Patents by Inventor Gerald Ofner

Gerald Ofner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7517722
    Abstract: An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: April 14, 2009
    Assignee: Infineon Technologies AG
    Inventors: Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner
  • Patent number: 7452747
    Abstract: A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.
    Type: Grant
    Filed: August 10, 2006
    Date of Patent: November 18, 2008
    Assignee: Infineon Technologies AG
    Inventors: Kai Chong Chan, Charles Wee Ming Lee, Gerald Ofner
  • Publication number: 20080265367
    Abstract: An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
    Type: Application
    Filed: August 24, 2005
    Publication date: October 30, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim
  • Patent number: 7420262
    Abstract: The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: September 2, 2008
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Peter Strobel, Gerald Ofner, Edward Fürgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier
  • Publication number: 20080150159
    Abstract: A semiconductor package includes a substrate and a semiconductor chip which includes an active surface with a plurality of chip contact areas. The chip is electrically connected to the substrate. The substrate includes a sheet of core material, a plurality of upper conducting traces and upper contact pads on its upper surface, a second plurality of lower conductive traces and external contact areas on its bottom surface. A plurality of conducting vias connect the conducting traces and lower conducting traces. The substrate also includes a plurality of vent holes and a layer of solder resist covering the upper and lower surfaces of the substrate leaving the contact areas free from solder resist.
    Type: Application
    Filed: February 11, 2004
    Publication date: June 26, 2008
    Inventors: Irwin Aberin, Gerald Ofner, Alfred Swain Hong Yeo, Wen Hui Zhu
  • Publication number: 20080122053
    Abstract: A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.
    Type: Application
    Filed: February 4, 2008
    Publication date: May 29, 2008
    Inventors: Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim, Khoon Lam Chua
  • Publication number: 20080006900
    Abstract: A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.
    Type: Application
    Filed: April 23, 2007
    Publication date: January 10, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Kai Chong Chan, Charles Wee Ming Lee, Gerald Ofner
  • Patent number: 7286287
    Abstract: A vision aid in the form of telescopic spectacles has two lens systems, which each comprise at least one objective lens (70) and one eyepiece (71). An autofocussing element which changes the focal length of the lens systems for sharp focussing thereof according to the distance of the telescopic spectacle from the object is assigned to the lens systems. Furthermore, an element for changing the magnification factor by changing the focal length of the lens systems (“zoom”) and finally an element for matching the parallax between the lens systems of the vision aid to the focal length which has been set according to the distance of the telescopic spectacles from the object are assigned to the lens systems. The parallax is adapted using adjustable optical elements (11) which are located in the beam path of the lens systems, with which elements the angle (13) between the beam paths (14) running from the lens systems (1) to the object can be changed.
    Type: Grant
    Filed: November 23, 2000
    Date of Patent: October 23, 2007
    Assignee: Life Optics GmbH
    Inventor: Anton Gerald Ofner
  • Patent number: 7276783
    Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: October 2, 2007
    Assignee: Infineon Technologies AG
    Inventors: Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner
  • Publication number: 20070120268
    Abstract: An electronic component includes a substrate having contacts and a chip having contacts and a passivation layer disposed on an active side of the chip. The active side of the chip is mounted on a first surface of the substrate by flip chip technology such that the contacts of the chip are electrically connected to the contacts of the substrate by means of connecting elements. Elastic elevations are disposed between the contacts of the chip and the contacts of the substrate and an underfiller is disposed in an intermediate space between the chip and the substrate and between the elastic elevations. The underfiller and the elastic elevations have substantially the same modulus of elasticity.
    Type: Application
    Filed: January 13, 2006
    Publication date: May 31, 2007
    Inventors: Roland Irsigler, Harry Hedler, Bernd Goller, Gerald Ofner
  • Publication number: 20070075410
    Abstract: A semiconductor device (5) for radio frequency applications has a semiconductor chip (1) with an integrated circuit accommodated in a radio frequency package. Inside bumps (2) comprise inside contacts between the semiconductor chip (1) and a redistribution substrate (3). The inside bumps (2) have a metallic or plastic core (6) and a coating layer (7) of a noble metal.
    Type: Application
    Filed: September 5, 2006
    Publication date: April 5, 2007
    Inventors: Kai Chong Chan, Gerald Ofner
  • Publication number: 20070037319
    Abstract: A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.
    Type: Application
    Filed: August 10, 2006
    Publication date: February 15, 2007
    Inventors: Kai Chan, Charles Lee, Gerald Ofner
  • Publication number: 20060270163
    Abstract: A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.
    Type: Application
    Filed: May 8, 2006
    Publication date: November 30, 2006
    Inventors: Gerald Ofner, Ai Tan, Mary Teo
  • Publication number: 20060258046
    Abstract: An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.
    Type: Application
    Filed: July 24, 2006
    Publication date: November 16, 2006
    Inventors: Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Worner
  • Publication number: 20060183306
    Abstract: An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.
    Type: Application
    Filed: March 23, 2006
    Publication date: August 17, 2006
    Inventors: Robert-Christian Hagen, Gerald Ofner
  • Patent number: 7045881
    Abstract: An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.
    Type: Grant
    Filed: November 19, 2001
    Date of Patent: May 16, 2006
    Assignee: Infineon Technologies AG
    Inventors: Robert-Christian Hagen, Gerald Ofner
  • Publication number: 20060088954
    Abstract: An electronic component and a method for fabricating it is disclosed, where the component comprises a semiconductor chips which has flip-chip contacts. These contacts are fixed on a rewiring substrate, the interspace between the rewiring substrate and the semiconductor chip being filled with a thermoplastic. The glass transition temperature of the thermoplastic is above the highest operating test temperature of the component and below the melting temperature of the solder material for external contacts.
    Type: Application
    Filed: October 20, 2003
    Publication date: April 27, 2006
    Inventors: Michael Bauer, Christian Birzer, Gerald Ofner, Stephan Stoeckl
  • Publication number: 20060027905
    Abstract: A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.
    Type: Application
    Filed: August 4, 2005
    Publication date: February 9, 2006
    Inventors: Michael Bauer, Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Holger Woerner
  • Patent number: 6953992
    Abstract: The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: October 11, 2005
    Assignee: Infineon Technologies AG
    Inventors: Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stümpfl, Josef Thumbs, Stefan Wein, Holger Wörner
  • Patent number: 6940156
    Abstract: An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: September 6, 2005
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Christian Birzer, Gerald Ofner, Stephan Stoeckl