Abstract: An alignment method includes directing an illumination beam with a first polarization state to form a diffracted beam with a second polarization state from an alignment target, and passing the diffracted beam through a polarization analyzer. The alignment method further includes measuring a polarization state of the diffracted beam and determining a location of the alignment target from the measured polarization state relative to its initial polarization state. The alignment target includes a plurality of diffraction gratings with a single pitch and two or more duty cycles, wherein the pitch is smaller than a wavelength of the illumination beam, and the location of the alignment target corresponds to the duty cycle of the diffraction grating.

Abstract: An alignment method includes directing an illumination beam with a first polarization state to form a diffracted beam with a second polarization state from an alignment target, and passing the diffracted beam through a polarization analyzer. The alignment method further includes measuring a polarization state of the diffracted beam and determining a location of the alignment target from the measured polarization state relative to its initial polarization state. The alignment target includes a plurality of diffraction gratings with a single pitch and two or more duty cycles, wherein the pitch is smaller than a wavelength of the illumination beam, and the location of the alignment target corresponds to the duty cycle of the diffraction grating.

Abstract: An alignment mark for determining a two-dimensional alignment position of a substrate is discussed. The alignment mark includes an array of patterns. The array of patterns includes a first set of patterns and a second set of patterns arranged. The first set of patterns is arranged in a first sequence along a first direction. The second set of patterns is arranged in a second sequence along the first direction. The second sequence is different from the first sequence. Each pattern of the array of patterns is different from other patterns of the array of patterns that are adjacent to the each pattern.

Abstract: A method and apparatus to measure a target (e.g., an alignment mark (e.g., on a substrate)) is disclosed. Relative movement between the target and a measurement spot of a measurement system in a “fly-in” direction (e.g., movement of the target towards the measurement spot) is performed so that a first measurement for the target can be made. Thereafter, relative movement between the target and the measurement spot is made in an opposite “fly-in” direction so that a second measurement for the target can be made. By combining (e.g., averaging) these two measurements, an error is cancelled out, and higher accuracy in the measurement may be achieved.

Abstract: An alignment mark for determining a two-dimensional alignment position of a substrate is discussed. The alignment mark includes an array of patterns. The array of patterns includes a first set of patterns and a second set of patterns arranged. The first set of patterns is arranged in a first sequence along a first direction. The second set of patterns is arranged in a second sequence along the first direction. The second sequence is different from the first sequence. Each pattern of the array of patterns is different from other patterns of the array of patterns that are adjacent to the each pattern.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: A method and apparatus to measure a target (e.g., an alignment mark (e.g., on a substrate)) is disclosed. Relative movement between the target and a measurement spot of a measurement system in a “fly-in” direction (e.g., movement of the target towards the measurement spot) is performed so that a first measurement for the target can be made. Thereafter, relative movement between the target and the measurement spot is made in an opposite “fly-in” direction so that a second measurement for the target can be made. By combining (e.g., averaging) these two measurements, an error is cancelled out, and higher accuracy in the measurement may be achieved.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: An apparatus to measure the position of a mark, the apparatus including an illumination arrangement to direct radiation across a pupil of the apparatus, the illumination arrangement including an illumination source to provide multiple-wavelength radiation of substantially equal polarization and a wave plate to alter the polarization of the radiation in dependency of the wavelength, such that radiation of different polarization is supplied; an objective to direct radiation on the mark using the radiation supplied by the illumination arrangement while scanning the radiation across the mark in a scanning direction; a radiation processing element to process radiation that is diffracted by the mark and received by the objective; and a detection arrangement to detect variation in an intensity of radiation output by the radiation processing element during the scanning and to calculate from the detected variation a position of the mark in at least a first direction of measurement.

Abstract: An apparatus to measure the position of a mark, the apparatus including an objective lens to direct radiation on a mark using radiation supplied by an illumination arrangement; an optical arrangement to receive radiation diffracted and specularly reflected by the mark, wherein the optical arrangement is configured to provide a first image and a second image, the first image being formed by coherently adding specularly reflected radiation and positive diffraction order radiation and the second image being formed by coherently adding specularly reflected radiation and negative diffraction order radiation; and a detection arrangement to detect variation in an intensity of radiation of the first and second images and to calculate a position of the mark in a direction of measurement therefrom.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: An apparatus to measure the position of a mark, the apparatus including an illumination arrangement to direct radiation across a pupil of the apparatus, the illumination arrangement including an illumination source to provide multiple-wavelength radiation of substantially equal polarization and a wave plate to alter the polarization of the radiation in dependency of the wavelength, such that radiation of different polarization is supplied; an objective to direct radiation on the mark using the radiation supplied by the illumination arrangement while scanning the radiation across the mark in a scanning direction; a radiation processing element to process radiation that is diffracted by the mark and received by the objective; and a detection arrangement to detect variation in an intensity of radiation output by the radiation processing element during the scanning and to calculate from the detected variation a position of the mark in at least a first direction of measurement.

Abstract: An apparatus to measure the position of a mark, the apparatus including an objective lens to direct radiation on a mark using radiation supplied by an illumination arrangement; an optical arrangement to receive radiation diffracted and specularly reflected by the mark, wherein the optical arrangement is configured to provide a first image and a second image, the first image being formed by coherently adding specularly reflected radiation and positive diffraction order radiation and the second image being formed by coherently adding specularly reflected radiation and negative diffraction order radiation; and a detection arrangement to detect variation in an intensity of radiation of the first and second images and to calculate a position of the mark in a direction of measurement therefrom.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: A method of exposing a substrate (e.g. in a lithographic apparatus comprising a substrate table to support a substrate) according to one embodiment of the invention includes performing first and a second height measurement of a part of at least one substrate with a first and second sensor, generating and storing an offset error map based on a difference between the measurements; generating and storing a height map of portions of the substrate (or another substrate that has had a similar processing as the part) by performing height measurements with the first sensor and correcting this height map by means of the offset error map; and exposing the substrate (or the other substrate).