Abstract: A connector for low or zero insertion force receipt of multi-pin arrays, such as those in very large scale integration (VLSI) components, includes cooperating camming surfaces having inclined ramps and slots. Selective longitudinal movement of a cam actuator causes vertical movement of a cam plate whereby self-biasing of connector contacts is opposed for ready pin insertion. Engagement between the cam plate and contacts ceases upon reverse movement of the cam actuator to permit the contacts to effect tight engagement with the pins under the influence of their such self-biasing forces.

Abstract: A connector for zero or low insertion force receipt of multi-pin arrays, such as those in very large scale integration (VLSI) components, includes cam surfaces for selective movement to oppose the self-biasing forces of connector contacts for pin insertion and reverse movement to permit the contacts to effect tight engagement with the pins under the influence of such self-biasing forces.

Abstract: Common printed circuit board area usage is provided for electronic packages and accessory components by the provision of an assembly including a receptacle stacking a package and accessory component and having electrical contact elements with fixed portions selectively connected to component contacts and other portions for engaging package contacts. In a preferred embodiment, the assembly includes one or more dual-in-line packages (DIP) and the accessory component is a capacitive decoupling assembly.

Abstract: A receptacle for stacked support of electronic packages provides ready address/selection of each package by disposing vertically spaced receptacle contact sets in offset relation longitudinally of an elongate package-receiving channel. Package stacking is facilitated by a fixed support for a lower package and a further support selectively movable into the package-receiving channel for supporting an upper package. Zero insertion force is provided by an actuator operable to displace receptacle contact sets from noninterfering disposition with respect to the channel into engagement with package contacts.

Abstract: Common printed circuit board area usage is provided for electronic packages and accessory components by the provision of an assembly including a receptacle stacking a package and accessory component and having electrical contact elements with fixed portions selectively connected to component contacts and other portions for engaging package contacts. In a preferred embodiment, the assembly includes one or more dual-in-line packages (DIP) and the accessory component is a capacitive decoupling assembly.