Abstract: The present invention is a method for mounting, on a ceramic substrate (9), an LED chip (1), in which an upper surface of a positive electrode (6) is in a higher position than an upper surface of a negative electrode (5). The method includes the steps of: (i) laminating resist (16) on the negative electrode (5) and the positive electrode (6) and forming openings (16a and 16b) in the resist (16); (ii) forming bumps (11 and 12) in the respective openings (16a and 16b); (iii) removing the resist (16); and (iv) bonding bumps (11 and 12) to the ceramic substrate (9). A cross-sectional area of the opening (16a) is larger than a cross-sectional area of the opening (16b).

Abstract: The present invention is a method for mounting, on a ceramic substrate (9), an LED chip (1), in which an upper surface of a positive electrode (6) is in a higher position than an upper surface of a negative electrode (5). The method includes the steps of: (i) laminating resist (16) on the negative electrode (5) and the positive electrode (6) and forming openings (16a and 16b) in the resist (16); (ii) forming bumps (11 and 12) in the respective openings (16a and 16b); (iii) removing the resist (16); and (iv) bonding bumps (11 and 12) to the ceramic substrate (9). A cross-sectional area of the opening (16a) is larger than a cross-sectional area of the opening (16b).

Abstract: A method for manufacturing a solid-state pickup device module of the present invention includes: a step of processing a transparent substrate so that each of transparent substrates for a chip is held opposite to each of solid-state image pickup devices when the transparent substrate and a substrate having a plurality of solid-state image pickup devices are opposed to each other (step of processing a transparent substrate; S1 to S17); and a modularizing step in which the transparent substrate thus processed and the substrate having a plurality of solid-state image pickup devices are opposed to each other so as to place each of the transparent substrates for a chip opposite to each of the solid-state image pickup devices (modularizing step; S21 to S28). Thus, the present invention can improve manufacturing efficiency by bonding the transparent substrate and the substrate having a plurality of solid-state image pickup devices at a time.

Abstract: A method of manufacturing a semiconductor device can suppress the generation of burrs when an array of integrated circuits to which a supporting member is bonded for assistance is separated into chips. The supporting member having thinned regions (or void regions which are openings in the supporting member) located correspondingly beneath the scribing lines extending between the integrated circuits is bonded by an adhesive to the back side of a semiconductor substrate on which integrated circuits are arrayed at the primary side. Then, a dicing tape is attached to the support member to secure the entire assembly, and the assembly of the integrated circuits, the semiconductor substrate, the adhesive, and the supporting member are cut along the scribing lines, and then the dicing tape is removed.

Abstract: A method of manufacturing a semiconductor device can suppress the generation of burrs when an array of integrated circuits to which a supporting member is bonded for assistance is separated into chips. The supporting member having thinned regions (or void regions which are openings in the supporting member) located correspondingly beneath the scribing lines extending between the integrated circuits is bonded by an adhesive to the back side of a semiconductor substrate on which integrated circuits are arrayed at the primary side. Then, a dicing tape is attached to the support member to secure the entire assembly, and the assembly of the integrated circuits, the semiconductor substrate, the adhesive, and the supporting member are cut along the scribing lines, and then the dicing tape is removed.

Abstract: There is disclosed a power-saving sensor system such as a distance measurement sensor making use of light projection type triangulation. The sensor system has a sensor means and a CPU for controlling the supply of electrical power to the sensor means, accepting the output from the sensor means, and performing desired processing. The CPU turns on signals P1, P2, P3 in response to a trigger signal Tp from a timer circuit, thus supplying electrical power to a distance measurement module. A distance measurement IC within the module produces an emission signal when the operating signal P3 is turned on. This activates the sensor means to perform a measurement of a distance. The presence or absence of an object is determined from the detected distance value. According to the presence or absence, a transistor Tr2 is turned on or off. A signal indicating the distance or the presence or absence of an object is produced from a terminal T8.

Abstract: A plating processing device is so arranged that at least a part of a portion touching plating liquid is made of a material whose change rate of surface roughness in response to a removing agent is lower than resin when the material and the resin are measured in the same conditions. For example, a storage tank (1), a plating processing tank (2), a buffer tank (3), and a pipe (9) are made of hard glass and quartz glass. With this, it is possible to prevent a plating material from being deposited as foreign body on wall surfaces of the plating processing tank, etc.

Abstract: Display device designed to prevent surroundings from being adversely affected by noise includes an inner circuit board on which a support frame is mounted in a specific position. A liquid crystal panel is mounted on the support frame and held stationary by a frame. An EL panel for illuminating the liquid crystal panel is mounted behind the liquid crystal panel. An EL circuit board holding an EL driver circuit thereon is bonded to the bottom surface of the EL panel. A shielding plate is mounted on a top surface of the inner circuit board surrounded by the support frame, and is located opposite the EL panel. The shielding plate cuts off noise generated by the EL driver circuit. The EL panel is connected with electrodes on the EL circuit board via lead wires. An electrode on the EL circuit board and an electrode on the circuit board are connected via a contact member. Electric power and control signals are supplied via this contact member.

Abstract: To prevent temporary reduction of battery voltage when driving a shutter, an exposure control drive apparatus is provided with a boosting circuit for boosting a voltage of the battery and outputting a boosted voltage. A capacitor is charged by the boosted voltage for driving an actuator of an exposure control mechanism. A detecting circuit detects a current flowing in the boosting circuit and a control circuit controls operation of the boosting circuit in accordance with a magnitude of the detected value so that the boosting circuit is prevented from boosting the battery voltage when the detected current exceeds a predetermined level and is permitted to boost the battery voltage when the detected current is below the predetermined level. In this manner, the current flowing from the battery is prevented from exceeding a maximum level.

Abstract: It is possible to enhance accuracy in photometry measurements without an increase in unnecessary actual measurement data and design value data in the case where on a low ambient luminance side, an output of a first light sensor, which receives light collected from a large area, is linear and an output of a second light sensor, which receives light collected from a small area, is non-linear. The number of luminance measurement points used for performing measurement with the second light sensor is set at low ambient luminance values to be larger than the number of luminance measurement points used for performing measurements with the first light sensor.

Abstract: There is disclosed a display device designed to cut off noise to prevent the surroundings from being adversely affected by noise. The display device has a circuit board on which a support frame is mounted in a given position. A liquid crystal panel is mounted on the support frame and made stationary by a holddown frame. An EL panel for illuminating the liquid crystal panel is mounted behind the liquid crystal panel with a given gap with the EL panel. An EL circuit board holding an EL driver circuit thereon is adhesively bonded to the bottom surface of the EL panel. A shielding plate is mounted on the top surface of the inner circuit board surrounded by the support frame, and is located opposite to the EL panel. The shielding plate consists of a flexible plastic film on which a copper foil is formed. The shielding plate cuts off noise generated from the EL driver circuit. The EL panel is connected with given electrodes on the EL circuit board via lead wires.

Abstract: It is possible to enhance accuracy in photometry measurements without an increase in unnecessary actual measurement data and design value data in the case where on a low ambient luminance side, an output of a first light sensor, which receives light collected from a large area, is linear and an output of a second light sensor, which receives light collected from a small area, is non-linear. The number of luminance measurement points used for performing measurement with the second light sensor is set at low ambient luminance values to be larger than the number of luminance measurement points used for performing measurements with the first light sensor.

Abstract: An object sensing apparatus comprises a distance measuring device for measuring a distance to an object to be sensed, and a filter member having a surface disposed in confronting and spaced-apart relation to the distance measuring device. The distance measuring device has a light projecting element for projecting light toward the object and a light receiving element for receiving the light projected by the light projecting element and reflected by the object. The filter member is disposed at a preselected angle of inclination with respect to the distance measuring device. When the light projecting element projects light toward the object, light reflected or scattered by the surface of the filter member is directed in a direction away from the light receiving element.

Abstract: A low cost, low power photometric circuit suitable for use in a low end camera includes a first counter for counting successive pulses produced by a first oscillator having a substantially constant oscillation frequency and a second counter for counting successive pulses produced by a second oscillator having an oscillation frequency which varies in accordance with ambient brightness. The ambient brightness is judged according to outputs of the counters so that even if the oscillation frequency of the second oscillator varies only slightly due to a change in ambient brightness, the slight variation is easily detectable as an accumulated count value. Accordingly, costly, high-precision components are not needed. The low cost photometric circuit requires no microcomputer, analog/digital converter or comparator and can be fabricated in a single integrated circuit operated at a low voltage of 1V or less, and is thus suitable for incorporation into a low end camera.

Abstract: A camera shutter having a shutter aperture, shutter blades, and a driving device for driving the shutter blades to open and close the shutter aperture. The driving device includes a pair of lever members spaced apart and confronting each other across the shutter aperture, each of the lever members having a first end portion and a second end portion. A piezoelectric element is connected to and between the lever members at the first end portions thereof for undergoing elastic deformation to oscillate the lever members. An elastic member is connected to and between the lever members at the second end portions thereof for undergoing elastic displacement in response to oscillation of the lever members. A transmission member is integrally connected to a central portion of the elastic member for transmitting the displacement of the elastic member to the shutter blades to open and close the shutter aperture.

Abstract: A device for determining the measurement zone of an object which permits the adjustable setting of a plurality of measurement zones bounded by user-defined division points comprises a distance measurement apparatus for measuring a distance to an object, a specific division point setting circuit, such as a digital switch, for adjustably setting a specific distance point within the effective measurement range of the distance measurement apparatus, a circuit for adjustably setting one or more predetermined division points on at least one of the near side and the far side of the specific distance point, such that the specific distance point and the at least one predetermined division point define a plurality of measurement zones within the effective measurement range of the distance measurement apparatus, and a judgment circuit for judging which of the plurality of measurement zones a distance measurement result of the distance measurement apparatus belongs to.

Abstract: A distance measurement device is provided which determines the measurement zone of an object and also determines the direction of movement of the object within the measurement zone.

Abstract: A distance measurement device comprises at least one switch for generating a start signal, a distance measurement device for measuring the distance to an object in response to the start signal, a memory device for storing distance data measured by the distance measurement device, the stored data defining a plurality of measurement zones within the full range of distance measurement of the distance measurement device, and a judgement circuit for judging which measurement zone the result of the distance measurement performed by the distance measurement means belongs to from the plurality of measurement zones defined by the distance data stored in the memory device. In accordance with this configuration, division points can be set if an object is placed at an actual division point desired and a switch is pressed. Accordingly, when an operator sets the division point, it is unnecessary to depend on memory, perception, or calculation, and the setting of the division points becomes easier.

Abstract: A distance measurement device includes a distance measurement device for measuring a distance to an object, a processor for determining which respective measurement zone a measurement result of the distance measurement device is in, from a plurality of measurement zones within a range of distance measurement of the distance measurement device; and a plurality of output terminals for outputting, based on the determination by the processor, a predetermined output signal corresponding to the respective measurement zones. The output terminals output a signal which is not representative of any respective measurement zone for a predetermined period of time at the time of the end of a distance measurement operation.

Abstract: A distance measurement device comprises distance measurement device for measuring a distance to an object, a processor for judging a result of the distance measurement of the distance measurement device, a first digital switch connected to the processor for setting a first division point where a measurement range of the distance measurement means is divided into a first long distance side and a first short distance side, a second digital switch for setting a second division point where a range between the first division point and the first short distance side is further divided into a second long distance side and a second short distance side. Based on the set states of the first and second digital switches, the processor determines which area the measurement result of the distance measurement device belongs to, from the plurality of distance areas into which the measurement result of the distance measurement device is divided with the first division point and the second division point.