Patents by Inventor Hajime Furuya
Hajime Furuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9694572Abstract: Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The second holding unit includes: a body portion configured to vacuum-draw the entire surface of the second substrate; a plurality of pins installed on the body portion and configured to make contact with a rear surface of the second substrate; and a support portion installed on the body portion at the outer side of the pins, the support portion having a reduced contact area over which the support portion makes contact with an outer peripheral portion of the second substrate.Type: GrantFiled: November 4, 2014Date of Patent: July 4, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Shintaro Sugihara, Hajime Furuya, Goro Furutani, Yasunobu Iwamoto
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Patent number: 9263312Abstract: A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.Type: GrantFiled: September 13, 2012Date of Patent: February 16, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Michikazu Nakamura, Masahiko Sugiyama, Hajime Furuya, Naoki Akiyama, Yosuke Omori
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Patent number: 9263268Abstract: A joining device for joining substrates with an intermolecular force includes a first holding unit configured to hold a first substrate on a lower surface thereof, a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof, and a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.Type: GrantFiled: May 19, 2014Date of Patent: February 16, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Masahiro Yamamoto, Shintaro Sugihara, Hajime Furuya
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Publication number: 20150129137Abstract: Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The second holding unit includes: a body portion configured to vacuum-draw the entire surface of the second substrate; a plurality of pins installed on the body portion and configured to make contact with a rear surface of the second substrate; and a support portion installed on the body portion at the outer side of the pins, the support portion having a reduced contact area over which the support portion makes contact with an outer peripheral portion of the second substrate.Type: ApplicationFiled: November 4, 2014Publication date: May 14, 2015Inventors: Shintaro SUGIHARA, Hajime FURUYA, Goro FURUTANI, Yasunobu IWAMOTO
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Publication number: 20140349465Abstract: A joining device for joining substrates with an intermolecular force includes a first holding unit configured to hold a first substrate on a lower surface thereof, a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof, and a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.Type: ApplicationFiled: May 19, 2014Publication date: November 27, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Masahiro YAMAMOTO, Shintaro SUGIHARA, Hajime FURUYA
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Publication number: 20140311653Abstract: A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.Type: ApplicationFiled: September 13, 2012Publication date: October 23, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Michikazu Nakamura, Masahiko Sugiyama, Hajime Furuya, Naoki Akiyama, Yosuke Omori
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Patent number: 8210417Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.Type: GrantFiled: October 18, 2011Date of Patent: July 3, 2012Assignee: Tokyo Electron LimitedInventors: Naoki Akiyama, Masahiko Sugiyama, Hajime Furuya
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Publication number: 20120091186Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.Type: ApplicationFiled: October 18, 2011Publication date: April 19, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Naoki AKIYAMA, Masahiko SUGIYAMA, Hajime FURUYA
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Patent number: 7827931Abstract: A plasma processor electrode includes a support member disposed to face to an electrode that holds a substrate to be treated, an electrode plate fixed to the support member and equipped with gas injection holes and a screw hole open and facing to the support member to supply a processing gas through the gas discharge hole into a processing space formed between the electrode plate and the electrode to generate a plasma in the processing space, and a fastening unit that clamps the electrode plate on the support member by fastening the electrode plate to the support member with a screw driven into the screw hole from the support member.Type: GrantFiled: March 27, 2003Date of Patent: November 9, 2010Assignee: Tokyo Electron LimitedInventors: Keiichi Matsushima, Takashi Suzuki, Hajime Furuya
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Patent number: 7231321Abstract: A method of resetting a substrate processing apparatus having a chamber which is capable of carrying out abnormality judgment on the substrate processing apparatus accurately without causing a decrease in the utilization ratio of the substrate processing apparatus. The chamber is evacuated. A temperature in the chamber is set. Whether or not there is an abnormality in the chamber is judged. An atmosphere in the chamber is stabilized so as to conform to predetermined processing conditions. At least one selected from data that change in response to a change in a state inside the chamber is measured. The measured data is compared with reference data that corresponds to the measured data for a normal state in the chamber.Type: GrantFiled: November 10, 2005Date of Patent: June 12, 2007Assignee: Tokyo Electron LimitedInventors: Hajime Furuya, Hideki Tanaka, Tomoya Okubo, Ryoko Kobayashi
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Publication number: 20060100825Abstract: A method of resetting a substrate processing apparatus having a chamber which is capable of carrying out abnormality judgment on the substrate processing apparatus accurately without causing a decrease in the utilization ratio of the substrate processing apparatus. The chamber is evacuated. A temperature in the chamber is set. Whether or not there is an abnormality in the chamber is judged. An atmosphere in the chamber is stabilized so as to conform to predetermined processing conditions. At least one selected from data that change in response to a change in a state inside the chamber is measured. The measured data is compared with reference data that corresponds to the measured data for a normal state in the chamber.Type: ApplicationFiled: November 10, 2005Publication date: May 11, 2006Applicant: TOKYO ELECTRON LIMITEDInventors: Hajime Furuya, Hideki Tanaka, Tomoya Okubo, Ryoko Kobayashi
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Publication number: 20050145336Abstract: A plasma processor electrode includes a support member disposed to face to an electrode that holds a substrate to be treated, an electrode plate fixed to the support member and equipped with gas injection holes and a screw hole open and facing to the support member to supply a processing gas through the gas discharge hole into a processing space formed between the electrode plate and the electrode to generate a plasma in the processing space, and a fastening unit that clamps the electrode plate on the support member by fastening the electrode plate to the support member with a screw driven into the screw hole from the support member.Type: ApplicationFiled: March 27, 2003Publication date: July 7, 2005Applicant: TOKYO ELECTRON LIMITEDInventors: Keiichi Matsushima, Takashi Suzuki, Hajime Furuya