Patents by Inventor Hajime FURUTANI

Hajime FURUTANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210011377
    Abstract: A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Requirements 1 to 3, Requirement 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[0]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[0]×16+[F]×19+[S]×32+[I]×127)??Formula (1): Requirement 2: The concentration of solid contents in the photosensitive composition for EUV light is 5.0% by mass or less, Requirement 3: The content of the photoacid generator is 5% to 50% by mass with respect to the total solid content in the photosensitive composition for EUV light.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Michihiro SHIRAKAWA, Hajime FURUTANI, Hironori OKA
  • Publication number: 20200319551
    Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition that can provide a resist film with excellent sensitivity and a pattern with excellent LER performance, and can suppress pattern collapse during pattern formation. In addition, the present invention also provides a resist film, a pattern forming method, a mask blank with a resist film, a method for producing a photomask, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Application
    Filed: June 18, 2020
    Publication date: October 8, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Tomotaka Tsuchimura, Takashi Kawashima, Akihiro Kaneko, Michihiro Ogawa, Michihiro Shirakawa, Hajime Furutani, Kyohei Sakita
  • Publication number: 20200192220
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a repeating unit having a group in which a phenolic hydroxyl group is protected with an acid-leaving group; a first photoacid generator that generates an acid having a pKa of ?2.00 to 2.00, in which in a case where the acid thus generated is a carboxylic acid, a pKa of the carboxylic acid is ?2.00 or more and less than 1.00; and a second photoacid generator that generates a carboxylic acid having a pKa of 1.00 or more.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kazunari YAGI, Takashi KAWASHIMA, Tomotaka TSUCHIMURA, Hajime FURUTANI, Michihiro SHIRAKAWA
  • Publication number: 20200050106
    Abstract: A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Conditions 1 and 2, Condition 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127)??Formula (1): Condition 2: The concentration of the solid content in the photosensitive composition for EUV light is 2.5% by mass or less.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Michihiro SHIRAKAWA, Hajime FURUTANI, Mitsuhiro FUJITA, Tomotaka TSUCHIMURA, Takashi KAWASHIMA, Michihiro OGAWA, Akihiro KANEKO, Hironori OKA, Yasuharu SHIRAISHI
  • Publication number: 20190219922
    Abstract: There is provided a resist composition containing a resin. The resin includes a repeating unit (a) having one or more *—OY0 groups substituted for an aromatic ring; and a phenolic hydroxyl group (b) or a partial structure (c) represented by Formula (X). Here, the *—OY0 group is a group that is decomposed due to an action of an acid to generate a phenolic hydroxyl group, and Y0 is a specific protective group. In a case where the repeating unit (a) includes none of the phenolic hydroxyl group (b) and the partial structure (c), the repeating unit (a) is a repeating unit in which the *—OY0 group is decomposed due to an action of an acid to generate two or more phenolic hydroxyl groups.
    Type: Application
    Filed: March 25, 2019
    Publication date: July 18, 2019
    Applicant: FujiFilm Corporation
    Inventors: Akihiro KANEKO, Shuji Hirano, Takashi Kawashima, Michihiro Ogawa, Hajime Furutani, Wataru Nihashi, Hideaki Tsubaki, Kyohei Sakita
  • Publication number: 20190219921
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin including a repeating unit (a) represented by Formula (1); (B) a compound that generates an acid by irradiation with actinic rays or radiation; and (C) an organic solvent. A concentration of solid contents of the actinic ray-sensitive or radiation-sensitive resin composition is 4 mass % or less. (in the formula, R11 and R12 each independently represent a hydrogen atom, a halogen atom, or a monovalent organic group. R13 represents a hydrogen atom, a halogen atom, or a monovalent organic group or is a single bond or an alkylene group, and is bonded to L or Ar in the formula to form a ring. L represents a single bond or a divalent linking group. Ar represents an aromatic ring group. n represents an integer of 2 or more.
    Type: Application
    Filed: March 28, 2019
    Publication date: July 18, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Hideaki TSUBAKI, Hajime FURUTANI, Akihiro KANEKO, Wataru NIHASHI, Shuji HIRANO
  • Publication number: 20190187558
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition containing a resin and a compound that generates acid due to irradiation with an actinic ray or radiation. The resin includes a repeating unit (a) represented by Formula (I-1) and a repeating unit (b) having a group in which a protective group including a monocyclic ring leaves due to an action of an acid to generate a polar group. (In the formula, R11 and R12 each independently represent a hydrogen atom or an alkyl group. R13 represents a hydrogen atom or an alkyl group, or is a single bond or an alkylene group, and is bonded to L or Ar in the formula to form a ring. L represents a single bond or a divalent linking group. Ar represents an aromatic ring. n represents an integer of 2 or more.
    Type: Application
    Filed: February 26, 2019
    Publication date: June 20, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Wataru NIHASHI, Hajime Furutani, Akihiro Kaneko, Hideaki Tsubaki, Shuji Hirano
  • Patent number: 10303058
    Abstract: A pattern forming method includes, in this order: a step (1) of forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing at least a resin having a group that is decomposed due to an action of an acid so as to generate a polar group; a step (2) of exposing the film; a step (3) of causing the exposed film to come into contact with a component that performs any one interaction of an ionic bond, a hydrogen bond, a chemical bond, and a dipole interaction with a polar group generated in the exposed film without substantially dissolving the exposed film; and a step (4) of forming a pattern by developing the exposed film by using a developer including an organic solvent and removing an area of the film having a small exposure amount.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 28, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Hajime Furutani, Michihiro Shirakawa, Akiyoshi Goto, Masafumi Kojima
  • Publication number: 20170059995
    Abstract: A pattern forming method includes a pattern forming method using an actinic ray-sensitive or radiation-sensitive resin composition in which ?Dth represented by the following Formula (1) satisfies 0.8 or more (in the formula, Dth(PTI) represents the threshold deprotection rate of the acid-decomposable group with respect to the film thickness of the actinic ray-sensitive or radiation-sensitive film after development using the alkali developer, and Dth(NTI) represents the threshold deprotection rate of the acid-decomposable group with respect to the film thickness of the actinic ray-sensitive or radiation-sensitive film after development using the developer including an organic solvent).
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Applicant: FUJIFILM Corporation
    Inventors: Hajime FURUTANI, Akiyoshi GOTO, Michihiro SHIRAKAWA, Masahiro YOSHIDOME, Masafumi KOJIMA
  • Patent number: 9523912
    Abstract: There is provided a pattern forming method comprising (i) a step of forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the specific formula, (B) a compound different from the compound (A) and capable of generating an acid upon irradiation with an actinic ray or radiation, and (P) a resin that does not react with the acid generated from the compound (A) and is capable of decreasing the solubility for an organic solvent-containing developer by the action of the acid generated from the compound (B), (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern; the actinic ray-sensitive or radiation-sensitive resin composition above; a resist film using the composition.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: December 20, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Shohei Kataoka, Akinori Shibuya, Toshiaki Fukuhara, Hajime Furutani, Michihiro Shirakawa
  • Publication number: 20160327866
    Abstract: A pattern forming method includes, in this order: a step (1) of forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing at least a resin having a group that is decomposed due to an action of an acid so as to generate a polar group; a step (2) of exposing the film; a step (3) of causing the exposed film to come into contact with a component that performs any one interaction of an ionic bond, a hydrogen bond, a chemical bond, and a dipole interaction with a polar group generated in the exposed film without substantially dissolving the exposed film; and a step (4) of forming a pattern by developing the exposed film by using a developer including an organic solvent and removing an area of the film having a small exposure amount.
    Type: Application
    Filed: July 22, 2016
    Publication date: November 10, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Hajime FURUTANI, Michihiro SHIRAKAWA, Akiyoshi GOTO, Masafumi KOJIMA
  • Publication number: 20160195814
    Abstract: There is provided a pattern formation method comprising: a step (1) of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition which contains a resin of which, due to a polarity being increased by an action of an acid, solubility decreases with respect to a developer which includes an organic solvent; a step (2) of exposing the film to an actinic ray or radiation; a step (3) of forming a target process pattern by developing the film using a developer which includes an organic solvent; and a step (4) of obtaining a processed pattern by applying a processing agent which includes a compound (x) which has at least one of a primary amino group and a secondary amino group with respect to the target process pattern.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 7, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Yuichiro ENOMOTO, Ryosuke UEBA, Michihiro SHIRAKAWA, Hajime FURUTANI, Akiyoshi GOTO, Masafumi KOJIMA
  • Publication number: 20160070167
    Abstract: There is provided a pattern forming method comprising (i) a step of forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the specific formula, (B) a compound different from the compound (A) and capable of generating an acid upon irradiation with an actinic ray or radiation, and (P) a resin that does not react with the acid generated from the compound (A) and is capable of decreasing the solubility for an organic solvent-containing developer by the action of the acid generated from the compound (B), (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern; the actinic ray-sensitive or radiation-sensitive resin composition above; a resist film using the composition.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 10, 2016
    Applicant: FUJIFILM CORPORATION
    Inventors: Shohei KATAOKA, Akinori SHIBUYA, Toshiaki FUKUHARA, Hajime FURUTANI, Michihiro SHIRAKAWA
  • Publication number: 20160048082
    Abstract: A pattern-forming method includes forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing at least a resin that exhibits, due to an action of an acid, increase in polarity and decrease in solubility with respect to a developer including an organic solvent, and a compound that generates an acid by being irradiated with actinic rays or radiation; exposing the film; and forming a negative tone pattern by developing the exposed film with a developer including an organic solvent, in which the developer includes at least one compound A selected from the group consisting of an onium salt, a polymer having an onium salt, a nitrogen-containing compound including three or more nitrogen atoms, a basic polymer, and a phosphorus-based compound.
    Type: Application
    Filed: October 21, 2015
    Publication date: February 18, 2016
    Applicant: FUJIFILM CORPORATION
    Inventors: Masafumi KOJIMA, Akiyoshi GOTO, Michihiro SHIRAKAWA, Hajime FURUTANI, Akinori SHIBUYA
  • Publication number: 20150331314
    Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a group capable of decomposing by an action of an acid to produce a polar group, (C1) a compound containing a group capable of generating a first acidic functional group upon irradiation with an actinic ray or radiation and a group capable of generating a second acidic functional group different from the first acidic functional group upon irradiation with an actinic ray or radiation, and (C2) at least one compound containing two or more groups selected from the group consisting of the groups capable of generating the structures represented by the specific formulae upon irradiation with an actinic ray or radiation.
    Type: Application
    Filed: July 29, 2015
    Publication date: November 19, 2015
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuhei YAMAGUCHI, Takamitsu TOMIGA, Fumihiro YOSHINO, Hajime FURUTANI, Michihiro SHIRAKAWA, Mitsuhiro FUJITA