Patents by Inventor Graham J. Baldwin

Graham J. Baldwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4509096
    Abstract: A substrate for a leadless chip carrier is formed on a rigid multi-layer circuit board. Layers of copper-clad invar are secured to opposite sides of the board, and on top of these are mounted respective layers of elastomeric material. An electrically-conductive layer is laid on top of the upper elastomeric layer and this is formed in a pattern of contact elements, and tracks which may be of dog-leg shape and which are interconnected to other layers of the substrate by plated holes. The chip carrier is supported on a heat transfer pad of copper which rests on the upper invar layer and is secured thereto by a layer of solder. The pad may have an integral pillar that extends through a copper-plated aperture in the substrate to a heat-dissipating pad on the surface of the lower elastomeric layer. Contact pads on the chip carrier are soldered to the contact elements, the height of the heat-transfer pad being such as to separate them and ensure a thick solder joint.
    Type: Grant
    Filed: February 10, 1984
    Date of Patent: April 2, 1985
    Assignee: Smiths Industries Public Limited Company
    Inventors: Graham J. Baldwin, Michael O. McCann