Abstract: The present invention relates to an encoding method and decoding method, and a device using the same. The encoding method according to the present invention comprises the steps of: specifying an intra prediction mode for a current block; and scanning a residual signal by intra prediction of the current block, wherein the step of scanning the residual signal can determine a scanning type for a luminance signal and a chroma signal of the current block according to an intra prediction mode for a luminance sample of the current block.

Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.

Abstract: The present invention discloses an image decoding method, the method including generating a candidate list including motion information derived from a spatial neighboring block and a temporal neighboring block adjacent to a current block; deriving motion information of the current block using the candidate list; generating a prediction block of the current block using the derived motion information; and updating the derived motion information in a motion information list, wherein the generating of the candidate list is performed in such a manner as to include at least one information of the motion information included in the updated motion information list in a block decoded before the current block.

Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.

Abstract: According to the present invention, an image encoding apparatus comprises: a motion prediction unit which derives motion information on a current block in the form of the motion information including L0 motion information and L1 motion information; a motion compensation unit which performs a motion compensation for the current block on the basis of at least one of the L0 motion information and L1 motion information so as to generate a prediction block corresponding to the current block; and a restoration block generating unit which generates a restoration block corresponding to the current block based on the prediction block. According to the present invention, image encoding efficiency can be improved.

Abstract: The present disclosure relates to a patch-type thermometer using a thermochromic ink, and particularly to, a patch-type thermometer capable of accurately measuring a body temperature even in special environments.

Abstract: Provided herein is a portable apparatus for surface inspection and electrolytic polishing, the apparatus including a housing where a motor and controller are embedded. The apparatus also includes a screw axis rotatable by the motor and a cylinder with a ball nut coupled to the screw axis and coupled to a slider. A plurality of guide members are included that each have an upper end coupled to the housing and a lower end coupled to a base plate. The guide member penetrates the slider, and the slider moves up and down along the guide members with the cylinder. A surface inspector and an electrolytic polisher are coupled to the slider and move up and down together with the slider allowing the surface inspector and the electrolytic polisher to test a test subject in various industrial fields, such as machinery, construction, chemicals, and the like.

Abstract: Provided herein is a portable apparatus for surface inspection and electrolytic polishing, the apparatus including a housing where a motor and controller are embedded. The apparatus also includes a screw axis rotatable by the motor and a cylinder with a ball nut coupled to the screw axis and coupled to a slider. A plurality of guide members are included that each have an upper end coupled to the housing and a lower end coupled to a base plate. The guide member penetrates the slider, and the slider moves up and down along the guide members with the cylinder. A surface inspector and an electrolytic polisher are coupled to the slider and move up and down together with the slider allowing the surface inspector and the electrolytic polisher to test a test subject in various industrial fields, such as machinery, construction, chemicals, and the like.

Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads are provided in two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body.

Abstract: A multi-directional hand-free kit. The kit has a main body receiving a printed circuit board therein for controlling audio signal sending and receiving incorporated with a mobile communication device and formed with a first oblique portion, a connector member connected to an external power source and formed at a portion thereof facing the first oblique portion with a second oblique portion which frictionally makes contact with the first oblique portion, and a shaft member for connecting the main body and the connector member in such a manner that the main body and the connector member are obliquely rotatable to each other.