Patents by Inventor Gunn Hwang
Gunn Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8638110Abstract: There is provided a high resolution circuit for converting a capacitance-to-time deviation including a capacitance deviation detecting unit generating two detection signals having a phase difference corresponding to variations of capacitance of an micro electro mechanical system (MEMS) sensor; a capacitance deviation amplifying unit dividing frequencies of the two detection signals to amplify the phase difference corresponding to the capacitance deviation; and a time signal generating unit generating a time signal having a pulse width corresponding to the amplified phase difference.Type: GrantFiled: July 21, 2008Date of Patent: January 28, 2014Assignee: Electronics and Telecommunications Research InstituteInventors: Sung Sik Lee, Myung Lae Lee, Gunn Hwang, Chang Auck Choi
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Patent number: 8613287Abstract: An apparatus for preventing stiction of a three-dimensional MEMS (microelectromechanical system) microstructure, the apparatus including: a substrate; and a plurality of micro projections formed on a top surface of the substrate with a predetermined height in such a way that a cleaning solution flowing out from the microstructure disposed thereabove is discharged.Type: GrantFiled: April 14, 2008Date of Patent: December 24, 2013Assignee: Electronics and Telecommunications Research InstituteInventors: Chang Han Je, Myung Lae Lee, Sung Hae Jung, Gunn Hwang, Chang Auck Choi
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Publication number: 20130271088Abstract: Disclosed are ultrasonic wireless power transmitter and receiver apparatuses, and a method for wireless charging thereof.Type: ApplicationFiled: November 7, 2012Publication date: October 17, 2013Applicant: Electronics and Telecommunications Research InstituteInventors: Gunn HWANG, Sung Q LEE, Woo Seok YANG, JongDae KIM
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Patent number: 8490683Abstract: There is provided a flat plate type micro heat transport device formed of two plates coupled with each other to be opposite to each other, each of the plates includes: a reservoir formed to store a moving fluid charged via an inlet; a evaporator formed separated from the reservoir to generate vapor having latent heat by vaporizing the moving fluid; a vapor flow path formed to be connected to the evaporator, through which the vapor having latent heat is transported; a condenser formed to be connected to the vapor flow path and to condense the vapor having latent heat; and a liquid flow path formed to be connected to the condenser and the evaporator and separately from the vapor flow path to transport a liquid obtained by condensing the vapor. The device may efficiently control heat with respect to portable electronic devices by effectively transporting heat generated by a heat source.Type: GrantFiled: April 21, 2008Date of Patent: July 23, 2013Assignee: Electronics and Telecommunications Research InstituteInventors: Seok Hwan Moon, Gunn Hwang
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Publication number: 20130028055Abstract: Disclosed is a high directive ultrasonic transducer that can concentrate a radiated ultrasonic wave in one direction by making an orientation angle of the radiated ultrasonic wave small in an ultrasonic transducer having a planar radiation plate structure, which has high radiation efficiency in an air medium. The high directive ultrasonic transducer according to the present disclosure includes a planar radiation plate configured to radiate an ultrasonic wave into a medium; a driving unit configured to vibrate the radiation plate in a higher order mode of a secondary order or more by applying predetermined force to a bottom surface of the radiation plate; and a matching layer formed in a height corresponding to 1/4 of an ultrasonic wavelength in the medium, in a part having a positive vibration velocity on a top surface of the radiation plate.Type: ApplicationFiled: July 25, 2012Publication date: January 31, 2013Applicant: Electronics and Telecommunications Research InstituteInventors: Sung Q LEE, Gunn Hwang
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Patent number: 8359758Abstract: A three-dimensional inclination angle calculation circuit is provided. The three-dimensional inclination angle calculation circuit includes: X-axis, Y-axis, and Z-axis vibration sensors which change X-axis, Y-axis, and Z-axis electrostatic capacitances according to three-dimensional positions of a measured plane with respect to a reference plane, respectively; X-axis, Y-axis, and Z-axis position value acquisition units which acquire X-axis, Y-axis, and Z-axis position values corresponding to the X-axis, Y-axis, and Z-axis electrostatic capacitances, respectively; and an inclination angle calculation unit which calculates an inclination angle of the measured plane with respect to the reference plane based on the X-axis, Y-axis, and Z-axis position values. Accordingly, it is possible to very easily calculate an inclination angle according to a three-dimensional position of a to-be-measured apparatus by using an existing vibration sensor.Type: GrantFiled: April 15, 2008Date of Patent: January 29, 2013Assignee: Electronics and Telecommunications Research InstituteInventors: Sung Sik Lee, Myung Lae Lee, Chang Han Je, Gunn Hwang, Chang Auck Choi
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Patent number: 8261617Abstract: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.Type: GrantFiled: April 21, 2008Date of Patent: September 11, 2012Assignee: Electronics and Telecomunications Research InstituteInventors: Chang Auck Choi, Chang Han Je, Gunn Hwang, Youn Tae Kim, Sung Hae Jung, Myung Lae Lee, Sung Sik Lee, Seok Hwan Moon
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Publication number: 20120155220Abstract: Disclosed is a system of transferring wireless power using an ultrasonic wave, including: an ultrasonic wave generating device converting and transferring electric energy to an ultrasonic wave; and an ultrasonic wave receiving device receiving the ultrasonic wave to convert the ultrasonic wave to electric energy, wherein the ultrasonic wave generating device includes a radiation plate with a plurality of ultrasonic elements and controls an effective area of the radiation plate by turning on/off the plurality of ultrasonic elements so that the ultrasonic wave receiving device is disposed at a position minimizing dispersion effect due to a circular radiation of the ultrasonic wave.Type: ApplicationFiled: December 2, 2011Publication date: June 21, 2012Applicant: Electronics and Telecommunications Research InstituteInventors: Sung Q LEE, Gunn Hwang
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Patent number: 8113054Abstract: A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.Type: GrantFiled: December 5, 2007Date of Patent: February 14, 2012Assignee: Electronics and Telecommunications Research InstituteInventors: Chang-Han Je, Gunn Hwang, Sung-Hae Jung, Myung-Lae Lee, Chang-Auck Choi
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Patent number: 8035176Abstract: Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.Type: GrantFiled: July 25, 2007Date of Patent: October 11, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Sung-Hae Jung, Myung-Lae Lee, Gunn Hwang, Chang-Kyu Kim, Chang-Han Je, Chang-Auck Choi
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Patent number: 7997137Abstract: There is provided a bidirectional readout circuit for detecting direction and amplitude of an oscillation sensed at a capacitive microelectromechanical system (MEMS) accelerometer, the bidirectional readout circuit converting capacitance changes of the capacitive MEMS accelerometer into a time change amount by using high resolution capacitance-to-time conversion technology and outputting the time change amount as the direction and the amplitude of the oscillation by using time-to-digital conversion (TDC) technology, thereby detecting not only the amplitude of the oscillation but also the direction thereof, which is capable of being applied to various MEMS sensors.Type: GrantFiled: July 3, 2008Date of Patent: August 16, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Sung Sik Lee, Ji Man Park, Myung Lae Lee, Sung Hae Jung, Chang Han Je, Gunn Hwang, Chang Auck Choi
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Publication number: 20110192040Abstract: A three-dimensional inclination angle calculation circuit is provided. The three-dimensional inclination angle calculation circuit includes: X-axis, Y-axis, and Z-axis vibration sensors which change X-axis, Y-axis, and Z-axis electrostatic capacitances according to three-dimensional positions of a measured plane with respect to a reference plane, respectively; X-axis, Y-axis, and Z-axis position value acquisition units which acquire X-axis, Y-axis, and Z-axis position values corresponding to the X-axis, Y-axis, and Z-axis electrostatic capacitances, respectively; and an inclination angle calculation unit which calculates an inclination angle of the measured plane with respect to the reference plane based on the X-axis, Y-axis, and Z-axis position values. Accordingly, it is possible to very easily calculate an inclination angle according to a three-dimensional position of a to-be-measured apparatus by using an existing vibration sensor.Type: ApplicationFiled: April 15, 2008Publication date: August 11, 2011Inventors: Sung Sik Lee, Myung Lae Lee, Chang Han Je, Gunn Hwang, Chang Auck Choi
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Publication number: 20110186089Abstract: An apparatus for preventing stiction of a three-dimensional MEMS (microelectromechanical system) microstructure, the apparatus including: a substrate; and a plurality of micro projections formed on a top surface of the substrate with a predetermined height in such a way that a cleaning solution flowing out from the microstructure disposed thereabove is discharged.Type: ApplicationFiled: April 14, 2008Publication date: August 4, 2011Inventors: Chang Han Je, Myung Lae Lee, Sung Hae Jung, Gunn Hwang, Chang Auck Choi
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Patent number: 7975550Abstract: There is provided a micromachined sensor for measuring a vibration, based on silicone micromachining technology, in which a conductor having elasticity is connected to masses moving due to a force generated by the vibration and the vibration is measured by using induced electromotive force generated due to the conductor moving in a magnetic field.Type: GrantFiled: April 29, 2008Date of Patent: July 12, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Myung Lae Lee, Chang Han Je, Sung Sik Lee, Sung Hae Jung, Chang Auck Choi, Gunn Hwang
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Patent number: 7971633Abstract: Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.Type: GrantFiled: December 9, 2005Date of Patent: July 5, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Seok Hwan Moon, Gunn Hwang, Sung Weon Kang, Chang Auck Choi
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Publication number: 20110133758Abstract: There is provided a high resolution circuit for converting a capacitance-to-time deviation including a capacitance deviation detecting unit generating two detection signals having a phase difference corresponding to variations of capacitance of an micro electro mechanical system (MEMS) sensor; a capacitance deviation amplifying unit dividing frequencies of the two detection signals to amplify the phase difference corresponding to the capacitance deviation; and a time signal generating unit generating a time signal having a pulse width corresponding to the amplified phase difference.Type: ApplicationFiled: July 21, 2008Publication date: June 9, 2011Applicant: Electronics and Telecommunications Research InstituteInventors: Sung Sik Lee, Myung Lae Lee, Gunn Hwang, Chang Auck Choi
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Publication number: 20110079372Abstract: Provided is a heat transfer device which has a function of generating power through vibration of capillary grooves having a thin piezoelectric film deposited thereon, in addition to a heat transfer function of discharging heat transferred from a heating element to the outside.Type: ApplicationFiled: December 11, 2008Publication date: April 7, 2011Applicant: Electronics and Telecommunications Research InstituteInventors: Seok Hwan Moon, Gunn Hwang
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Publication number: 20100258278Abstract: A flat plate type heat spreading device is provided. The flat plat type heat spreading device can reduce heat by generating phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers or mobile phones. Specifically, the flat plate type heat spreading device includes a lower plate for evaporating liquid, a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate, and an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor.Type: ApplicationFiled: April 1, 2008Publication date: October 14, 2010Applicant: Electronics and Telecommunications Research InstituteInventors: Seok Hwan Moon, Gunn Hwang
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Publication number: 20100251826Abstract: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.Type: ApplicationFiled: April 21, 2008Publication date: October 7, 2010Inventors: Chang Auck Choi, Chang Han Je, Gunn Hwang, Youn Tae Kim, Sung Hae Jung, Myung Lae Lee, Sung Sik Lee, Seok Hwan Moon
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Publication number: 20100243214Abstract: There is provided a flat plate type micro heat transport device formed of two plates coupled with each other to be opposite to each other, each of which includes: a reservoir formed to store a moving fluid charged via an inlet; a evaporator formed separated from the reservoir to generate vapor having latent heat by vaporizing the moving fluid; a vapor flow path formed to be connected to the evaporator, through which the vapor having latent heat is transported; a condenser formed to be connected to the vapor flow path and to condense the vapor having latent heat; and a liquid flow path formed to be connected to the condenser and the evaporator and separately from the vapor flow path to transport a liquid obtained by condensing the vapor. The device may efficiently control heat with respect to portable electronic devices by effectively transportring heat generated by a heat source.Type: ApplicationFiled: April 21, 2008Publication date: September 30, 2010Applicant: Electronics and Telecommunications Research Insti tuteInventors: Seok Hwan Moon, Gunn Hwang