Abstract: A lift-off method for forming write pole of a magnetic write head and write pole formed thereby is disclosed. A write pole including a hard mask on a top portion of the write pole is formed. A layer of material for reinforcing sidewall fencing of the write pole is deposited. Portions of the layer of material on top of the write pole are removed while the layer of material at the sidewall fencing is left to provide support to the sidewall fencing.

Abstract: Read sensors and associated methods of fabrication are disclosed. A read sensor as disclosed herein includes a first shield, a sensor stack including an antiparallel (AP) free layer, and insulating material disposed on the sensor stack. A aperture is formed through the insulating material above the sensor stack so that a subsequently deposited second shield is electrically coupled to the sensor stack through the aperture. The width of the aperture controls the current density that is injected into the top of the sensor stack. Also, hard bias structures may be formed to be electrically coupled to the sensor stack. The electrical coupling of the sensor stack and the hard bias structures allows current to laterally spread out as it passes through the sensor stack, and hence, provides a non-uniform current density.

Abstract: A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over a substrate and is covered with a thick layer of alumina. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

Abstract: Methods and systems of enhancing stepper alignment signals and metrology alignment target signals. In one embodiment, a plurality of alternating rows comprising a first material of a first height and a second material of a second height are constructed. The first material and the second material are selected to enhance the contrast of the mark when imaged for alignment of photolithographic structures.

Abstract: Methods for creating a write head by forming a bump after the top pole is formed are provided. In one embodiment, a bottom pole is created out of a first layer. A non-magnetic gap material is applied to the surface of the wafer. A top pole is created out of a second layer. After creating the top pole, a bump is created. The bump is used to protect at least a portion of the first layer while etching to create a stray flux absorber.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording having a write pole with a very narrow track width and well controlled critical dimensions. The write pole is formed by depositing an electrically conductive seed layer over a substrate, and then depositing a photo resist layer over the seed layer. The photo resist layer is photolithographically exposed and developed to form an opening or trench in the photoreist layer, the opening defining the pattern of the write pole. A magnetic material is then plated into the opening in the photoresist layer. The photo resist layer can then be removed by a chemical lift off, and portions of the seed layer that are not covered by the write pole can be removed by ion milling.

Abstract: A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A substrate such as an alumina fill layer, magnetic shaping layer, etc. is formed with region having a contact pad formed therein. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over the substrate and is covered with a thick layer of alumina. The alumina can be applied by a high deposition rate process that does not form voids or seams in the alumina layer. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

Abstract: A method of manufacturing a write pole that prevents P2 pedestal consumption during ion milling removal of coil and pole seed layers. The write head can be constructed by forming a first pole and then forming a magnetic pedestal (P2) over the first pole. A protective layer of, for example, alumina is deposited over a portion of the pedestal in the pole tip region, leaving a portion of the pedestal uncovered in the flare region. A coil seed layer can then be deposited and a coil formed. When the coil seed layer is removed, such as by ion milling, the pole tip region of the pedestal is protected from the ion milling by the protective layer. Similarly, a top pole can be deposited by first depositing an electrically conductive, magnetic seed layer and then plating the top pole. When the top pole seed layer is removed by ion milling, the pole tip region of the pedestal is protected from removal by the protective layer.

Abstract: A lift-off method for forming write pole of a magnetic write head and write pole formed thereby is disclosed. A write pole including a hard mask on a top portion of the write pole is formed. A layer of material for reinforcing sidewall fencing of the write pole is deposited. Portions of the layer of material on top of the write pole are removed while the layer of material at the sidewall fencing is -left to provide support to the sidewall fencing.

Abstract: A perpendicular write head having a wrap around trailing shield for reducing stray field writing and adjacent track interference. A method for constructing such a write head allows for excellent control of side shield gap thickness and trailing shield gap thickness, and allows the ratio of side gap to trailing gap thicknesses to be maintained at about two to one as desired. The method includes depositing forming a write pole by constructing a mask which may include a bi-layer hard mask, and then ion milling to form the write pole. Once the write pole has been formed, a layer of alumina or some other non-magnetic material can be conformally deposited. A reactive ion mill (RIM) can be performed to open up the top of the write pole (remove the horizontally disposed portions of the alumina layer). Then, a second layer of alumina or some other non-magnetic material can be deposited, and the write pole can be plated.

Abstract: A perpendicular write head includes a beveled main pole having corners defining a track width and having a planarized surface and encapsulated on either side thereof and below by an alumina layer, the alumina layer having a polished surface and extending above the main pole on either side thereof as steps.

Abstract: Methods for creating a write head by forming a bump after the top pole is formed are provided. In one embodiment, a bottom pole is created out of a first layer. A non-magnetic gap material is applied to the surface of the wafer. A top pole is created out of a second layer. After creating the top pole, a bump is created. The bump is used to protect at least a portion of the first layer while etching to create a stray flux absorber.

Abstract: Methods and systems of enhancing stepper alignment signals and metrology alignment target signals. In one embodiment, a plurality of alternating rows comprising a first material of a first height and a second material of a second height are constructed. The first material and the second material are selected to enhance the contrast of the mark when imaged for alignment of photolithographic structures.

Abstract: A free layer for a spin valve sensor includes a cobalt iron (CoFe) film which has an easy axis oriented perpendicular to an air bearing surface (ABS) of a read head and a nickel iron (NiFe) film which has an easy axis oriented parallel to the ABS and parallel to the major planes of the thin film layers. In a further embodiment the free layer is annealed at a high temperature in the presence of a field which is oriented perpendicular to the ABS.

Abstract: A free layer for a spin valve sensor includes a cobalt iron (CoFe) film which has an easy axis oriented perpendicular to an air bearing surface (ABS) of a read head and a nickel iron (NiFe) film which has an easy axis oriented parallel to the ABS and parallel to the major planes of the thin film layers. In a further embodiment the free layer is annealed at a high temperature in the presence of a field which is oriented perpendicular to the ABS.

Abstract: A thin film conductive line is formed between MR pads on an MR head for protecting an MR sensor from electrostatic discharge (ESD) during assembly steps between row level fabrication of the head and prior to merge of a head stack assembly with a disk stack assembly. The conductive line may have a reduced thickness delete pad. A laser beam having a fluence sufficient to sever the conductive line at the delete pad but insufficient to damage or cause debris from structure underlying or surrounding the conductive line is used to sever the conductive line. The method traverses minimum energy, short laser pulses at a high pulse rate across the line, the melted material withdrawing from the melted area and being heaped on top of adjacent portions of the delete pad by surface tension and the melted material cooling to room temperature before the next pulse so that there is no cumulative heating and therefore no damage to or debris from the underlying structure.

Abstract: A thin film conductive line is formed between MR pads on an MR head for protecting an MR sensor from electrostatic discharge (ESD) during assembly steps between row level fabrication of the head and prior to merge of a head stack assembly with a disk stack assembly. The conductive line may have a reduced thickness delete pad. A laser beam having a fluence sufficient to sever the conductive line at the delete pad but insufficient to damage or cause debris from structure underlying or surrounding the conductive line is used to sever the conductive line.