Patents by Inventor Giles Humpston

Giles Humpston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10249673
    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: April 2, 2019
    Assignee: Invensas Corporation
    Inventors: Giles Humpston, Moshe Kriman
  • Patent number: 10147750
    Abstract: The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: December 4, 2018
    Assignee: FLIR Systems Trading Belgium BVBA
    Inventors: Moshe Kriman, William Hudson Welch, Giles Humpston, Osher Avsian, Felix Hazanovich, Ekaterina Axelrod
  • Publication number: 20170117318
    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
    Type: Application
    Filed: October 31, 2016
    Publication date: April 27, 2017
    Applicants: Tessera North America, Inc., DigitalOptics Corporation East
    Inventors: Giles Humpston, Moshe Kriman
  • Patent number: 9548145
    Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: January 17, 2017
    Assignee: Invensas Corporation
    Inventors: Michael J. Nystrom, Giles Humpston
  • Patent number: 9484379
    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: November 1, 2016
    Assignee: Invensas Corporation
    Inventors: Giles Humpston, Moshe Kriman
  • Patent number: 9029759
    Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: May 12, 2015
    Assignee: Nan Chang O-Film Optoelectronics Technology Ltd
    Inventors: Harpuneet Singh, Giles Humpston, Ellis Chau, Eddie Azuma, Peter Pietrangelo, Ocie Ward
  • Publication number: 20150091120
    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
    Type: Application
    Filed: December 2, 2014
    Publication date: April 2, 2015
    Applicant: Invensas Corporation
    Inventors: Giles Humpston, Moshe Kriman
  • Patent number: 8900910
    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: December 2, 2014
    Assignee: Invensas Corporation
    Inventors: Giles Humpston, Moshe Kriman
  • Patent number: 8883562
    Abstract: A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements each having a front surface, contacts exposed at the front surface, a rear surface and edges extending between the front and rear surfaces. Traces connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face of the microelectronic unit. A plurality of conductors may extend along edges of the microelectronic elements from the traces to the top face. The conductors may be conductively connected with unit contacts such that the unit contacts overlie the rear surface of the at least one microelectronic element adjacent to the top face.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: November 11, 2014
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Giles Humpston, David Ovrutsky, Laura Wills Mirkarimi
  • Publication number: 20140224419
    Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.
    Type: Application
    Filed: December 4, 2013
    Publication date: August 14, 2014
    Applicant: INVENSAS CORPORATION
    Inventors: Michael J. Nystrom, Giles Humpston
  • Patent number: 8735287
    Abstract: A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: May 27, 2014
    Assignee: Invensas Corp.
    Inventors: Belgacem Haba, Giles Humpston, Moti Margalit
  • Publication number: 20140120650
    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
    Type: Application
    Filed: January 6, 2014
    Publication date: May 1, 2014
    Applicant: INVENSAS CORPORATION
    Inventors: Giles Humpston, Moshe Kriman
  • Publication number: 20140027931
    Abstract: A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.
    Type: Application
    Filed: September 25, 2013
    Publication date: January 30, 2014
    Applicant: TESSERA, INC.
    Inventors: Osher Avsian, Andrey Grinman, Giles Humpston, Moti Margalit
  • Patent number: 8624342
    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: January 7, 2014
    Assignee: Invensas Corporation
    Inventors: Giles Humpston, Moshe Kriman
  • Publication number: 20130344652
    Abstract: A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements each having a front surface, contacts exposed at the front surface, a rear surface and edges extending between the front and rear surfaces. Traces connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face of the microelectronic unit. A plurality of conductors may extend along edges of the microelectronic elements from the traces to the top face. The conductors may be conductively connected with unit contacts such that the unit contacts overlie the rear surface of the at least one microelectronic element adjacent to the top face.
    Type: Application
    Filed: June 6, 2013
    Publication date: December 26, 2013
    Applicant: Tessera, Inc.
    Inventors: Belgacem Haba, Giles Humpston, David Ovrutsky, Laura Wills Mirkarimi
  • Patent number: 8604605
    Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: December 10, 2013
    Assignee: Invensas Corp.
    Inventors: Michael J. Nystrom, Giles Humpston
  • Publication number: 20130314587
    Abstract: An actuator that operates by electrostatic attraction and repulsion and can have fixed and moving electrodes is disclosed for one or more embodiments. The fixed and moving electrodes can be inclined relative to each other at an acute angle. The actuator can be radially symmetric and mirrored about the moving electrode. The moving electrode can have a central aperture over which is placed an optical element such as a lens. The optical element can be part of an optical train that permits the focus of an electronic camera to be modified by changing the displacement of the lens along the optical axis of the camera.
    Type: Application
    Filed: February 6, 2012
    Publication date: November 28, 2013
    Applicant: DIGITALOPTICS CORPORATION MEMS
    Inventors: Moshe Kriman, Ephraim Goldenberg, Uri Kinrot, Gal Shabtay, Jamil Nasser, Dalit Bahar, Giles Humpston
  • Publication number: 20130270419
    Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
    Type: Application
    Filed: April 12, 2012
    Publication date: October 17, 2013
    Applicant: DIGITALOPTICS CORPORATION
    Inventors: Harpuneet Singh, Giles Humpston, Ellis Chau, Eddie Azuma, Peter Pietrangelo, Ocie Ward
  • Patent number: 8551815
    Abstract: A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: October 8, 2013
    Assignee: Tessera, Inc.
    Inventors: Osher Avsian, Andrey Grinman, Giles Humpston, Moti Margalit
  • Patent number: 8545599
    Abstract: A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: October 1, 2013
    Assignee: Tessera, Inc.
    Inventor: Giles Humpston