Patents by Inventor HaiChao Du
HaiChao Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940528Abstract: Disclosed are a method and system for evaluating sonar self-noise at a ship design stage. The method includes: building a ship structure full-scale geometric simulation model; acquiring loss factors and sonar transducer space outfitting acoustic absorption coefficient material parameters; acquiring mechanical excitation, hydrodynamic excitation, and propeller excitation; inputting the loss factors and the sonar transducer space outfitting acoustic absorption coefficient material parameters into an established statistical energy evaluation model, and applying a mechanical excitation to a face plate of foundation of the built ship structure full-scale geometric simulation model, applying a hydrodynamic excitation to the surface of a ship hull, and applying a propeller excitation to a stern shaft to perform calculation of sonar self-noise of a ship to obtain total spectral density level of the sonar self-noise; and evaluating spectral density level calculation results by index requirements.Type: GrantFiled: October 24, 2023Date of Patent: March 26, 2024Assignee: HARBIN ENGINEERING UNIVERSITYInventors: Haichao Li, Jiawei Xu, Fuzhen Pang, Cong Gao, Yuhang Tang, Jiajun Zheng, Xueren Wang, Zhe Zhao, Xuhong Miao, Yuan Du
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Publication number: 20240077608Abstract: Disclosed are a method and system for evaluating sonar self-noise at a ship design stage. The method includes: building a ship structure full-scale geometric simulation model; acquiring loss factors and sonar transducer space outfitting acoustic absorption coefficient material parameters; acquiring mechanical excitation, hydrodynamic excitation, and propeller excitation; inputting the loss factors and the sonar transducer space outfitting acoustic absorption coefficient material parameters into an established statistical energy evaluation model, and applying a mechanical excitation to a face plate of foundation of the built ship structure full-scale geometric simulation model, applying a hydrodynamic excitation to the surface of a ship hull, and applying a propeller excitation to a stern shaft to perform calculation of sonar self-noise of a ship to obtain total spectral density level of the sonar self-noise; and evaluating spectral density level calculation results by index requirements.Type: ApplicationFiled: October 24, 2023Publication date: March 7, 2024Inventors: Haichao LI, Jiawei XU, Fuzhen PANG, Cong GAO, Yuhang TANG, Jiajun ZHENG, Xueren WANG, Zhe ZHAO, Xuhong MIAO, Yuan DU
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Patent number: 11523041Abstract: The present disclosure provides a camera module and an electronic device. The camera module comprises a bearing base, an image sensor, a baseplate, a lens bracket, and a lens group. The image sensor is disposed at the bearing base. The baseplate is disposed at the bearing base and is separated from the image sensor. The baseplate is disposed on the periphery of the image sensor. The baseplate is electrically connected with the image sensor. The lens bracket is disposed at the bearing base. The image sensor and a part of the baseplate are disposed in the lens bracket. The lens bracket comprises a photosensitive through hole. The image sensor corresponds to the photosensitive through hole. The lens group is disposed at the lens bracket and corresponds to the image sensor through the photosensitive through hole.Type: GrantFiled: June 25, 2021Date of Patent: December 6, 2022Assignee: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITEDInventors: HaiChao Du, JiJi Zhong, Rui Zhang
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Patent number: 11419207Abstract: The present disclosure provides an embedding reinforced circuit board, a camera module, and an electronic device. The embedding reinforced circuit board, comprising a circuit board and a reinforcing plate. The circuit board comprises a first surface and a second surface opposite to the first surface. The first surface is provided with a component installation area. The second surface is provided with an accommodating groove. The width of at least one side of the cross-sectional area of the accommodating groove is wider than the width of the corresponding side of the component installation area. The cross-sectional area of the accommodating groove is parallel to the first surface or the second surface. The reinforcing plate is disposed in the accommodating groove.Type: GrantFiled: December 7, 2020Date of Patent: August 16, 2022Assignee: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITEDInventors: Bo Chen, HaiChao Du
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Publication number: 20220006935Abstract: The present disclosure provides a camera module and an electronic device. The camera module comprises a bearing base, an image sensor, a baseplate, a lens bracket, and a lens group. The image sensor is disposed at the bearing base. The baseplate is disposed at the bearing base and is separated from the image sensor. The baseplate is disposed on the periphery of the image sensor. The baseplate is electrically connected with the image sensor. The lens bracket is disposed at the bearing base. The image sensor and a part of the baseplate are disposed in the lens bracket. The lens bracket comprises a photosensitive through hole. The image sensor corresponds to the photosensitive through hole. The lens group is disposed at the lens bracket and corresponds to the image sensor through the photosensitive through hole.Type: ApplicationFiled: June 25, 2021Publication date: January 6, 2022Applicant: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITEDInventors: HaiChao DU, JiJi ZHONG, Rui ZHANG
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Publication number: 20210176856Abstract: The present disclosure provides an embedding reinforced circuit board, a camera module, and an electronic device. The embedding reinforced circuit board, comprising a circuit board and a reinforcing plate. The circuit board comprises a first surface and a second surface opposite to the first surface. The first surface is provided with a component installation area. The second surface is provided with an accommodating groove. The width of at least one side of the cross-sectional area of the accommodating groove is wider than the width of the corresponding side of the component installation area. The cross-sectional area of the accommodating groove is parallel to the first surface or the second surface. The reinforcing plate is disposed in the accommodating groove.Type: ApplicationFiled: December 7, 2020Publication date: June 10, 2021Applicant: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITEDInventors: Bo CHEN, HaiChao DU
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Patent number: 10261225Abstract: A filter assembly includes a filter defining a light transmissive region for light of a specific wavelength range to pass therethrough, and a non-light transmissive first sheet body preformed and adhered to a surface of the filter. The first sheet body has a first opening with a shape conforming to that of the light transmissive region.Type: GrantFiled: January 19, 2017Date of Patent: April 16, 2019Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventors: Chun-Lung Lin, Gaowei Xie, Haichao Du
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Publication number: 20180095204Abstract: A filter assembly includes a filter defining a light transmissive region for light of a specific wavelength range to pass therethrough, and a non-light transmissive first sheet body preformed and adhered to a surface of the filter. The first sheet body has a first opening with a shape conforming to that of the light transmissive region.Type: ApplicationFiled: January 19, 2017Publication date: April 5, 2018Inventors: CHUN-LUNG LIN, GAOWEI XIE, HAICHAO DU
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Publication number: 20180077327Abstract: An image sensing module including a substrate, an image sensor, and a light-extinction layer is provided. The image sensor is disposed on the substrate. The light-extinction layer is at least located on at least part of a surface of a reflective body on the substrate and exposes a sensing area of the image sensor. The reflective body is located on a surface of the substrate at a side of the substrate facing the image sensor. A camera module having the image sensing module is also provided.Type: ApplicationFiled: February 17, 2017Publication date: March 15, 2018Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: HaiChao Du, GaoWei Xie, Chun-Lung Lin