Abstract: Techniques and mechanisms for providing interconnected circuitry of an integrated circuit (IC) die stack. In an embodiment, first integrated circuitry of a first IC die is configured to couple, via a first interconnects of the first IC die, to second integrated circuitry of a second IC die. When the first IC die and the second IC die are coupled to one another, second interconnects of the first IC die are further coupled to the second integrated circuitry, wherein the second interconnects are coupled to each of two opposite sides of the first IC die. In another embodiment, the second integrated circuitry includes processor logic, and the first integrated circuitry is configured to cache data for access by the processor logic. In another embodiment, the first integrated circuitry includes a power delivery circuit and an on-package input-output interface to cache data for access by the processor logic at higher bandwidth with lower power consumption.

Abstract: Techniques and mechanisms for providing interconnected circuitry of an integrated circuit (IC) die stack. In an embodiment, first integrated circuitry of a first IC die is configured to couple, via a first interconnects of the first IC die, to second integrated circuitry of a second IC die. When the first IC die and the second IC die are coupled to one another, second interconnects of the first IC die are further coupled to the second integrated circuitry, wherein the second interconnects are coupled to each of two opposite sides of the first IC die. In another embodiment, the second integrated circuitry includes processor logic, and the first integrated circuitry is configured to cache data for access by the processor logic. In another embodiment, the first integrated circuitry includes a power delivery circuit and an on-package input-output interface to cache data for access by the processor logic at higher bandwidth with lower power consumption.

Abstract: Techniques and mechanisms for providing interconnected circuitry of an integrated circuit (IC) die stack. In an embodiment, first integrated circuitry of a first IC die is configured to couple, via a first interconnects of the first IC die, to second integrated circuitry of a second IC die. When the first IC die and the second IC die are coupled to one another, second interconnects of the first IC die are further coupled to the second integrated circuitry, wherein the second interconnects are coupled to each of two opposite sides of the first IC die. In another embodiment, the second integrated circuitry includes processor logic, and the first integrated circuitry is configured to cache data for access by the processor logic. In another embodiment, the first integrated circuitry includes a power delivery circuit and an on-package input-output interface to cache data for access by the processor logic at higher bandwidth with lower power consumption.

Abstract: A system and method are described for flushing a specified region of a memory side cache (MSC) within a multi-level memory hierarchy. For example, a computer system according to one embodiment comprises: a memory subsystem comprised of a non-volatile system memory and a volatile memory side cache (MSC) for caching portions of the non-volatile system memory; and a flush engine for flushing a specified region of the MSC to the non-volatile system memory in response to a deactivation condition associated with the specified region of the MSC.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.” In one embodiment, the “near memory” is configured to operate in a plurality of different modes of operation including (but not limited to) a first mode in which the near memory operates as a memory cache for the far memory and a second mode in which the near memory is allocated a first address range of a system address space with the far memory being allocated a second address range of the system address space, wherein the first range and second range represent the entire system address space.

Abstract: Techniques and mechanisms for providing interconnected circuitry of an integrated circuit (IC) die stack. In an embodiment, first integrated circuitry of a first IC die is configured to couple, via a first interconnects of the first IC die, to second integrated circuitry of a second IC die. When the first IC die and the second IC die are coupled to one another, second interconnects of the first IC die are further coupled to the second integrated circuitry, wherein the second interconnects are coupled to each of two opposite sides of the first IC die. In another embodiment, the second integrated circuitry includes processor logic, and the first integrated circuitry is configured to cache data for access by the processor logic. In another embodiment, the first integrated circuitry includes a power delivery circuit and an on-package input-output interface to cache data for access by the processor logic at higher bandwidth with lower power consumption.

Abstract: A system and method are described for flushing a specified region of a memory side cache (MSC) within a multi-level memory hierarchy. For example, a computer system according to one embodiment comprises: a memory subsystem comprised of a non-volatile system memory and a volatile memory side cache (MSC) for caching portions of the non-volatile system memory; and a flush engine for flushing a specified region of the MSC to the non-volatile system memory in response to a deactivation condition associated with the specified region of the MSC.

Abstract: A system and method are described for flushing a specified region of a memory side cache (MSC) within a multi-level memory hierarchy. For example, a computer system according to one embodiment comprises: a memory subsystem comprised of a non-volatile system memory and a volatile memory side cache (MSC) for caching portions of the non-volatile system memory; and a flush engine for flushing a specified region of the MSC to the non-volatile system memory in response to a deactivation condition associated with the specified region of the MSC.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.

Abstract: A disclosed example method to suspend and resume a device includes: after detecting a low-power suspend mode request, determining a storage performance of the device to store suspend state data; based on the storage performance of the device, setting a suspend flag to indicate a low-power suspend mode to a processor platform; when resuming from the low-power suspend mode, confirming a setting of a resume flag from the processor platform, the resume flag to notify an operating system to resume from the low-power suspend mode; and when the resume flag is set, restoring state data corresponding to an operating system context from a non-volatile dual-purpose system and storage memory.

Abstract: Embodiments of the invention describe a system main memory comprising two levels of memory that include cached subsets of system disk level storage. This main memory includes “near memory” comprising memory made of volatile memory, and “far memory” comprising volatile or nonvolatile memory storage that is larger and slower than the near memory. The far memory is presented as “main memory” to the host OS while the near memory is a cache for the far memory that is transparent to the OS, thus appearing to the OS the same as prior art main memory solutions. The management of the two-level memory may be done by a combination of logic and modules executed via the host CPU. Near memory may be coupled to the host system CPU via high bandwidth, low latency means for efficient processing. Far memory may be coupled to the CPU via low bandwidth, high latency means.

Abstract: Embodiments of the invention describe a system main memory comprising two levels of memory that include cached subsets of system disk level storage. This main memory includes “near memory” comprising memory made of volatile memory, and “far memory” comprising volatile or nonvolatile memory storage that is larger and slower than the near memory. The far memory is presented as “main memory” to the host OS while the near memory is a cache for the far memory that is transparent to the OS, thus appearing to the OS the same as prior art main memory solutions. The management of the two-level memory may be done by a combination of logic and modules executed via the host CPU. Near memory may be coupled to the host system CPU via high bandwidth, low latency means for efficient processing. Far memory may be coupled to the CPU via low bandwidth, high latency means.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.” In one embodiment, the “near memory” is configured to operate in a plurality of different modes of operation including (but not limited to) a first mode in which the near memory operates as a memory cache for the far memory and a second mode in which the near memory is allocated a first address range of a system address space with the far memory being allocated a second address range of the system address space, wherein the first range and second range represent the entire system address space.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.” In one embodiment, the “near memory” is configured to operate in a plurality of different modes of operation including (but not limited to) a first mode in which the near memory operates as a memory cache for the far memory and a second mode in which the near memory is allocated a first address range of a system address space with the far memory being allocated a second address range of the system address space, wherein the first range and second range represent the entire system address space.

Abstract: Systems, apparatuses and methods may provide for identifying a first block and a second block, wherein the first block includes a first plurality of cache lines, the second block includes a second plurality of cache lines, and the second block resides in a memory-side cache. Additionally, each cache line in the first plurality of cache lines may be compressed with a corresponding cache line in the second plurality of cache lines to obtain a compressed block that includes a third plurality of cache lines. In one example, the second block is replaced in the memory-side cache with the compressed block if the compressed block satisfies a size condition.

Abstract: A disclosed example method to suspend and resume a device includes: after detecting a low-power suspend mode request, determining a storage performance of the device to store suspend state data; based on the storage performance of the device, setting a suspend flag to indicate a low-power suspend mode to a processor platform; when resuming from the low-power suspend mode, confirming a setting of a resume flag from the processor platform, the resume flag to notify an operating system to resume from the low-power suspend mode; and when the resume flag is set, restoring state data corresponding to an operating system context from a non-volatile dual-purpose system and storage memory.

Abstract: In one embodiment, an inter-memory transfer interface having selective data compression/decompression in accordance with the present description, selects from multiple candidate processes, a compression/decompression process to compress a region of data from a near memory before transmitting the compressed data to the far memory. In another aspect, the inter-memory transfer interface stores metadata indicating the particular compression/decompression process selected to compress that region of data. The stored metadata may then be used to identify the compression/decompression technique selected to compress a particular region of data, for purposes of locating the compressed data and subsequently decompressing data of that region when read from the far memory. Other aspects are described herein.

Abstract: Systems, apparatuses and methods may provide for identifying a first block and a second block, wherein the first block includes a first plurality of cache lines, the second block includes a second plurality of cache lines, and the second block resides in a memory-side cache. Additionally, each cache line in the first plurality of cache lines may be compressed with a corresponding cache line in the second plurality of cache lines to obtain a compressed block that includes a third plurality of cache lines. In one example, the second block is replaced in the memory-side cache with the compressed block if the compressed block satisfies a size condition.