Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.

Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.

Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to 15 parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.

Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.

Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.

Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.