Patents by Inventor Hajime Nishi

Hajime Nishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120129
    Abstract: Provided is an insulated wire that can inhibit a decrease in adhesion between an insulation film including pores and a conductor. The insulated wire comprises a conductor having a long shape, and an insulation film including multiple pores and covering the conductor. The opening area ratio SR measured by a method below is 20% or less. The method of measuring the opening area ratio SR:peeling the insulation film from the conductor; obtaining a SEM image showing an interface on a conductor side in the insulation film peeled; calculating an area S1 of an observation region that is at least a part of the SEM image; and an area S2 of portions where the multiple pores are open in the observation region; and calculating the opening area ratio SR by the following Formula (1). SR=(S2/S1)×100.
    Type: Application
    Filed: September 22, 2023
    Publication date: April 11, 2024
    Inventors: Takami USHIWATA, Ikumi ANDO, Hajime NISHI
  • Publication number: 20240029923
    Abstract: An insulated wire includes a conductor having an elongated shape and an insulating coating. The insulating coating is provided around the conductor. The insulating coating is formed by laminating multiple insulating layers, each of which includes pores.
    Type: Application
    Filed: July 17, 2023
    Publication date: January 25, 2024
    Inventors: Hajime NISHI, Takami USHIWATA, Yuki HONDA
  • Publication number: 20230099568
    Abstract: An insulated electrical wire is provided. The insulated electrical wire includes a conductor and an insulating film including pores. The insulating film at least includes a first insulating layer. The first insulating layer includes a first center region, a first inner side region, and a first outer side region. The first center region is a center region in the first insulating layer in a thickness direction and is formed of an insulating material and first pores that are the pores. The first pores are derived from a liquid thermally decomposable polymer. The first inner side region and the first outer side region are formed not to include the first pores.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 30, 2023
    Inventors: Hajime NISHI, Ikumi ANDO, Takami USHIWATA, Yuki HONDA
  • Publication number: 20220165458
    Abstract: In an insulated wire including a conductor formed into a long shape and an insulation film formed by stacking at least one insulating layer covering a circumference of the conductor, the insulating layer includes a porous region and a resin region. The porous region is formed of a resin and multiple voids, and the resin region is formed of the resin. In the insulating layer, a boundary surface is not provided between a first boundary surface located on a radially inner side and a second boundary surface located on a radially outer side, and the porous region and the resin region are arranged in this order from the first boundary surface toward the second boundary surface.
    Type: Application
    Filed: November 22, 2021
    Publication date: May 26, 2022
    Inventors: Takami USHIWATA, Hajime NISHI, Ikumi ANDO, Yuki HONDA
  • Publication number: 20160133760
    Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material. The thickness of the oxide film on a surface to the molten solder plate layer is suppressed to be not more than 7 nm.
    Type: Application
    Filed: January 15, 2016
    Publication date: May 12, 2016
    Inventors: Hajime NISHI, Yuju ENDO, Ken TAKAHASHI, Hiromitsu KURODA, Hiroyuki AKUTSU, Katsunori SAWAHATA, Hiroshi BANDO, Iku HIGASHIDANI, Hiroshi OKIKAWA
  • Patent number: 9279176
    Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer on the surface of the molten solder plated layer, is not more than 7 nm.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: March 8, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Ken Takahashi, Hiromitsu Kuroda, Hiroyuki Akutsu, Katsunori Sawahata, Hiroshi Bando, Iku Higashidani, Hiroshi Okikawa
  • Patent number: 9174541
    Abstract: A halogen-free extra-high-voltage cable for railway rolling stock includes a stranded conductor, an inner semi-conducting layer covering the stranded conductor, an outer semi-conducting layer provided on an outer periphery of the inner semi-conducting layer via an insulation layer, and a sheath layer on an outer periphery of the outer semi-conducting layer, the sheath layer containing 80 to 200 parts by weight of metal hydroxide and 0.5 to 10 parts by weight of cross-linking agent with respect to 100 parts by weight of olefin-based polymer containing ethylene-vinyl acetate copolymer as a main component, the ethylene-vinyl acetate copolymer having a vinyl acetate content of not less than 40 wt % and less than 50 wt % and a melt flow rate of not more than 2.5 g/10 min and a resin composition is cross-linked.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: November 3, 2015
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hajime Nishi, Motoharu Kajiyama, Yoshiaki Nakamura, Kentaro Segawa, Takayuki Tanaka
  • Publication number: 20140290976
    Abstract: A halogen-free extra-high-voltage cable for railway rolling stock includes a stranded conductor, an inner semi-conducting layer covering the stranded conductor, an outer semi-conducting layer provided on an outer periphery of the inner semi-conducting layer via an insulation layer, and a sheath layer on an outer periphery of the outer semi-conducting layer, the sheath layer containing 80 to 200 parts by weight of metal hydroxide and 0.5 to 10 parts by weight of cross-linking agent with respect to 100 parts by weight of olefin-based polymer containing ethylene-vinyl acetate copolymer as a main component, the ethylene-vinyl acetate copolymer having a vinyl acetate content of not less than 40 wt % and less than 50 wt % and a melt flow rate of not more than 2.5 g/10 min and a resin composition is cross-linked.
    Type: Application
    Filed: February 26, 2014
    Publication date: October 2, 2014
    Applicant: Hitachi Metals, Ltd.
    Inventors: Hajime NISHI, Motoharu KAJIYAMA, Yoshiaki NAKAMURA, Kentaro SEGAWA, Takayuki TANAKA
  • Publication number: 20140141241
    Abstract: A halogen-free heat aging-resistant flame-retardant resin compound includes a mixture of 100 parts by mass of polyolefin-based resin, 100 to 250 parts by mass of metal hydroxide, and 2 to 5 parts by mass of an antioxidant including a first antioxidant having a melting point of not less than 200 degrees Celsius and a mean particle diameter of not greater than 10 ?m solely or a combination with a second antioxidant, and the mixture is cross-linked.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 22, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Hajime NISHI, Kenichiro FUJIMOTO, Kentaro SEGAWA, Yoshiaki NAKAMURA
  • Patent number: 8653380
    Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: February 18, 2014
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Ken Takahashi, Hiromitsu Kuroda, Hiroshi Okikawa, Kuniaki Kimoto, Hiroyuki Akutsu, Yukio Ito, Iku Higashidani
  • Patent number: 8143525
    Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: March 27, 2012
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Bando, Iku Higashidani, Katsunori Sawahata, Yukio Ito, Hiroshi Okikawa
  • Patent number: 8138606
    Abstract: A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn and the oxidation control element is diffused to form an alloy.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: March 20, 2012
    Assignee: Hitachi Cable, Ltd.
    Inventors: Takayuki Tsuji, Hiroshi Yamanobe, Hajime Nishi, Takeshi Usami, Seigi Aoyama, Masato Ito, Hiroshi Okikawa
  • Publication number: 20110220196
    Abstract: Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire (10) has a band plate-shaped electroconductive material (12) that is formed with straight-angled cross-sectional shape and is covered by a molten solder plating layer (13), with the thickness of the oxide film on the surface of the molten solder plating layer (13) being 7 nm or less.
    Type: Application
    Filed: November 20, 2009
    Publication date: September 15, 2011
    Inventors: Hajime Nishi, Yuju Endo, Ken Takahashi, Hiromitsu Kuroda, Hiroyuki Akutsu, Katsunori Sawahata, Hiroshi Bando, Iku Higashidani, Hiroshi Okikawa
  • Publication number: 20100218981
    Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.
    Type: Application
    Filed: February 26, 2010
    Publication date: September 2, 2010
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Ken Takahashi, Hiromitsu Kuroda, Hiroshi Okikawa, Kuniaki Kimoto, Hiroyuki Akutsu, Yukio Ito, Iku Higashidani
  • Publication number: 20090260689
    Abstract: A solar cell lead wire includes a conducting material, and a molten solder plated layer formed on the conducting material. The conducting material includes a concave-convex conducting material that includes a concavity on top and under surfaces thereof, respectively, and a convexity on a side surface thereof, and that is formed by die processing a strip-shaped conducting material, and the molten solder plated layer comprises a flat surface formed by supplying a molten solder to the concavity of the concave-convex conducting material.
    Type: Application
    Filed: April 7, 2009
    Publication date: October 22, 2009
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Okikawa
  • Publication number: 20090255710
    Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.
    Type: Application
    Filed: December 16, 2008
    Publication date: October 15, 2009
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Bando, Iku Higashidani, Katsunori Sawahata, Yukio Ito, Hiroshi Okikawa
  • Patent number: 7568959
    Abstract: A metallic material is rolled to provide a conductor 3 having a rectangular cross section. A surface of the rectangular conductor 3 is plated with a plating layer 14. A thickness of the plating layer 14 at a surface facing to the Si cell is not more than 5 ?m to provide a connecting lead wire 12 for a solar battery. The connecting lead wire 12 for a solar battery has 0.2% proof stress of not more than 60 MPa. The connecting lead wire 12 for a solar battery is connected to a predetermined contact region of a Si cell 1 of a solar battery at a high temperature.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: August 4, 2009
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine Tech, Ltd.
    Inventors: Hajime Nishi, Takayuki Tsuji, Yuju Endo, Hiroyuki Akutsu
  • Publication number: 20080076307
    Abstract: A metallic material is rolled to provide a conductor 3 having a rectangular cross section. A surface of the rectangular conductor 3 is plated with a plating layer 14. A thickness of the plating layer 14 at a surface facing to the Si cell is not more than 5 ?m to provide a connecting lead wire 12 for a solar battery. The connecting lead wire 12 for a solar battery has 0.2% proof stress of not more than 60 MPa. The connecting lead wire 12 for a solar battery is connected to a predetermined contact region of a Si cell 1 of a solar battery at a high temperature.
    Type: Application
    Filed: September 12, 2007
    Publication date: March 27, 2008
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine Tech, Ltd.
    Inventors: Hajime Nishi, Takayuki Tsuji, Yuju Endo, Hiroyuki Akutsu
  • Publication number: 20080011347
    Abstract: A connecting lead wire is used for a solar battery module in which a plurality of solar battery cells connected in series by an inter-connector are arranged. The connecting lead wire is provided with a trunk portion and one or more branch portions. In the trunk portion, an enamel coating layer is provided on a conductor. In each of the branch portions, a solder plating layer is provided on a conductor. The branch portion protrudes from the trunk portion in a lateral direction, and connected to an electrode of each of the solar battery cells. The branch portion connects the solar battery cells with each other.
    Type: Application
    Filed: July 12, 2007
    Publication date: January 17, 2008
    Inventors: Seigi Aoyama, Takayuki Tsuji, Hiroshi Okikawa, Hajime Nishi
  • Publication number: 20070295528
    Abstract: A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of a surface the wiring conductor, and the Sn-based material part includes a base metal doped with a transformation retardant element and an oxidation control element. The transformation retardant element is at least one element selected from a group consisted of Sb, Bi, Cd, In, Ag, Au, Ni, Ti, Zr, and Hf. The oxidation control element is at least one element selected from a group consisted of Ge, P, Zn, Kr, Cr, Mn, Na, V, Si, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn, the transformation retardant element and the oxidation control element is diffused to form an alloy.
    Type: Application
    Filed: June 4, 2007
    Publication date: December 27, 2007
    Applicant: HITACHI CABLE, LTD.
    Inventors: Hajime Nishi, Takayuki Tsuji, Hiroshi Yamanobe, Hiroshi Okikawa