Abstract: A hardfacing alloy satisfies the following condition when the hardfacing alloy as a whole is 100 mass % (also simply referred to as “%,” hereinafter), Ni: 10-25%, Si: 1-3%, Fe: 3-18%, the total of one or more elements of Mo, W, and Nb: 6.5-20%, and the balance: Cu and impurities. In particular, it preferably satisfies Fe+2Mo?22.6(%), Mo equivalent/Fe?1.17, and Mo equivalent=Mo+0.522W+1.033Nb. In a hardfacing part composed of the hardfacing alloy, coarse hard particles are formed to ensure the wear resistance, and a soft phase present in the hard particles ensures the machinability. This may be understood as a raw material powder for hardfacing treatment and may also be understood as a hardfacing member in which a hardfacing part is formed on a base material using the raw material powder.

Abstract: A processing system for bone-in limb meats according to an embodiment includes: a right-limb incision-forming portion for forming incision on a right bone-in limb meat; a left-limb incision-forming portion for forming incision on a left bone-in limb meat; a processing line including a plurality of processing stations to separate a bone part and a meat part of each bone-in limb meat on which incision is formed at the right-limb incision-forming portion or the left-limb incision-forming portion; and a loading portion arranged at an uppermost stream part of the processing line to receive the right bone-in limb meat with incision formed at the right-limb incision-forming portion and the left bone-in limb meat with incision formed at the left-limb incision-forming portion.

Abstract: First, a reaction gas is supplied to a fuel cell stack including a laminate of solid polymer electrolyte fuel cells and power generation is performed so that a temperature of the fuel cell stack reaches 65° C. or higher (heating power generation step). Next, the reaction gas is supplied to the fuel cell stack and the power generation is performed under a condition in which relative humidity is 100% or more (cleaning power generation step). Cooling water of room temperature may be supplied to the fuel cell stack from the outside before the cleaning power generation step is performed after the heating power generation step is completed, or after the cleaning power generation step is completed (quenching step).

Abstract: An objective of the present disclosure is to provide a stacked battery that suppresses sneak current caused by an unevenness of a short circuit resistance among a plurality of cells. The present disclosure provides a stacked battery comprising: a plurality of cells in a thickness direction, wherein the plurality of cells are electrically connected in parallel; the stacked battery includes a surface-side cell that is located on a surface side of the stacked battery, and a center-side cell that is located on a center side rather than the surface-side cell; wherein a resistance of the cathode current collecting tab in the surface-side cell is more than a resistance of the cathode current collecting tab in the center-side cell; or a resistance of the anode current collecting tab in the surface-side cell is more than a resistance of the anode current collecting tab in the center-side cell.

Abstract: A connector includes a plurality of conductors, a magnetic core, and a housing, the housing includes a housing member that is provided with a housing chamber that houses the plurality of conductors and the magnetic core, an abutment surface on which a core assembling portion abuts, and an opening that is arranged to face the abutment surface at an interval and exposes the core assembling portion housed in the housing chamber outward, the core assembling portion being composed of the respective intermediate portions of the plurality of conductors and the magnetic core housed in the housing chamber; a cover member that closes the opening; and a pressing member that is sandwiched between the cover member and the core assembling portion by pressing the core assembling portion to push the core assembling portion against the abutment surface when the housing member and the cover member are in an assembled state.

Abstract: An electronic component includes an element body, a conductor, and a plated electrode layer. The element body includes a first outer surface provided with a first recess. The conductor includes a first conductor portion. The first conductor portion is disposed in the first recess and includes a first face opposed to a bottom face of the first recess and a second face opposed to the first face. The plated electrode layer includes a first plating portion covering the second face. The second face includes a first slope inclined with respect to the first outer surface in such a way as to be recessed toward the bottom face side of the first recess from the first outer surface.

Abstract: A pair of terminal electrodes 4 and 5 have electrode parts 4a and 5a and electrode parts 4b and 5b when viewed from a stacking direction, respectively. A plurality of connection conductors are disposed at positions not overlapping a plurality of coil conductors when viewed from the stacking direction. At least two of the plurality of connection conductors are disposed in a first region A1 or a second region A2 between the terminal electrodes 4 and 5 and an outer edge 9a of a coil 9 when viewed from the stacking direction. The first region A1 and the second region A2 overlap the electrode parts 4a and 5a when viewed from the facing direction of a pair of end surfaces 2a and 2b and overlap the electrode parts 4b and 5b when viewed from the facing direction of a pair of main surfaces 2c and 2d.

Abstract: A connector which can improve reliability of electrical connection is provided. Accommodation recesses are formed to a plate-like terminal member, and a coil member accommodated in the accommodation recesses is retained to the terminal member, thereby allowing wire winding portions of the coil member to be deformed within the accommodation recesses when the winding wire portions are sandwiched between bottom faces of the accommodation recesses and a mating terminal. Consequently, the obliquely wound coil member is not likely to experience deformation other than fall over of ring portions, and/or is not likely to be displaced, improving contact between the coil member and both of the terminal member and the mating terminal. As a result, reliability of electrical connection can be improved.

Abstract: A multilayer coil component 1 includes an element body 2 having a plurality of stacked insulator layers 6 and having an outer surface provided with recessed portions 7 and 8, a coil 9 disposed in the element body 2, and terminal electrodes 4 and 5 connected to the coil 9 and disposed in the recessed portions 7 and 8. The recessed portions 7 and 8 are defined by a bottom surface and a side surface extending in a depth direction of the recessed portions 7 and 8 over the outer surface and the bottom surface, the terminal electrodes 4 and 5 have a first surface facing the bottom surface and a second surface facing the side surface, and a connection region A where a compound of elements constituting the element body 2 and a metal component are mixed is exposed to the second surface.

Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.

Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.

Abstract: An electrical contact point including: a first contact and a second contact capable of forming an electrical contact each other, wherein: the first contact includes an alloy containing layer having alloy parts made of an alloy containing tin and palladium and a tin part made of tin or an alloy having a higher ratio of tin to palladium than the alloy parts with both the alloy parts and the tin part exposed on an outermost surface; and the second contact includes a dissimilar metal layer made of metal having a higher hardness than the alloy containing layer and containing neither tin nor palladium on an outermost surface.

Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.

Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.

Abstract: A connector includes a plurality of conductors, a magnetic core, and a housing, the housing includes a housing member that is provided with a housing chamber that houses the plurality of conductors and the magnetic core, an abutment surface on which a core assembling portion abuts, and an opening that is arranged to face the abutment surface at an interval and exposes the core assembling portion housed in the housing chamber outward, the core assembling portion being composed of the respective intermediate portions of the plurality of conductors and the magnetic core housed in the housing chamber; a cover member that closes the opening; and a pressing member that is sandwiched between the cover member and the core assembling portion by pressing the core assembling portion to push the core assembling portion against the abutment surface when the housing member and the cover member are in an assembled state.

Abstract: An information processing apparatus includes an interface, a first load device, a battery, a controller, and a plurality of power transmission paths including first to third power transmission paths, wherein the controller is configured to start up the controller with power having a first power amount from an external device via the interface, request a second power amount greater than the first power amount to the external device, determine whether it is possible to receive power supply of the second power amount from the external device, supply power to the first load device via the second power transmission path to start up the first load device, and supply the power to the battery via the third power transmission path.

Abstract: A bonded structure may be formed by measuring die areas of first semiconductor dies on a wafer at a measurement temperature, generating a two-dimensional map of local target temperatures that are estimated to thermally adjust a die area of each of the first semiconductor dies to a target die area, loading the wafer to a bonding apparatus comprising at least one temperature sensor, and iteratively bonding a plurality of second semiconductor dies to a respective one of the first semiconductor dies by sequentially adjusting a temperature of the wafer to a local target temperature of a respective first semiconductor die that is bonded to a respective one of the second semiconductor dies. An apparatus for forming such a bonded structure may include a computer, a chuck for holding the wafer, a die attachment unit, and a temperature control mechanism.

Abstract: An imaging device which has a stacked-layer structure and can be manufactured easily is provided. The imaging device includes a signal processing circuit, a memory device, and an image sensor. The imaging device has a stacked-layer structure in which the memory device is provided above the signal processing circuit, and the image sensor is provided above the memory device. The signal processing circuit includes a transistor formed on a first semiconductor substrate, the memory device includes a transistor including a metal oxide in a channel formation region, and the image sensor includes a transistor formed on a second semiconductor substrate.

Abstract: A wavelength dispersive X-ray fluorescence spectrometer of the present invention includes: a position sensitive detector (10) configured to detect intensities of secondary X-rays (41) at different spectral angles, by using detection elements (7) corresponding to the secondary X-rays (41) at different spectral angles; a measured spectrum display unit (14) configured to display a relationship between a position, in an arrangement direction, of each detection element (7), and a detected intensity by the detection element (7), as a measured spectrum, on a display (15); a detection area setting unit (16) configured to be set a peak area and a background area; and a quantification unit (17) configured to calculate, as a net intensity, an intensity of the fluorescent X-rays to be measured, based on a peak intensity in the peak area, a background intensity in the background area, and a background correction coefficient, and to perform quantitative analysis.

Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.