Patents by Inventor Hamid R. Borzabadi

Hamid R. Borzabadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8375778
    Abstract: An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: February 19, 2013
    Assignee: Delphi Technologies, Inc.
    Inventors: Hamid R. Borzabadi, Ronald D. Wilcox, Philip D. Kuznia, Timothy A. Vas, Lewis H. Little, David G. Miller
  • Publication number: 20110203359
    Abstract: An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.
    Type: Application
    Filed: February 22, 2010
    Publication date: August 25, 2011
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: HAMID R. BORZABADI, RONALD D. WILCOX, PHILIP D. KUZNIA, TIMOTHY A. VAS, LEWIS H. LITTLE, DAVID G. MILLER
  • Patent number: 7983046
    Abstract: Power electronic devices of an electronic control module are mounted in a power module disposed between the control module circuit board and an interior face of the control module case, with a prescribed separation distance between the circuit board and a housing of the power module. The power electronic devices are mounted on an inboard face of a power module substrate, and a heatsink thermally coupled to the opposite face of the substrate is fastened to an interior surface of the control module case. The substrate and heatsink are mounted in the power module housing, and the power electronic devices are electrically coupled to the circuit board by a set of compliant terminals that protrude from the inboard face of the power module housing. The terminals extend into plated holes in the circuit board, and have shoulders that limit their depth of insertion to establish the prescribed separation distance between the circuit board and the power module housing.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: July 19, 2011
    Assignee: Delphi Technologies, Inc.
    Inventors: Hamid R. Borzabadi, Ronald D. Wilcox
  • Publication number: 20090152653
    Abstract: A surface mount multi-axis cavity package for micro-electrical mechanical systems (MEMS) devices includes a substantially cubical housing having a plurality of sides and at least one internal cavity. A first plurality of solder pads are positioned on at least one side of the housing and a second plurality of solder pads are positioned on a bottom of the housing. A MEMS sensor is then mounted within the at least one internal cavity in any axis for increasing the versatility of the MEMS device.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Inventors: Hamid R. Borzabadi, Ronald D. Wilcox
  • Patent number: 7331212
    Abstract: A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: February 19, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Gregory J. Manlove, Stephen P. Long, Hamid R. Borzabadi, Timothy A. Vas, Kevin J. Hawes
  • Patent number: 7244895
    Abstract: A cost efficient electrical feedthrough is provided for forming a hermetic seal with a container and allowing a desired number of inputs to be connected between varied environmental conditions. The electrical feedthrough can be employed for environmental conditions including high pressures, high temperatures, low temperatures and the presence of corrosive gases. A first wire situated in a first environmental condition and a second wire situated in a second environmental condition are connected via a conducting material. The first environmental condition and the second environmental condition are separated by a divider having an opening for passing therethrough either the first wire or the second wire. A first seal extends from the divider to a material in contact with the conducting material.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: July 17, 2007
    Assignee: Delphi Technologies, Inc.
    Inventor: Hamid R. Borzabadi
  • Patent number: 7174773
    Abstract: A leak-testing technique and apparatus for differential pressure sensor arrays is provided. A reference pressure sensor array is provided, wherein a seal is disposed between the reference pressure sensor array and a target differential pressure sensor array. A probe socket is utilized to communicate with each individual sensor in the reference pressure sensor array. The target pressure sensor array and the reference pressure sensor array are sealed via a pressure plate and plunger assembly. The target pressure sensor array, seal, and reference pressure sensor array are exposed to a first pressure. The target differential pressure sensor array, seal, and reference pressure sensor array are then exposed to a second pressure. The probe socket verifies that all reference pressure sensors continue to output the first pressure. If the probe socket identifies a reference pressure sensor that reads the second pressure, then the corresponding target pressure sensor is identified as being defective because of leakage.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: February 13, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Hamid R. Borzabadi, Dennis M. Koglin
  • Patent number: 7117747
    Abstract: A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: October 10, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Hamid R. Borzabadi, Dennis M. Koglin, Stephen P. Long, Timothy A. Vas
  • Patent number: 6993975
    Abstract: A pressure sensor module is provided with an isolation platform which isolates stress. The pressure sensor module includes a base structure and a cantilever member formed in the base structure by an isolation gap. A pressure sensing element is located on the cantilever member such that the cantilever member provides stress isolation to the pressure sensing element.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: February 7, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Hamid R. Borzabadi, Dennis M. Koglin, Gregory J. Manlove, Stephen P. Long
  • Patent number: 6844606
    Abstract: An optical sensor package capable of being surface mounted, and in a form that enables multiple packages to be fabricated simultaneously and then array tested in a wafer stack prior to singulation. The package comprises a chip carrier, a device chip electrically and mechanically connected to a first surface of the chip carrier with solder connections, and a capping chip secured to the chip carrier to hermetically enclose the device chip. The device chip has an optical sensing element on a surface thereof, while the capping chip has means for enabling radiation to pass therethrough to the device chip. The chip carrier includes conductive vias that are electrically connected to the solder connections of the device chip and extend through the chip carrier to bond pads on a second surface of the chip carrier, enabling the package to be surface mounted with solder connections to a suitable substrate.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: January 18, 2005
    Assignee: Delphi Technologies, Inc.
    Inventors: James H. Logsdon, Abhijeet V. Chavan, Hamid R. Borzabadi
  • Patent number: 6828560
    Abstract: An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: December 7, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: David K. Lambert, Han-Sheng Lee, Dan W. Chilcott, Hamid R. Borzabadi, Qin Jiang, James H. Logsdon
  • Publication number: 20030146384
    Abstract: An optical sensor package capable of being surface mounted, and in a form that enables multiple packages to be fabricated simultaneously and then array tested in a wafer stack prior to singulation. The package comprises a chip carrier, a device chip electrically and mechanically connected to a first surface of the chip carrier with solder connections, and a capping chip secured to the chip carrier to hermetically enclose the device chip. The device chip has an optical sensing element on a surface thereof, while the capping chip has means for enabling radiation to pass therethrough to the device chip. The chip carrier includes conductive vias that are electrically connected to the solder connections of the device chip and extend through the chip carrier to bond pads on a second surface of the chip carrier, enabling the package to be surface mounted with solder connections to a suitable substrate.
    Type: Application
    Filed: October 18, 2002
    Publication date: August 7, 2003
    Applicant: Delphi Technologies, Inc.
    Inventors: James H. Logsdon, Abhijeet V. Chavan, Hamid R. Borzabadi
  • Publication number: 20030141455
    Abstract: An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventors: David K. Lambert, Han-Sheng Lee, Dan W. Chilcott, Hamid R. Borzabadi, Qin Jiang, James H. Logsdon