Patents by Inventor Gregory Perry

Gregory Perry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package with stud bump electrical connections
    Patent number: 11552035
    Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: January 10, 2023
    Assignee: Intel Corporation
    Inventors: Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan H. Lu, Omkar Karhade, Shawna M. Liff
  • ELECTRONIC PACKAGE WITH STUD BUMP ELECTRICAL CONNECTIONS
    Publication number: 20210366862
    Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 25, 2021
    Inventors: Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan H. Lu, Omkar Karhade, Shawna M. Liff
  • Electronic package with stud bump electrical connections
    Patent number: 11127706
    Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 21, 2021
    Assignee: Intel Corporation
    Inventors: Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan H. Lu, Omkar Karhade, Shawna M. Liff
  • ELECTRONIC PACKAGE WITH STUD BUMP ELECTRICAL CONNECTIONS
    Publication number: 20200105701
    Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan H. Lu, Omkar Karhade, Shawna M. Liff
  • Graded polymer optical fibers and process for the manufacture thereof
    Patent number: 5235660
    Abstract: A process for the manufacture of a multi-layer polymer optical fiber having a graded optical refractive index profile. This fiber is comprised of an inner core layer, one or more intermediate layers and an outer clad layer, each layer being extruded from a polymer material. All layers are arranged in a concentric configuration, with the outer clad layer enclosing all other layers.
    Type: Grant
    Filed: July 10, 1992
    Date of Patent: August 10, 1993
    Assignee: Peachtree Fiberoptics, Inc.
    Inventors: Gregory A. Perry, Clifford E. Witcher
  • Method for producing a single mode fiber preform
    Patent number: 4596589
    Abstract: A method for fabricating a single mode fiber preform is described. The method consists of placing a core rod in a glass lathe, sliding a barrier tube over the core rod, partially attaching the barrier tube to the core rod, rotating and heating the barrier tube, and traversing the heat source until the barrier tube collapses onto the core rod. A second tube of high purity quartz called a primary jacket tube is then slipped over the combination fabricated from the core rod and barrier tube, rotating and heating the primary jacket tube, and traversing the heat source until the primary jacket tube collapses onto the barrier tube.
    Type: Grant
    Filed: February 9, 1984
    Date of Patent: June 24, 1986
    Inventor: Gregory A. Perry