Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.

Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.

Abstract: An illustrative example electronic device includes a signal generator having at least one conductive output member. A substrate integrated waveguide (SIW) includes a substrate and a plurality of conductive members in the substrate. The substrate includes a slot in one exterior surface of the substrate. The slot is situated adjacent the at least one conductive output member of the signal generator such that a signal of the signal generator is coupled into the SIW through the slot.

Abstract: An illustrative example electronic device includes a signal generator having at least one conductive output member. A substrate integrated waveguide (SIW) includes a substrate and a plurality of conductive members in the substrate. The substrate includes a slot in one exterior surface of the substrate. The slot is situated adjacent the at least one conductive output member of the signal generator such that a signal of the signal generator is coupled into the SIW through the slot.

Abstract: A signal handling device includes a first substrate. A plurality of first conductors in the first substrate are arranged to form a substrate integrated waveguide. A second substrate includes a plurality of second conductors arranged to form a resonating cavity near one end of the substrate integrated waveguide. A signal carrier is aligned with the one end of the substrate integrated waveguide.

Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.

Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.

Abstract: A signal handling device includes a first substrate. A plurality of first conductors in the first substrate are arranged to form a substrate integrated waveguide. A second substrate includes a plurality of second conductors arranged to form a resonating cavity near one end of the substrate integrated waveguide. A signal carrier is aligned with the one end of the substrate integrated waveguide.

Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.

Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide.

Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide.

Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.

Abstract: An antenna for a radar sensor includes an emitter element, a receiver element, and an anti-reflection element. The emitter element is configured to direct the emitted signal along a boresight that intersects a fascia. The receiver element is configured to detect a reflected signal reflected by an object located beyond the fascia. The anti-reflection element is configured to reduce reflection by the antenna of an early-reflection portion reflected by the fascia.

Abstract: An antenna for a radar sensor includes an emitter element, a receiver element, and an anti-reflection element. The emitter element is configured to direct the emitted signal along a boresight that intersects a fascia. The receiver element is configured to detect a reflected signal reflected by an object located beyond the fascia. The anti-reflection element is configured to reduce reflection by the antenna of an early-reflection portion reflected by the fascia.

Abstract: A surface mountable transition block for perpendicular transitions between a microstrip or stripline and a waveguide. The transition block configuration allows for a reduction in the overall cost of a microwave circuit assembly because the circuit board to which the transition block is attached can be an FR-4 type circuit board as opposed to more expensive microwave circuit board materials.

Abstract: A surface mountable transition block for perpendicular transitions between a microstrip or stripline and a waveguide. The transition block configuration allows for a reduction in the overall cost of a microwave circuit assembly because the circuit board to which the transition block is attached can be an FR-4 type circuit board as opposed to more expensive microwave circuit board materials.

Abstract: A microwave circuit assembly including a flip-chip attachable integrated circuit die attached to a substrate by an interconnect device. The integrated circuit die and the substrate have microstrip transmission lines that are electrically coupled through the interconnect device. The interconnect device forms a transmission line configured to electrically couple the microstrip transmission line on the substrate to the microstrip transmission line on the integrated circuit die The interconnect device includes stubs to enhance the ground elements of the interconnect device transmission line and provide a microwave short for the integrated circuit die.

Abstract: A system and method for an electronically scanned antenna is provided in which phase shifters are deposited en masse along with other electronically scanned antenna components on a wafer scale substrate using a thin film process. Alternative wafer scale sizes may be utilized to furnish a required antenna aperture area. Significant processing costs for radar and communication systems are saved utilizing the present invention as compared with contemporary discrete phase shifters that are individually mounted on an antenna. In an aspect, the phase shifter is made up of a base electrode, a barium strontanate titanate (BST) ferroelectric varactor and a top electrode. The BST ferroelectric material is a voltage variable dielectric, which generates a radiation phase. The radiation phase is regulated by a phase shifter control. The radiation phase generates an electromagnetic field about a radiating element and electromagnetic radio waves are radiated from the radiating element.

Abstract: A thermally compensating microwave cavity is provided. An active device that generates microwaves is disposed within this microwave cavity such that microwaves are emitted within the cavity. A first portion of these microwaves travels in one direction from the active device and forms a broad bandwidth signal. A section portion of the microwaves travels toward a reflecting member and is reflected. Once reflected, this second portion combines with and compensates the first portion. A temperature dependent bellows is utilized to displace the active device and the reflecting member relative to one another. Accordingly, as the signal emitted by the active device changes with temperature, the reflecting member is displaced by the bellows to properly reflect the second portion of the microwaves such that it combines with and properly compensates the signal.