Abstract: A method and apparatus for molding a video display screen bezel to a video display device, such as a CRT, is disclosed. The bezel is molded in such a way as to eliminate the need for fasteners between the bezel and the CRT and between the bezel and a housing or some other structural support. The molded bezel also prevents any undesirable shifting of the CRT with respect to the bezel due to accidental dynamic loads. The molding material conforms to the surface of the CRT compensating for any dimensional variations in the CRT while minimizing the size of the bezel. Molded within the bezel is a compensating means which absorbs stresses generated by the molding material both during and following the molding process which might otherwise be exerted on the CRT.

Abstract: A system for cooling an electronic module in a computer system. In one embodiment of the invention, predetermined areas of the module, such as those exposed parts that carry electrical currents are covered with an conformable, electrically insulating layer. Thereafter, a second conformable, thermally conductive layer is formed on the first layer. In addition, surface expanding elements may be arranged on the first layer near devices particularly sensitive to heat before the application of the second layer.

Abstract: A shock and vibration isolating device is provided for mounting a component on a supporting structure while absorbing with substantially equalized reaction force relative movement between the component and the supporting structure occurring in all of the three mutually orthogonal planes in which the dynamic loading of the component can occur. The device includes an open frame planar spring element lying in a plane parallel to one of the mutually orthogonal planes, the spring element composed of a core member of a low creep, high modulus, metal and a shell member of a plastic exhibiting high internal dynamic loss substantially encompassing said core. A first cantilever section adjacent a first end is mounted to the supporting structure; a second cantilever section parallel to the first cantilever section adjacent a second end is mounted to the component; and a bridge section connects the first and second cantilever sections and is perpendicular thereto.

Abstract: In the manufacture of flat-panel video displays, an assembler must align long rows of closely-spaced electrical signal contacts on a planar electroluminescent panel with mating signal contacts on a flex circuit prior to clamping the panel and flex circuit together. The disclosed technique employs electrically conductive alignment contacts on both surfaces. The alignment contacts are formed via the same process that forms the signal contacts. The alignment contacts are connected to ohmmeters to form circuits that an assembler monitors to determine proper alignment of the surfaces. The use of electrical rather than visual alignment checking makes assembly easy and error-resistant.

Abstract: A cathode ray tube mounting apparatus and method for use in a video display terminal or television receiver. An adhesive is applied to either the inside perimeter of the bezel of the cabinet or to the perimeter of the front surface of the cathode ray tube. The cathode ray tube and bezel are then placed in contact and pressed together. Before the adhesive has set, the position of the cathode ray tube is adjusted to align the cathode ray tube with the horizontal center line of the cabinet. In another embodiment, a sheet of material is attached to the inside of the front portion of the cabinet. The adhesive is applied to either the sheet of material or to the front surface of the cathode ray tube. The cathode ray tube and front portion of the cabinet are then mated as before. The sheet of material is used to compensate for any thermoexpansion mismatch between the cathode ray tube and the cabinet.

Abstract: A simple and compact removable interconnect for coupling clusters of contact pads on substantially planar circuit substrates together with uniform loading on all of the contact pads in the clusters.

Abstract: A system, i.e. method and materials for RFI/EMI shielding an electronic module in a computer or other electronic product is described. In one embodiment of the invention predetermined areas of the module, such as connectors, mounting holes, and electrically insulated portions of the cases of high heat-dissipation electronic devices of the module, are masked. Thereafter, a relatively tichk, substantially continuous, electrically insulating conformal coating, in liquid state, is applied to all exposed surfaces of the module by a suitable technique, such as dipping or spraying. The preferred coating is a polymer-resin coating of a predetermined high viscosity and may be applied unfilled or filled with an electrically-insulating, thermally-conductive solid, such as powdered metal oxide, e.g. aluminum oxide. The applied conformal coating is set or cured, and a substantially continuous electrically conductive coating is applied over the insulating coating by a suitable technique, such as spraying or plating.

Abstract: An enclosure for a video-amplifier printed wiring board (PWB) located in close proximity to, and substantially structurally separated from the cathode ray tube (CRT) connector base in a video display terminal (VDT). The enclosure combines the functions of a structural support for the board on the VDT chassis, of an EMI/RFI shield for the board, and of an expanded heat transfer-surface heatsink. The enclosure comprises a one-piece casting with a cavity formed by a bottom wall, side walls adjacent to the bottom wall, and an open side opposite to the bottom wall. It further has integral mounting features to locate and structurally support the board in the cavity with the high heat-dissipation components facing the inner surface of the cavity's bottom wall. The outer surface of the bottom wall is provided with integral, heat-dissipating fins to form an expanded heat-transfer surface heatsink.

Abstract: A heat exchange element having a heat receiving side and a heat dissipating side and having a serpentine member defining a first plurality of parallel elongate grooves, having elongate openings all in the heat receiving side, and a second plurality of parallel elongate grooves, having elongate openings all in the heat dissipating side, the grooves of the first plurality being interdigitated with the grooves of the second plurality, and closures which close all of the open ends of one of the pluralities of grooves. An enclosure for an electronic assembly having a rack in which electronic assemblies may be mounted in a vertical orientation, the rack being mounted in a cavity defined by side walls, a rear wall, a front wall, a top and a base which together separate the cavity from the environment surrounding the enclosure. At least one of the walls having one of the heat exchange elements sandwiched between an outer panel and an inner panel.

Abstract: A heat exchange element having a heat receiving side and a heat dissipating side and having a serpentine member defining a first plurality of parallel elongate grooves, having elongate openings all in the heat receiving side, and a second plurality of parallel elongate grooves, having elongate openings all in the heat dissipating side, the grooves of the first plurality being interdigitated with the grooves of the second plurality, and closures which close all of the open ends of one of the pluralities of grooves. An enclosure for an electronic assembly having a rack in which electronic assemblies may be mounted in a vertical orientation, the rack being mounted in a cavity defined by side walls, a rear wall, a front wall, a top and a base which together separate the cavity from the environment surrounding the enclosure. At least one of the walls having one of the heat exchange elements sandwiched between an outer panel and an inner panel.