Patents by Inventor Gwi-gyeon Yang

Gwi-gyeon Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140327144
    Abstract: Disclosed are complex semiconductor packages, each including a large power module package which includes a small semiconductor package, and methods of manufacturing the complex semiconductor packages. An exemplary complex semiconductor package includes a first package including: a first packaging substrate; a plurality of first semiconductor chips disposed on the first packaging substrate; and a first sealing member covering the first semiconductor chips on the first packaging substrate; and at least one second package separated from the first packaging substrate, disposed in the first sealing member, and including second semiconductor chips.
    Type: Application
    Filed: July 16, 2014
    Publication date: November 6, 2014
    Inventors: Gwi-gyeon Yang, Seungwon Im
  • Patent number: 8796831
    Abstract: Disclosed are complex semiconductor packages, each including a large power module package which includes a small semiconductor package, and methods of manufacturing the complex semiconductor packages. An exemplary complex semiconductor package includes a first package including: a first packaging substrate; a plurality of first semiconductor chips disposed on the first packaging substrate; and a first sealing member covering the first semiconductor chips on the first packaging substrate; and at least one second package separated from the first packaging substrate, disposed in the first sealing member, and including second semiconductor chips.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: August 5, 2014
    Assignee: Fairchild Korea Semiconductor, Ltd.
    Inventors: Gwi-gyeon Yang, Seung-won Lim
  • Patent number: 8198139
    Abstract: Provided are a power device package, which can be made compact by vertically stacking substrates on which semiconductor chips are mounted, and a method of fabricating the power device package.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: June 12, 2012
    Assignee: Fairchild Korea Semiconductor Ltd.
    Inventor: Gwi-gyeon Yang
  • Patent number: 7846779
    Abstract: Provided are a power device package, which can be made compact by mounting semiconductor chips in recesses formed in a substrate and improve operational reliability by rapidly dissipating heat generated during operation to the outside, and a method of fabricating the power device package.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: December 7, 2010
    Assignees: Fairchild Korea, Semiconductor Ltd.
    Inventor: Gwi-gyeon Yang
  • Publication number: 20090243061
    Abstract: Disclosed are complex semiconductor packages, each including a large power module package which includes a small semiconductor package, and methods of manufacturing the complex semiconductor packages. An exemplary complex semiconductor package includes a first package including: a first packaging substrate; a plurality of first semiconductor chips disposed on the first packaging substrate; and a first sealing member covering the first semiconductor chips on the first packaging substrate; and at least one second package separated from the first packaging substrate, disposed in the first sealing member, and including second semiconductor chips.
    Type: Application
    Filed: March 27, 2009
    Publication date: October 1, 2009
    Inventors: Gwi-gyeon Yang, Seung-won Lim
  • Publication number: 20090218665
    Abstract: Provided are a power device package, which can be made compact by mounting semiconductor chips in recesses formed in a substrate and improve operational reliability by rapidly dissipating heat generated during operation to the outside, and a method of fabricating the power device package.
    Type: Application
    Filed: August 20, 2008
    Publication date: September 3, 2009
    Inventor: Gwi-gyeon Yang
  • Publication number: 20090218666
    Abstract: Provided are a power device package, which can be made compact by vertically stacking substrates on which semiconductor chips are mounted, and a method of fabricating the power device package.
    Type: Application
    Filed: September 18, 2008
    Publication date: September 3, 2009
    Inventor: Gwi-gyeon Yang
  • Patent number: 7208819
    Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
    Type: Grant
    Filed: October 26, 2004
    Date of Patent: April 24, 2007
    Assignee: Fairchild Korea Semiconductor Ltd.
    Inventors: Gi-young Jeun, Sung-min Park, Joo-sang Lee, Sung-won Lim, O-seob Jeon, Byoung-ok Lee, Young-gil Kim, Gwi-gyeon Yang
  • Patent number: 7061080
    Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
    Type: Grant
    Filed: June 10, 2002
    Date of Patent: June 13, 2006
    Assignee: Fairchild Korea Semiconductor Ltd.
    Inventors: Gi-young Jeun, Sung-min Park, Joo-sang Lee, Sung-won Lim, O-seob Jeon, Byoung-ok Lee, Young-gil Kim, Gwi-gyeon Yang
  • Publication number: 20050056918
    Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
    Type: Application
    Filed: October 26, 2004
    Publication date: March 17, 2005
    Applicant: Fairchild Korea Semiconductor Ltd.
    Inventors: Gi-young Jeun, Sung-min Park, Joo-sang Lee, Sung-won Lim, O-seob Jeon, Byoung-ok Lee, Young-gil Kim, Gwi-gyeon Yang
  • Publication number: 20030011054
    Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
    Type: Application
    Filed: June 9, 2002
    Publication date: January 16, 2003
    Applicant: Fairchild Semiconductor Corporation
    Inventors: Gi-young Jeun, Sung-min Park, Joo-sang Lee, Sung-won Lim, O-seob Jeon, Byoung-ok Lee, Young-gil Kim, Gwi-gyeon Yang