Patents by Inventor George Coad

George Coad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6702302
    Abstract: An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes through a center hole in the cylindrical plate and is dispersed to the atmosphere using multiple pressure relief openings in the cylindrical plate. The purpose of this gas arrangement is to stabilize the wafer due to spinning vortex effects. The cylindrical plate has mounted therein an ertalyte ring which provides an area of angled contact for the wafer. The gas arrangement operates to pass gas to the slight space between the semiconductor wafer and the cylindrical plate, thereby contacting a lower surface of the wafer, and subsequently out of the arrangement using the pressure relief holes.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: March 9, 2004
    Assignee: KLA-Tencor Corporation
    Inventors: Rodney G. Smedt, George Coad
  • Patent number: 6217034
    Abstract: An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes through a center hole in the cylindrical plate and is dispersed to the atmosphere using multiple pressure relief openings in the cylindrical plate. The purpose of this gas arrangement is to stabilize the wafer due to spinning vortex effects. The cylindrical plate has mounted therein an ertalyte ring which provides an area of angled contact for the wafer. The gas arrangement operates to pass gas to the slight space between the semiconductor wafer and the cylindrical plate, thereby contacting a lower surface of the wafer, and subsequently out of the arrangement using the pressure relief holes.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: April 17, 2001
    Assignee: KLA-Tencor Corporation
    Inventors: Rodney G Smedt, George Coad
  • Patent number: 4548699
    Abstract: The system for rotating the transfer plate of a coating system in a vacuum chamber consists of a transfer plate driver assembly on the outside of the chamber at the axis and a transfer plate rotator assembly inside the chamber. The driver assembly consists of a pneumatic actuator for linear motion, a barrel cam which translates the linear motion into rotary motion with high torque at starting and stopping positions, and a rotary feedthrough all in a structural housing. The rotator assembly comprises a central hub with means for supporting the end walls, a transfer plate hub assembly and a ratchet arm connected to the rotary feedthrough. As the pressure plate assembly is drawn back by the ram, it in turn draws back the transfer plate and engages the ratchet arm with the transfer plate hub. The actuator then rotates the transfer plate. The ram then reverses direction, the ratchet arm disengages and is returned to its initial position.
    Type: Grant
    Filed: May 17, 1984
    Date of Patent: October 22, 1985
    Assignee: Varian Associates, Inc.
    Inventors: Martin A. Hutchinson, R. Howard Shaw, George Coad