Patents by Inventor Gerald L. Cheney

Gerald L. Cheney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6309916
    Abstract: In the manufacture of semiconductor packages having molded plastic bodies, the plating of all of the surfaces of the molding tool that comes into contact with the molten resin during molding with a nodular thin dense chromium (“NTDC”) coating prevents the surfaces from adhering to the package body and ensures good package release, without formation of cracks or craters in the package body. This, in turn, permits the amount of both release agents and adhesion promoters used in the molding compound to be substantially reduced, or eliminated altogether, thereby resulting in a package body having improved strength and adhesion with the components of the package, and hence, an improved resistance of the package body to the propagation of cracks and its subsequent penetration by moisture.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: October 30, 2001
    Assignee: Amkor Technology, Inc
    Inventors: Sean T. Crowley, Gerald L. Cheney, David S. Razu