Patents by Inventor Guizhen Zheng

Guizhen Zheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120180312
    Abstract: In integrated circuit packages, core vias are created to provide electrical connections between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods for forming a via in a packaging substrate and packaging substrates having core vias formed in the core substrate material. Methods for forma a core via in a packaging substrate in which a first hole is created through the core substrate and filled with a low permittivity filler material. A second co-axially aligned hole is then created in the low permittivity filler material wherein the second hole is smaller in diameter than the first hole. The second hole is then filled with conducting material to provide a conducting via through the core substrate material.
    Type: Application
    Filed: March 26, 2012
    Publication date: July 19, 2012
    Inventors: Zhichao Zhang, Kemal Aygun, Guizhen Zheng
  • Publication number: 20100326716
    Abstract: In integrated circuit packages, core vias are created to provide electrical connections between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods for forming a via in a packaging substrate and packaging substrates having core vias formed in the core substrate material. Methods for forma a core via in a packaging substrate in which a first hole is created through the core substrate and filled with a low permittivity filler material. A second co-axially aligned hole is then created in the low permittivity filler material wherein the second hole is smaller in diameter than the first hole. The second hole is then filled with conducting material to provide a conducting via through the core substrate material.
    Type: Application
    Filed: June 26, 2009
    Publication date: December 30, 2010
    Inventors: Zhichao Zhang, Kemal Aygun, Guizhen Zheng
  • Patent number: 7709934
    Abstract: A package may include a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: May 4, 2010
    Assignee: Intel Corporation
    Inventors: Xiang Yin Zeng, Jiangqi He, Guizhen Zheng
  • Patent number: 7589674
    Abstract: A self-similar multiband reconfigurable antenna includes a planar antenna structure formed on a surface of a substrate, the antenna structure including symmetrically opposed self-similar geometry antenna arms defining a self-similar or Sierpinski gasket configuration for each arm of the antenna. MEMS type switches are provided for operatively connecting adjacent antenna patches on each arm of the antenna configuration, and a voltage source is provided for selectively actuating the switches. Selective actuation of the switches enables up to four different antenna configurations each having a different resonant frequency, and wherein each resonant frequency demonstrates a similar radiation pattern.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: September 15, 2009
    Assignee: STC.UNM
    Inventors: Dimitrios Anagnostou, Guizhen Zheng, Ioannis Papapolymerou, Christos Christodoulou
  • Publication number: 20090207091
    Abstract: A self-similar multiband reconfigurable antenna includes a planar antenna structure formed on a surface of a substrate, the antenna structure including symmetrically opposed self-similar geometry antenna arms defining a self-similar or Sierpinski gasket configuration for each arm of the antenna. MEMS type switches are provided for operatively connecting adjacent antenna patches on each arm of the antenna configuration, and a voltage source is provided for selectively actuating the switches. Selective actuation of the switches enables up to four different antenna configurations each having a different resonant frequency, and wherein each resonant frequency demonstrates a similar radiation pattern.
    Type: Application
    Filed: July 18, 2006
    Publication date: August 20, 2009
    Inventors: Dimitrios Anagnostou, Guizhen Zheng, Ioannis Papapolymerou, Christos Christodoulou
  • Patent number: 7477197
    Abstract: Electronic devices and methods for their formation are described. One device relates to an electronic assembly including a substrate having a first surface and a second surface opposite the first surface. The electronic assembly also includes at least one RF front-end module coupled to the first surface of the substrate, and a ground plane layer positioned on the second surface of the substrate. The electronic assembly also includes an insulating layer on the ground plane layer, with the ground plane layer positioned between the second surface and the insulating layer. In addition, the electronic assembly also includes an antenna layer on the insulating layer, with the insulating layer positioned between the antenna layer and the ground plane layer.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: January 13, 2009
    Assignee: Intel Corporation
    Inventors: Xiang Yin Zeng, Jiangqi He, Guizhen Zheng
  • Publication number: 20080157294
    Abstract: A package may comprise a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.
    Type: Application
    Filed: December 28, 2006
    Publication date: July 3, 2008
    Inventors: Xiang Yin Zeng, Jiangqi He, Guizhen Zheng
  • Publication number: 20080158063
    Abstract: Electronic devices and methods for their formation are described. One device relates to an electronic assembly including a substrate having a first surface and a second surface opposite the first surface. The electronic assembly also includes at least one RF front-end module coupled to the first surface of the substrate, and a ground plane layer positioned on the second surface of the substrate. The electronic assembly also includes an insulating layer on the ground plane layer, with the ground plane layer positioned between the second surface and the insulating layer. In addition, the electronic assembly also includes an antenna layer on the insulating layer, with the insulating layer positioned between the antenna layer and the ground plane layer.
    Type: Application
    Filed: December 29, 2006
    Publication date: July 3, 2008
    Inventors: Xiang Yin ZENG, Jiangqi HE, Guizhen ZHENG