

Abstract: Polymeric compositions having a polymeric component and an inorganic filler which undergoes a crystal (phase) inversion within the operating temperature range of the composition are provided. The present invention relates to a method for reducing the water sensitivity of particles of a crystallized phosphate glass. The particles are composed of P.sub.2 O.sub.5 and one or more cations selected from the group consisting of magnesium, cobalt, arsenic, zinc, iron, aluminum, and zirconium. The method includes nitriding the particles.

Abstract: The present invention relates to a method for packaging an optical waveguide coupler where the coupler includes a body having two end portions and a constricted portion located between the end portions. The method includes placing the coupler in a mold where the mold surrounds at least the constricted portion of the coupler, introducing a polymeric composition into the mold so that the polymeric composition substantially fills the constricted portion, curing the polymeric composition, and removing the mold.

Abstract: This invention relates to a resistive heating device. In particular, it relates to an exhaust gas apparatus useful for achieving early light-off of catalytic converters comprising a cellular substrate having a layer of conductive material formed thereon and means for activating the device by passing electric current or by exposing the device to an electromagnetic energy field.

Abstract: Lead-free, tin phosphate glasses contain 25-50 mole percent P.sub.2 O.sub.5, 30-70% SnO, 0-15% ZnO, the mole ratio of SnO:ZnO being greater than 5:1, and an effective amount up to 25% total of at least one oxide in the indicated proportion selected from the group consisting of up to 25% R.sub.2 O, wherein R.sub.2 O consists of 0-25% Li.sub.2 O, 0-25% Na.sub.2 O, and 0-25% K.sub.2 O, up to 20% B.sub.2 O.sub.3, up to 5% Al.sub.2 O.sub.3, up to 5% SiO.sub.2, and up to 5% WO.sub.3. The glasses are particularly useful as sealing glass frits in sealing material to join component parts in electrical and electronic devices. The sealing glass material may contain mill additions to reduce the effective coefficient of thermal expansion in a seal, as well as a strength reinforcing additive having a coefficient of thermal expansion preferably below 120.times.10.sup.-7 /.degree.C.

Abstract: A composite article comprising a silicon body and a glass body bonded directly thereto by electrostatic bonding. The glass composition consists essentially of oxides of silicon, aluminum, and lithium, and the glass has a coefficient of thermal expansion approximating that of silicon, etches at a rate of at least 100 mg/cm.sup.2 in 20 minutes in 48% HF, and may be electrostatically bonded to silicon at a voltage not over 1,000 volts/mm of glass thickness at a temperature not over 440.degree. C.

Abstract: A fusion sealing material containing a mill addition, a sealing tape cast from the material, and a method of producing the tape. The material is composed of a low temperature glass, a mill addition that lowers the effective coefficient of thermal expansion of the glass in a seal and an organic medium. The sealing tape is prepared by hot mixing the solids with a liquefied medium, such as a high melting alcohol, and casting the hot mix onto a cold sheet to immediately solidify the medium.

Abstract: There is disclosed a sealing material based on a lead sealing glass having a mill addition of a crystalline material having the crystalline structure of magnesium pyrophosphate. The effective coefficient of thermal expansion in a seal is substantially reduced by the mill addition, thereby permitting use with low expansion materials.

Abstract: Mill additions are disclosed which lower the CTE of, and are compatible with, tin-phosphorus oxyfluoride glasses. The sealing materials provide fusion-type seals having a CTE not over about 110.times.10.sup.-7 /.degree.C. and a sealing temperature not over about 350.degree. C.Also disclosed is a family of glass compositions in the tin-phosphorus oxyfluoride system that exhibit very low glass transition temperatures and coefficients of thermal expansion not over about 160.times.10-7/.degree.C. (25.degree.-150.degree. C.). In addition to the four basic elements, the glasses contain up to 11% Nb, and may additionally contain up to 10%, taken individually or in combination, of V, Fe and/or Mo to further decrease the Tg and CTE values.

Abstract: There is disclosed a sintered, alpha-cordierite solid solution glass-ceramic body in which the properties of coefficient of thermal expansion and modulus of rupture are stabilized and controlled by using a combination of two dopants in the glass during sintering and crystallization. There is further disclosed the method of producing such bodies, and controlling such properties, through the use of the two dopants.

Abstract: There is disclosed a hybrid circuit embodying a crossover formed on a low expansion substrate of aluminum nitride, mullite or a cordierite-type glass-ceramic. The crossover is a thick film dielectric composed of a glass-ceramic having a primary crystal phase of willemite and a secondary phase of cordierite.

Abstract: Metallizing pastes, for forming thick film circuitry on low expansion substrates in electronic devices, are disclosed. The paste contains a glass powder that crystallizes on firing to a glass-ceramic in which lead titanate is the primary crystal phase.

Abstract: Disclosed is a method for making glass bonded metal oxide electric resistors involving including in the mixture a refractory oxide for providing configuration stability during firing.

Abstract: Disclosed is a method for making glass bonded metal oxide electric resistors involving including in the mixture a refractory oxide for providing configuration stability during firing.

Abstract: A temperature sensor is constructed as a bridge circuit using thick film technology. Both thermistor and resistor thick film inks are applied to a substrate to form a bridge circuit for producing a highly sensitive and accurate indicator when a predetermined temperature has been reached. The resistor thick film circuit is laser scribed at a specific temperature value for greater accuracy.

Abstract: Disclosed is a glass bonded electrical resistor element and composition composed of glass binder, refractory material to provide form stability during firing and electric conductivity imparting materials of noble metal and noble metal oxides. Manganese may also be present. Oxides of Ru and Ir are disclosed as being significant.

Abstract: A resistor end termination consisting of aluminum or aluminum alloy, deposited on a resistor core, for providing secure and reliable electrical and mechanical connection between the resistor element and the cap and lead assembly of an electrical resistor.

Abstract: A hermetically sealed fixed film resistor including a coupling element of soft alloy material between the resistive element and the leads for providing strain relief. The resistive element is composed of a resistive film having coated ends composed of a refractory metallic material for providing reliable electrical and mechanical connection to the coupling element.