Abstract: Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.

Abstract: Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.

Abstract: Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.

Abstract: Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.

Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.

Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.

Abstract: Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored in-situ. The characterization tool and the polishing pad can be rotated or moved so that any portion of the polishing pad can be tested.

Abstract: An alignment system for a unit magnification system (such as a Half-Field Dyson system) for use in microlithography is provided. The alignment system provides for aligning a pattern on a reticle with a complementary pattern on a wafer.

Abstract: Disclosed is tilt-sensing means that employs a point source of alternate 1st or 2nd divergent light beams which, after passing through collimating lenses of the Half-Field Dyson projection optics of the stepper, are separately incident on and reflected from a reflective pattern disposed on the surface of a reticle and from a reflective surface of a wafer, together with two-dimensional position detection means responsive to the position of each of the reflected alternate 1st or 2nd divergent light beams, for independently sensing the angular position of the surface of the reticle and the angular position of the surface of the wafer to determine thereby whether or not the surface of the reticle and the surface of the wafer are substantially parallel to one another.

Abstract: A microlithographic stepper, employing a Half-Field Dyson projection optical system, achieves focusing of an image of a first-layer reticle pattern on a completely unpatterned reflective wafer surface by including a repetitive diffraction pattern on the reticle which has a configuration in which a particular ordinal diffraction order is normally missing. In response to being simultaneously illuminated with each of two incident monochromatic beams of light, diffraction orders generated by the repetitive diffraction pattern are imaged on the reflective wafer surface and then reflected back to and reimaged on the repetitive diffraction pattern on the reticle. Diffraction orders generated on the first encounter with the repetitive diffraction pattern generate light in the originally missing ordinal diffraction order on the second encounter.