Patents by Inventor Gi-Jung Kim

Gi-Jung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10872879
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: December 22, 2020
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Patent number: 10866776
    Abstract: A pull printing method and system using a cloud server when a user terminal may not use an internal wireless network are provided. A pull printing system may include a user terminal, a cloud server, and at least one print server to manage at least one image forming apparatus. In an example, the cloud server receives a registration request to register device information of the at least one image forming apparatus from the at least one print server, receives a login request comprising user information and device information of an image forming apparatus, from the user terminal, transmits the login request to a print server corresponding to the device information of the image forming apparatus, receives a job list as an authentication result according to the request, from the print server corresponding to the device information of the image forming apparatus, and transmits the job list to the user terminal.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: December 15, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gi Won Seo, In Cheon Park, Wu Seok Jang, Byeong Jin Lee, Yeon Jung Lim, Jeong Ho Kim
  • Publication number: 20200251422
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.
    Type: Application
    Filed: April 24, 2020
    Publication date: August 6, 2020
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Publication number: 20200142656
    Abstract: A pull printing method and system using a cloud server when a user terminal may not use an internal wireless network are provided. A pull printing system may include a user terminal, a cloud server, and at least one print server to manage at least one image forming apparatus. In an example, the cloud server receives a registration request to register device information of the at least one image forming apparatus from the at least one print server, receives a login request comprising user information and device information of an image forming apparatus, from the user terminal, transmits the login request to a print server corresponding to the device information of the image forming apparatus, receives a job list as an authentication result according to the request, from the print server corresponding to the device information of the image forming apparatus, and transmits the job list to the user terminal.
    Type: Application
    Filed: June 20, 2018
    Publication date: May 7, 2020
    Inventors: Gi Won SEO, In Cheon PARK, Wu Seok JANG, Byeong Jin LEE, Yeon Jung LIM, Jeong Ho KIM
  • Publication number: 20200071698
    Abstract: The present invention relates to a novel anti-miRNA single-stranded nucleic acid maleimide derivative, which comprises an anti-miRNA single-stranded nucleic acid having a nucleic acid sequence complementary to a nucleic acid sequence of an miRNA. Further, the present invention provides an anti-miRNA single-stranded nucleic acid-serum albumin conjugate in which serum albumin is covalently bonded to the anti-miRNA single-stranded nucleic acid maleimide derivative via the maleimide group.
    Type: Application
    Filed: May 29, 2019
    Publication date: March 5, 2020
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sun Hwa KIM, Ick Chan KWON, Kwangmeyung KIM, Hong Yeol YOON, Gi-Jung KWAK, Juho PARK
  • Publication number: 20190270836
    Abstract: Provided is a method of preparing a polymer polyol, including steps of: (a) polymerizing a polyol and a monomer in presence of a diluent to prepare a primary particle dispersed liquid; and (b) feeding an additional polyol and monomer into the primary particle dispersed liquid and polymerizing to prepare a secondary particle dispersed liquid.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 5, 2019
    Inventors: Gi Jung KIM, Seul Gi KIM, Seung Moo HUH, Jin Woo PARK
  • Publication number: 20190270853
    Abstract: Provided is a method of preparing a polymer polyol including steps of (a) respectively batchwise feeding a polyol and a monomer in a weight ratio of 40 to 60:40 to 60 into a reactor to prepare a mixture; and (b) polymerizing the mixture for 1 to 5 hours to prepare monodispersed particles.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 5, 2019
    Inventors: Gi Jung KIM, Seul Gi KIM, Seung Moo HUH
  • Publication number: 20180374798
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.
    Type: Application
    Filed: June 24, 2017
    Publication date: December 27, 2018
    Applicant: Amkor Technology, Inc.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Patent number: 10163867
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: December 25, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Publication number: 20180323170
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Application
    Filed: July 17, 2018
    Publication date: November 8, 2018
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Publication number: 20180138155
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package.
    Type: Application
    Filed: January 15, 2018
    Publication date: May 17, 2018
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Patent number: 9219656
    Abstract: Provided are approaches for remote managing comprising at least one or more agents being resident in at least one or more management terminals connected to each other through a network and controlling the corresponding management terminals; and a management server transmitting to the agents a request for a service for managing the management terminals, where the management server transmits the request to the agent through a control channel. An independent control channel is formed between a management server and a management device separately from an ordinary communication channel and, in case the management device is required to perform a server role for a particular service, makes the corresponding management device require a request related to the service through a control channel and thus, the server role is assigned to the management server at the time of carrying out a service.
    Type: Grant
    Filed: March 25, 2013
    Date of Patent: December 22, 2015
    Assignee: LG CNS CO., LTD.
    Inventors: Gi Jung Kim, Jae Young Park, Ji Seong Song
  • Patent number: 9035309
    Abstract: A three-dimensional (3D) CMOS image sensor (CIS) that sufficiently absorbs incident infrared-rays (IRs) and includes an infrared-ray (IR) receiving unit formed in a thin epitaxial film, thereby being easily manufactured using a conventional CIS process, a sensor system including the 3D CIS, and a method of manufacturing the 3D CIS, the 3D CIS including an IR receiving part absorbing IRs incident thereto by repetitive reflection to produce electron-hole pairs (EHPs); and an electrode part formed on the IR receiving part and collecting electrons produced by applying a predetermined voltage thereto.
    Type: Grant
    Filed: January 5, 2011
    Date of Patent: May 19, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-soo Park, Won-joo Kim, Kyoo-chul Cho, Gi-jung Kim, Sam-jong Choi
  • Publication number: 20140067906
    Abstract: Provided are approaches for remote managing comprising at least one or more agents being resident in at least one or more management terminals connected to each other through a network and controlling the corresponding management terminals; and a management server transmitting to the agents a request for a service for managing the management terminals, where the management server transmits the request to the agent through a control channel. An independent control channel is formed between a management server and a management device separately from an ordinary communication channel and, in case the management device is required to perform a server role for a particular service, makes the corresponding management device require a request related to the service through a control channel and thus, the server role is assigned to the management server at the time of carrying out a service.
    Type: Application
    Filed: March 25, 2013
    Publication date: March 6, 2014
    Inventors: Gi Jung Kim, Jae Young Park, Ji Seong Song
  • Publication number: 20130262557
    Abstract: Disclosed herein is a city facility managing server and system. The city facility managing server is connected to a plurality of agents, each of which manages at least one city facility according to event processing scripts. The city facility managing server includes a schedule database, a schedule register, and a scheduler. The schedule database stores schedules, each including a specific event processing script for controlling at least one specific city facility. The schedule register registers the schedules in the schedule database. The scheduler continuously reads the stored schedules, registers the schedules in an event queue, reads a schedule corresponding to a current time from the schedule event queue, and sends the read schedule to at least one corresponding agent, thereby allowing the at least one corresponding agent to control a corresponding city facility according to a corresponding event processing script.
    Type: Application
    Filed: September 28, 2012
    Publication date: October 3, 2013
    Applicant: LG CNS CO., LTD
    Inventors: Gi Jung KIM, Ji Seong SONG, Jae Young PARK
  • Publication number: 20130029143
    Abstract: The present invention relates to a multilayer sheet for insert molding, in which a first thermosetting transparent resin layer protects the surface of the sheet, and a second thermoplastic transparent resin layer maintains moldability. The multilayer sheet may reduce gloss variation on the surface layer caused by change in surface microstructure of a base sheet in the multilayer sheet, which can occur during molding, and exhibits excellent scratch and abrasion resistance.
    Type: Application
    Filed: April 8, 2011
    Publication date: January 31, 2013
    Applicant: LG HAUSYS, LTD.
    Inventors: Hyung-Gon Kim, Dong-Gon Kim, Min-Ho Lee, Gi-Jung Kim
  • Patent number: 8293613
    Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first insulating layer formed over the semiconductor substrate, and a first semiconductor layer formed over the first insulation layer. At least one gettering region is formed in at least one of the first insulating layer and the first semiconductor layer. The gettering region includes a plurality of gettering sites, and at least one gettering site includes one of a precipitate, a dispersoid, an interface with the dispersoid, a stacking fault and a dislocation.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: October 23, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Soo Park, Young-Nam Kim, Young-Sam Lim, Gi-Jung Kim, Pil-Kyu Kang
  • Patent number: 8143142
    Abstract: A method of fabricating an epi-wafer includes providing a wafer including boron by cutting a single crystal silicon ingot, growing an insulating layer on one surface of the wafer, performing thermal treatment of the wafer, removing the insulating layer formed on one surface of the wafer, mirror-surface-grinding one surface of the wafer, and growing an epitaxial layer on one surface of the wafer and forming a high-density boron layer within the wafer that corresponds to the interface between the wafer and the epitaxial layer.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: March 27, 2012
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Young-Soo Park, Gi-Jung Kim, Won-Je Park, Jae-Sik Bae
  • Publication number: 20110193940
    Abstract: A three-dimensional (3D) CMOS image sensor (CIS) that sufficiently absorbs incident infrared-rays (IRs) and includes an infrared-ray (IR) receiving unit formed in a thin epitaxial film, thereby being easily manufactured using a conventional CIS process, a sensor system including the 3D CIS, and a method of manufacturing the 3D CIS, the 3D CIS including an IR receiving part absorbing IRs incident thereto by repetitive reflection to produce electron-hole pairs (EHPs); and an electrode part formed on the IR receiving part and collecting electrons produced by applying a predetermined voltage thereto.
    Type: Application
    Filed: January 5, 2011
    Publication date: August 11, 2011
    Inventors: Young-soo Park, Won-joo Kim, Kyoo-chul Cho, Gi-jung Kim, Sam-jong Choi
  • Publication number: 20110076838
    Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first insulating layer formed over the semiconductor substrate, and a first semiconductor layer formed over the first insulation layer. At least one gettering region is formed in at least one of the first insulating layer and the first semiconductor layer. The gettering region includes a plurality of gettering sites, and at least one gettering site includes one of a precipitate, a dispersoid, an interface with the dispersoid, a stacking fault and a dislocation.
    Type: Application
    Filed: November 29, 2010
    Publication date: March 31, 2011
    Inventors: Young-Soo Park, Young-Nam Kim, Young-Sam Lim, Gi-Jung Kim, Pil-Kyu Kang