Abstract: A Thermal Interface Material (“TIM”) composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.

Abstract: A Thermal Interface Material (“TIM”) composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.

Abstract: In a liquid crystal display device, a method for creating desirable pretilt angle by means of topography of the substrates, such as a surface that is sloped with respect to the surface of the electrodes. In combination with a low pretilt but highly photo-stable alignment layer, which may be very resistant to high levels of ultraviolet radiation, a high pretilt and photo-stable alignment structure is generated, by essentially combining two incompatible technical approaches. The ever more stringent requirements for projection displays are met. The methods for producing such sloped surfaces and the considerations related to design of the sloped surfaces are disclosed.

Abstract: The invention comprises a process for joining a first surface and a second surface where the first surface comprises an initially non-solderable surface which comprises coating the first surface with a solder-adhesion layer to produce a solder-adhesion layer on the first surface and providing a Thermal Interface Material (“TIM”) composition comprising solderable heat-conducting particles in a bondable resin matrix where at least some of the solderable heat-conducting particles comprise a solder surface. The TIM composition is placed between the first surface and the second surface to extend between and be contiguous with both the second surface and the solder-adhesion layer on the first surface. Sufficiently heating the TIM composition results in (a) soldering at least some of the solderable heat-conducting particles to one another; and (b) soldering at least some of the solderable heat-conducting particles to the solder-adhesion layer on the first surface.

Abstract: In a liquid crystal display device, a method for creating desirable pretilt angle by means of topography of the substrates, such as a surface that is sloped with respect to the surface of the electrodes. In combination with a low pretilt but highly photo-stable alignment layer, which may be very resistant to high levels of ultraviolet radiation, a high pretilt and photo-stable alignment structure is generated, by essentially combining two incompatible technical approaches. The ever more stringent requirements for projection displays are met. The methods for producing such sloped surfaces and the considerations related to design of the sloped surfaces are disclosed.

Abstract: The invention comprises a process for joining a first surface and a second surface where the first surface comprises an initially non-solderable surface which comprises coating the first surface with a solder-adhesion layer to produce a solder-adhesion layer on the first surface and providing a Thermal Interface Material (“TIM”) composition comprising solderable heat-conducting particles in a bondable resin matrix where at least some of the solderable heat-conducting particles comprise a solder surface. The TIM composition is placed between the first surface and the second surface to extend between and be contiguous with both the second surface and the solder-adhesion layer on the first surface. Sufficiently heating the TIM composition results in (a) soldering at least some of the solderable heat-conducting particles to one another; and (b) soldering at least some of the solderable heat-conducting particles to the solder-adhesion layer on the first surface.

Abstract: A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which projects away from the electrical contact location and through an aperture in a sheet of material. The sheet is disposed to be spaced apart from the surface of the substrate. At the second end of the elongated electrical conductor there is a tip structure, which is larger than the aperture in the sheet of material. The tip structure has a pointed portion thereof. The tip structure is disposed against contact locations of a contact surface.

Abstract: An OLED device which is capable of utilizing light transmitted from the sides of the OLED as well as the surface of the OLED is provided. The OLED device comprises an OLED having a substrate surface and sides for emission of photons therethrough and at least one adjacent light-folding means, wherein said light-folding means collects and redirects photons emitted from the sides of the OLED into coincident paths of light which are substantially parallel to said photons emitted from said substrate surface.

Abstract: A semiconductor or dielectric wafer with conducting vias is used as a substrate in an integrated circuit packaging structure, where high density inter and intra chip contacts and wiring are positioned on the substrate face on which the integrated circuitry is mounted, and external signal and power circuitry is contacted through the opposite face. Use of a substrate such as silicon permits the use of conventional silicon processes available in the art for providing high wiring density together with matching of the thermal expansion coefficient of any silicon chips in the integrated circuits. The use of vias through the substrate allows a high density of connections leaving the silicon substrate and provides short paths for the connections of power and signals.

Abstract: A stand for a portable personal computer including a base including a front side, a back side, a right side, a left side, and a bottom surface. The stand includes at least one stand member interconnectable with the base. The at least one stand member is positionable in a deployed position and a stowed position. In the deployed position the at least one stand member supports at least one portion of the bottom surface of the base at an elevated level with respect to a surface that the portable personal computer is supported by. The at least one stand member engages a surface of the base in the stowed position.

Abstract: An OLED device which is capable of utilizing light transmitted from the sides of the OLED as well as the surface of the OLED is provided. The OLED device comprises an OLED having a substrate surface and sides for emission of photons therethrough and at least one adjacent light-folding means, wherein said light-folding means collects and redirects photons emitted from the sides of the OLED into coincident paths of light which are substantially parallel to said photons emitted from said substrate surface.

Abstract: A hermetic pump includes a housing having a bore, an inlet, and an outlet for channeling a fluid therethrough. A shaft is disposed coaxially in the bore, and includes a journal and an impeller spaced apart therefrom. The shaft is hermetically rotated to pump the fluid through the bore from the impeller and around the journal for developing a hydrodynamic journal bearing. In one embodiment, the pump may be used in a closed loop cooling circuit.

Abstract: Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is applied over the individual sub pixel element and the pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.

Abstract: A stand for a portable personal computer including a base including a front side, a back side, a right side, a left side, and a bottom surface. The stand includes at least one stand member interconnectable with the base. The at least one stand member is positionable in a deployed position and a stowed position. In the deployed position the at least one stand member supports at least one portion of the bottom surface of the base at an elevated level with respect to a surface that the portable personal computer is supported by. The at least one stand member engages a surface of the base in the stowed position.

Abstract: An arrangement and method for enhancing the cooling capacity of portable personal computers. The power dissipation of portable personal computers, especially such as laptop computers or the like, is enhanced through the utilization of a split swivable keyboard adapted to provide for an increased cooling surface area for electronic components generating heat during use of the computer.

Abstract: An apparatus and method for providing a display cell structure based on the transmissive liquid crystal technology with a useful aperture ratio even as the cell size shrinks to less than 20 microns. The invention overcomes a problem of the prior art wherein the fractional area transmitting the light of the conventional designs becomes unacceptably low due to the aperture reducing opaque storage capacitor. This reduction in aperture ratio is removed in this invention by hiding the trench capacitor below the row and column x,y lines. The cell storage capacitor is formed using a vertical trench capacitor in SOI. Although useful even in standard display sizes and configurations, the invention is particularly useful for head-mounted displays and/or optical projection displays at the UXGA form factor for both monochromatic and color displays. Alternate capacitor configurations are described.

Abstract: A method and structure is presented for a display with reduced size pixels while retaining the transmissive approach. This enables continued use the least expensive transmission optics available. In an embodiment, it employs back-end-of-the-line vertical cells built on top of the row and column x, y lines of the pixels. In a PDLC type display embodiment each vertical cell is filled with PDLC which operates in a normally black mode known as the PDLC reverse mode. When the pixel control voltage is set ON, the liquid crystal is perpendicular to the light path resulting in a light pass through providing a bright state. When the control voltage is set OFF, the liquid crystals are randomly oriented, only the scattered light goes through the cell, so the pixel is in its OFF state. PDLC used here has two advantages. Firstly, the PDLC requires no rubbing. It is difficult to rub individual cell walls. Secondly, the use of both polarizations by the PDLC increases its luminous efficiency.

Abstract: The invention makes the size of the apparent image of the display screen of the display screen larger than the real size. A flat optical magnifier such as a lens of the fresnel type is positioned in an optically enhancing location between the operator and the display screen so that the apparent image at the operator side of the magnifier is greater than the actual image that is present on the display screen. A mechanism is provided for a notebook type portable computer that is passive to a user, folds into the case when the display screen closes over the keyboard and positions a fresnel lens, coplanar with and at a fixed distance from the display screen, when the notebook computer is opened and remains at that fixed distance as the display screen moves to maximum travel.

Abstract: Heat transfer out of a housing for a locallized source of heat such as that produced by a semiconductor chip of electronic apparatus is provided by a low thermal impedance heat transfer member such as a heat pipe, a thermal reservoir or heat transfer buffering member and a Peltier effect device interfaced with the thermal reservoir and the ambient surrounding the housing so as to provide a refrigeration function for the thermal reservoir. A high heat capacity or high latent heat of phase transition material can be used for the thermal reservoir. In a portable computer with a battery power supply, the thermal reservoir can be independent or the battery can be employed in the thermal reservoir functions.

Abstract: An arrangement and method for increasing the cooling capacity of portable personal computers, particularly such as laptop or notebook computers, wherein the computer possesses a keyboard having the rear edge thereof hingedly connected with the bottom of an openable display unit or panel, and wherein at least portions of the computer electronics are housed in outwardly swivable or slidable compartment structure located above the keyboard so as to provide increased surface areas for dissipation of heat.