Patents by Inventor Gerard Salvaterra

Gerard Salvaterra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and devices for stressing an integrated circuit
    Patent number: 9618567
    Abstract: Disclosed is in particular a device (2) for stressing an integrated circuit (1) including an electronic chip (10) mounted in a housing (12), the device including a source (20) of thermal stress. The device (2) also includes a thermally conductive coupling member (22), designed to be thermally coupled to the source (20) of thermal stress during the stressing operation. The coupling member (22) includes an end (220) whose geometry is suitable for being introduced into an aperture with a predefined geometry, to be made in the housing (12) of the integrated circuit (1) so as to thermally couple a coupling face (222) of this end (220) with a face (102) of the electronic chip (10).
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: April 11, 2017
    Assignee: EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE
    Inventors: Florian Moliere, Sebastien Morand, Alexandre Douin, Gerard Salvaterra, Christian Binois, Daniel Peyre
  • METHODS AND DEVICES FOR STRESSING AN INTEGRATED CIRCUIT
    Publication number: 20130193995
    Abstract: Disclosed is in particular a device (2) for stressing an integrated circuit (1) including an electronic chip (10) mounted in a housing (12), the device including a source (20) of thermal stress. The device (2) also includes a thermally conductive coupling member (22), designed to be thermally coupled to the source (20) of thermal stress during the stressing operation. The coupling member (22) includes an end (220) whose geometry is suitable for being introduced into an aperture with a predefined geometry, to be made in the housing (12) of the integrated circuit (1) so as to thermally couple a coupling face (222) of this end (220) with a face (102) of the electronic chip (10).
    Type: Application
    Filed: April 19, 2011
    Publication date: August 1, 2013
    Inventors: Florian Moliere, Sebastien Morand, Alexandre Douin, Gerard Salvaterra, Christian Binois, Daniel Peyre