Patents by Inventor H. Kelly Flesher

H. Kelly Flesher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stress-free silicon wafer and a die or chip made therefrom and method
    Patent number: 6576990
    Abstract: A stress-free wafer comprising a substrate formed of a semiconductor material having front side and back side planar and parallel surfaces and having a thickness which can be as thin as 1 to 2 mils. The front side has electronic circuitry therein with exposed contact pads. The back side is ground and polished so that the wafer is substantially stress free and can withstand bending over a 2″ radius without breaking or damaging.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: June 10, 2003
    Assignee: Aptek Industries, Inc.
    Inventors: H. Kelly Flesher, Albert P. Youmans
  • Stress-free silicon wafer and a die or chip made therefrom and method
    Publication number: 20010031511
    Abstract: A stress-free wafer comprising a substrate formed of a semiconductor material having front side and back side planar and parallel surfaces and having a thickness which can be as thin as 1 to 2 mils. The front side has electronic circuitry therein with exposed contact pads. The back side is ground and polished so that the wafer is substantially stress free and can withstand bending over a 2″ radius without breaking or damaging.
    Type: Application
    Filed: June 20, 2001
    Publication date: October 18, 2001
    Applicant: APTEK INDUSTRIES, INC.
    Inventors: H. Kelly Flesher, Albert P. Youmans
  • Stress-free silicon wafer and a die or chip made therefrom and method
    Patent number: 6268237
    Abstract: A stress-free wafer comprising a substrate formed of a semiconductor material having front side and back side planar and parallel surfaces and having a thickness which can be as thin as 1 to 2 mils. The front side has electronic circuitry therein with exposed contact pads. The back side is ground and polished so that the wafer is substantially stress free and can withstand bending over a 2″ radius without breaking or damaging.
    Type: Grant
    Filed: February 10, 2000
    Date of Patent: July 31, 2001
    Assignee: Aptek Industries, Inc.
    Inventors: H. Kelly Flesher, Albert P. Youmans
  • Stress-free silicon wafer and a die or chip made therefrom
    Patent number: 6054372
    Abstract: A stress-free wafer comprising a substrate formed of a semiconductor material having front side and back side planar and parallel surfaces and having a thickness ranging from 2 to 7 mils. The front side has electronic circuitry therein with exposed contact pads. The back side is ground and polished so that the wafer is substantially stress free and can withstand bending over a 2" radius without breaking or damaging.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: April 25, 2000
    Assignee: Aptek Industries, Inc.
    Inventors: H. Kelly Flesher, Albert P. Youmans
  • Flexible electronic card and method
    Patent number: 5733814
    Abstract: A flexible electronic card for use with an electronic card reader comprising a flexible substrate formed of plastic. The card has dimensions such that it can fit into a conventional billfold. A flexible semiconductor device is carried by the flexible substrate and is accessible electronically by the electronic card reader. The card and the semiconductor device carried thereby can withstand bending over a 2" radius without breaking or damaging the semiconductor device.
    Type: Grant
    Filed: September 17, 1996
    Date of Patent: March 31, 1998
    Assignee: Aptek Industries, Inc.
    Inventors: H. Kelly Flesher, Albert P. Youmans
  • Flexible electronic card and method
    Patent number: 5703755
    Abstract: A flexible electronic card for use with an electronic card reader including a flexible substrate formed of plastic. The card has dimensions such that it can fit into a conventional billfold. A flexible semiconductor device is carried by the flexible substrate and is accessible electronically by the electronic card reader. The card and the semiconductor device carried thereby can withstand bending over a 2" radius without breaking or damaging the semiconductor device.
    Type: Grant
    Filed: May 7, 1997
    Date of Patent: December 30, 1997
    Assignee: Aptek Industries, Inc.
    Inventors: H. Kelly Flesher, Albert P. Youmans