Patents by Inventor Gerard McVicker

Gerard McVicker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150000097
    Abstract: A method of mounting a heat sink includes providing a heat sink having a plurality of mounting points, and attaching a plurality of mounting members to the heat sink at the plurality of mounting points, respectively, at least one of a combination of a mounting point of the mounting points and a mounting member of the mounting members being configured so as to have a stiffness in a thermally-induced expansion direction of the heat sink at the respective mounting point which is less than a stiffness in an other direction at the respective mounting point.
    Type: Application
    Filed: October 3, 2013
    Publication date: January 1, 2015
    Applicant: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Gerard McVicker, Vijayeshwar D. Khanna
  • Publication number: 20150000868
    Abstract: A structure and method of mounting a heat sink having a body and mounting points configured so as to connect to a mounting medium, at least one of the mounting points being configured to allow movement in a thermally-induced expansion direction.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Applicant: International Business Machines Corporation
    Inventors: Sri M Sri-Jayantha, Gerard McVicker, JR., Vijayeshwar D Khanna, JR.
  • Publication number: 20140242524
    Abstract: A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities.
    Type: Application
    Filed: August 13, 2012
    Publication date: August 28, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gareth G. Hougham, Gerard McVicker, Anna Pratt
  • Patent number: 8651877
    Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in minor image relationship to each other.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: February 18, 2014
    Assignee: International Business Machines Corporation
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu
  • Patent number: 8624152
    Abstract: Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: January 7, 2014
    Assignee: International Business Machines Corporation
    Inventors: Gareth G. Hougham, Vijayeshwar D. Khanna, Xiao Hu Liu, Gerard McVicker
  • Publication number: 20130072073
    Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in minor image relationship to each other.
    Type: Application
    Filed: August 17, 2012
    Publication date: March 21, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu
  • Publication number: 20120325541
    Abstract: A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.
    Type: Application
    Filed: September 5, 2012
    Publication date: December 27, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao H. Liu
  • Patent number: 8322980
    Abstract: A cooling system includes a moving rotor system which in turn includes: a rotating disk on which a plurality of heat conducting structures are distributed, the heat conducting structures including an inner arrangement of spiral blades; an air flow generating fan element; and an outer arrangement of heat transfer pins distributed along a perimeter of the rotating disk, the heat transfer pins having a high aspect ratio that maximizes a surface area to footprint area; wherein the spiral blades generate a mass fluid flow of ambient fluid toward the heat transfer pins such that the heat transfer pins are persistently cooled.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: December 4, 2012
    Assignee: International Business Machines Corporation
    Inventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 8263879
    Abstract: A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: September 11, 2012
    Assignee: International Business Machines Corporation
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao H. Liu
  • Publication number: 20120121906
    Abstract: Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
    Type: Application
    Filed: January 24, 2012
    Publication date: May 17, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gareth G. Hougham, Vijayeshwar D. Khanna, Xiao Hu Liu, Gerard McVicker
  • Patent number: 8138448
    Abstract: Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: March 20, 2012
    Assignee: International Business Machines Corporation
    Inventors: Gareth G. Hougham, Vijayeshwar D. Khanna, Xiao Hu Liu, Gerard McVicker
  • Publication number: 20110123318
    Abstract: A cooling system includes a moving rotor system which in turn includes: a rotating disk on which a plurality of heat conducting structures are distributed, the heat conducting structures including an inner arrangement of spiral blades; an air flow generating fan element; and an outer arrangement of heat transfer pins distributed along a perimeter of the rotating disk, the heat transfer pins having a high aspect ratio that maximizes a surface area to footprint area; wherein the spiral blades generate a mass fluid flow of ambient fluid toward the heat transfer pins such that the heat transfer pins are persistently cooled.
    Type: Application
    Filed: January 28, 2011
    Publication date: May 26, 2011
    Applicant: International Business Machines Corporation
    Inventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
  • Publication number: 20110108316
    Abstract: A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.
    Type: Application
    Filed: November 6, 2009
    Publication date: May 12, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao H. Liu
  • Publication number: 20110111647
    Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.
    Type: Application
    Filed: November 6, 2009
    Publication date: May 12, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu
  • Patent number: 7896611
    Abstract: A cooling system includes a moving rotor system which in turn includes: a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area; the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled.
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: March 1, 2011
    Assignee: International Business Machines Corporation
    Inventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 7836353
    Abstract: A system for reducing an impact of hot spot pulsing of a semiconductor device including: first generating means for generating a plurality of local op-codes; a sequencer for augmenting customer op-codes with the plurality of local op-codes; selecting means for selecting one or more of the randomly arriving customer op-codes awaiting execution; monitoring means for tracking which of the one or more randomly arriving customer op-codes have been selected; separating means for separating the plurality of local op-codes from the one or more customer op-codes; storing means for storing one or more data related to the processing of the plurality of local op-codes and the customer op-codes; and second generating means for generating an output for a customer corresponding to that customer op-code while gainfully employing an output generated by local op-codes for system health monitoring purpose.
    Type: Grant
    Filed: May 7, 2007
    Date of Patent: November 16, 2010
    Assignee: International Business Machines Corporation
    Inventors: John U. Knickerbocker, Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 7781883
    Abstract: An electronic package includes a die including a thermal interface material through which a primary heat flux path is enabled for conducting heat from the die, an organic substrate, and a thermal interposer provided between the organic substrate and the die, the thermal interposer having an area extending beyond a footprint of the die, the area including the thermal interface material, the thermal interposer conducting heat generated by the die through the thermal interface material such that an auxiliary heat flux path for conducting heat generated in the die is enabled.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: August 24, 2010
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Gerard McVicker, John U. Knickerbocker
  • Publication number: 20100044856
    Abstract: An electronic package includes a die including a thermal interface material through which a primary heat flux path is enabled for conducting heat from the die, an organic substrate, and a thermal interposer provided between the organic substrate and the die, the thermal interposer having an area extending beyond a footprint of the die, the area including the thermal interface material, the thermal interposer conducting heat generated by the die through the thermal interface material such that an auxiliary heat flux path for conducting heat generated in the die is enabled.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 25, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sri M. SRI-JAYANTHA, Gerard McVicker, John U. Knickerbocker
  • Patent number: 7667969
    Abstract: Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: February 23, 2010
    Assignee: International Business Machines Corporation
    Inventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 7612446
    Abstract: A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: November 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Hien P. Dang, Vinod Kamath, Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha, Jung H. Yoon