Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: A piezoelectric fan comprises a blade (110, 210, 310, 410, 510, 610), a piezoelectric actuator patch (120, 220, 320, 420, 520 ,620, 811) adjacent to the blade, and a piezoelectric sensor patch (130, 230, 330, 430, 530, 630, 812) adjacent to one of the piezoelectric actuator patch and the blade. The piezoelectric sensor patch measures a voltage proportional to a deflection of the piezoelectric actuator patch and a deflection of a tip of the blade and uses that voltage to generate an input signal to an active feedback controller (840) that in turn ensures that the oscillation amplitude of the blade satisfies certain cooling specifications.

Abstract: In some embodiments, piezoelectric air jet augmented cooling for electronic devices is presented. In this regard, an apparatus is introduced having a plurality of more than about one hundred lead-free piezoelectric layers and electrodes stacked on top of each other and formed around a central opening, and a diaphragm coupled to the piezoelectric layers and substantially covering the central opening to vibrate and blow air when an operating voltage is applied to the electrodes. Other embodiments are also disclosed and claimed.

Abstract: In some embodiments, piezoelectric air jet augmented cooling for electronic devices is presented. In this regard, an apparatus is introduced having a plurality of more than about one hundred lead-free piezoelectric layers and electrodes stacked on top of each other and formed around a central opening, and a diaphragm coupled to the piezoelectric layers and substantially covering the central opening to vibrate and blow air when an operating voltage is applied to the electrodes. Other embodiments are also disclosed and claimed.

Abstract: A piezoelectric fan comprises a blade (110, 210, 310, 410, 510, 610), a piezoelectric actuator patch (120, 220, 320, 420, 520, 620, 811) adjacent to the blade, and a piezoelectric sensor patch (130, 230, 330, 430, 530, 630, 812) adjacent to one of the piezoelectric actuator patch and the blade. The piezoelectric sensor patch measures a voltage proportional to a deflection of the piezoelectric actuator patch and a deflection of a tip of the blade and uses that voltage to generate an input signal to an active feedback controller (840) that in turn ensures that the oscillation amplitude of the blade satisfies certain cooling specifications.

Abstract: A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.

Abstract: A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.

Abstract: A vapor chamber used for cooling an electronic component may have an evaporation surface and a condensation surface. A moving device may be provided to sweep condensed liquid from the condensation surface. Particularly, with alternate working fluids such as hydrofluoroethers, where the condensation resistance is a substantial portion of the overall resistance of the system, performance of the system may be dramatically improved through active condensation enhancement.

Abstract: A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

Abstract: A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

Abstract: A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.

Abstract: A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

Abstract: A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.

Abstract: A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

Abstract: Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.

Abstract: Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.