Patents by Inventor Gerhard Deml

Gerhard Deml has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a semiconductor device having a resin with warpage compensated structures
    Patent number: 8377753
    Abstract: A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: February 19, 2013
    Assignee: Infineon Technologies AG
    Inventors: Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
  • Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures
    Publication number: 20120058606
    Abstract: A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
    Type: Application
    Filed: November 10, 2011
    Publication date: March 8, 2012
    Applicant: Infineon Technologies AG
    Inventors: Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
  • Semiconductor device including isolation layer
    Patent number: 8110906
    Abstract: A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: February 7, 2012
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Wae Chet Yong, Stanley Job Doraisamy, Gerhard Deml, Rupert Fischer, Reimund Engl
  • Semiconductor devices having a resin with warpage compensated surfaces
    Patent number: 8067841
    Abstract: A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: November 29, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
  • Semiconductor module for a switched-mode power supply and method for its assembly
    Patent number: 7923827
    Abstract: Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: April 12, 2011
    Assignee: Infineon Technologies AG
    Inventors: Yang Hong Heng, Kean Cheong Lee, Xaver Schloegel, Gerhard Deml, Ralf Otremba, Juergen Schredl
  • Semiconductor Device
    Publication number: 20090212446
    Abstract: A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
    Type: Application
    Filed: February 25, 2008
    Publication date: August 27, 2009
    Inventors: Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
  • Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly
    Publication number: 20090001535
    Abstract: Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip.
    Type: Application
    Filed: July 28, 2005
    Publication date: January 1, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Yang Hong Heng, Kean Cheong Lee, Xaver Schloegel, Gerhard Deml, Ralf Otremba, Juergen Schredl
  • SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER
    Publication number: 20080173992
    Abstract: A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.
    Type: Application
    Filed: July 16, 2007
    Publication date: July 24, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Wae Chet Yong, Stanley Job Doraisamy, Gerhard Deml, Rupert Fischer, Reimund Engl