Patents by Inventor Geok Ling Adelene Ng

Geok Ling Adelene Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing an optoelectronic device
    Patent number: 11552226
    Abstract: An optoelectronic device and a method for producing an optoelectronic device are disclosed. In an embodiment a method includes arranging an optoelectronic semiconductor chip with its top side towards a surface of a carrier, forming a recess at the surface of the carrier such that the recess surrounds the optoelectronic semiconductor chip, arranging a mold compound in the recess and above the surface of the carrier such that the optoelectronic semiconductor chip is embedded into the mold compound, wherein a bottom side of the optoelectronic semiconductor chip remains at least partially not covered by the mold compound, removing the carrier and arranging a wavelength-converting material above the surface of the carrier before arranging the optoelectronic semiconductor chip, wherein the wavelength-converting material is perforated while forming the recess.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: January 10, 2023
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Chui Wai Chong, Seong Tak Koay, Geok Ling Adelene Ng, Teng Hai Ocean Chuah
  • Method of producing an optoelectronic element
    Patent number: 10964863
    Abstract: A method of producing an optoelectronic element with a light emitting component, includes arranging a sacrificial layer at least above a part of a light emitting side of the component, forming at least in a part of an outer surface of the sacrificial layer an inverted optic structure, covering the outer surface of the sacrificial layer by a light transparent layer, transferring the inverted optic structure to an inner side of the transparent layer, and removing the sacrificial layer and forming a gap between the component and the light transparent layer, wherein the light transparent layer includes at the inner side the optic structure.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: March 30, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Chui Wai Chong, Choo Kean Lim, Seong Tak Koay, Geok Ling Adelene Ng, Teng Hai Ocean Chuah
  • Optoelectronic Device and Method for Producing an Optoelectronic Device
    Publication number: 20210028335
    Abstract: An optoelectronic device and a method for producing an optoelectronic device are disclosed. In an embodiment a method includes arranging an optoelectronic semiconductor chip with its top side towards a surface of a carrier, forming a recess at the surface of the carrier such that the recess surrounds the optoelectronic semiconductor chip, arranging a mold compound in the recess and above the surface of the carrier such that the optoelectronic semiconductor chip is embedded into the mold compound, wherein a bottom side of the optoelectronic semiconductor chip remains at least partially not covered by the mold compound, removing the carrier and arranging a wavelength-converting material above the surface of the carrier before arranging the optoelectronic semiconductor chip, wherein the wavelength-converting material is perforated while forming the recess.
    Type: Application
    Filed: March 23, 2018
    Publication date: January 28, 2021
    Inventors: Chui Wai Chong, Seong Tak Koay, Geok Ling Adelene Ng, Teng Hai Ocean Chuah
  • METHOD OF PRODUCING AN OPTOELECTRONIC ELEMENT
    Publication number: 20200119241
    Abstract: A method of producing an optoelectronic element with a light emitting component, includes arranging a sacrificial layer at least above a part of a light emitting side of the component, forming at least in a part of an outer surface of the sacrificial layer an inverted optic structure, covering the outer surface of the sacrificial layer by a light transparent layer, transferring the inverted optic structure to an inner side of the transparent layer, and removing the sacrificial layer and forming a gap between the component and the light transparent layer, wherein the light transparent layer includes at the inner side the optic structure.
    Type: Application
    Filed: January 16, 2018
    Publication date: April 16, 2020
    Inventors: Chui Wai Chong, Choo Kean Lim, Seong Tak Koay, Geok Ling Adelene Ng, Teng Hai Ocean Chuah