Abstract: An ultra-compact, high power, fiber pump module apparatus has a heatsink with a stepped outer shape. The heatsink has at least one interior cooling channel. A plurality of single emitter diodes is positioned on one step of the stepped outer shape of the heatsink, respectively. At least two beam-shifting structures are positioned in a beam path of each of the plurality of single emitter diodes. The at least two beam-shifting structures fold each beam emitted from the plurality of single emitter diodes in at least three dimensions. At least one beam combining structure is positioned in the beam path, wherein the at least one beam combining structure combines the beams from each of the plurality of single emitter diodes into a single, combined beam. The single, combined beam is output from the ultra-compact, high power, fiber pump module apparatus.

Abstract: In general, in some aspects, the subject matter of the present disclosure encompasses laser diode heat sinks that include: multiple planar foils, in which each planar foil of the multiple planar foils includes a first face and a second face opposite the first face, the multiple planar foils being arranged in a stack along a stacking direction, with the second face of each planar foil of the plurality of planar foils arranged on a first face of a respective preceding planar foil in the stack. The first face of each planar foil of the multiple planar foils includes a corresponding elongated trench extending substantially along a second direction that is perpendicular to the stacking direction, and, for each planar foil of the multiple planar foils, a depth of the corresponding trench extends through less than an entire thickness of the planar foil.

Abstract: Methods of passivating at least one facet of a multilayer waveguide structure can include: cleaning, in a first chamber of a multi-chamber ultra-high vacuum (UHV) system, a first facet of the multilayer waveguide structure; transferring the cleaned multilayer waveguide structure from the first chamber to a second chamber of the multi-chamber UHV system; forming, in the second chamber, a first single crystalline passivation layer on the first facet; transferring the multilayer waveguide structure from the second chamber to a third chamber of the multi-chamber UHV system; and forming, in the third chamber, a first dielectric coating on the first single crystalline passivation layer, in which the methods are performed in an UHV environment of the multi-chamber UHV system without removing the multilayer waveguide structure from the UHV environment.

Abstract: Methods of passivating at least one facet of a multilayer waveguide structure can include: cleaning, in a first chamber of a multi-chamber ultra-high vacuum (UHV) system, a first facet of the multilayer waveguide structure; transferring the cleaned multilayer waveguide structure from the first chamber to a second chamber of the multi-chamber UHV system; forming, in the second chamber, a first single crystalline passivation layer on the first facet; transferring the multilayer waveguide structure from the second chamber to a third chamber of the multi-chamber UHV system; and forming, in the third chamber, a first dielectric coating on the first single crystalline passivation layer, in which the methods are performed in an UHV environment of the multi-chamber UHV system without removing the multilayer waveguide structure from the UHV environment.

Abstract: A laser diode assembly contains a plurality of laser diode chips packaged closely in a row. Each laser diode chip is bonded on both P-side and N-side to first and second sub-mounts. The sub-mounts are then attached to a cooling carrier, with both bonding surfaces perpendicular to the top surface of the carrier. The direction of laser radiation is parallel to the carrier top surface, and the distance between the top of the active area of the laser diode chip and the carrier is preferably in a range of half a pitch between individual laser sources packaged in a row or preferably in a range of 0.2 mm to 1 mm to allow efficient cooling for high power operation. The sub-mounts may be electrically conductive, or they may be of insulating material at least partially covered with a conducting layer. A laser diode chip is bonded uniquely to a set of sub-mounts or may share a sub-mount with another laser diode chip.

Abstract: Embodiments are directed to a beam combining apparatus including a light source having a first emitter with a first output wavelength and at least one second emitter having a second output wavelength. A beam conditioning section is configured to collimate the output of the emitters and provide diffractive optical feedback to the emitters and a diffractive beam combining device is configured to spatially overlap the output wavelengths of the first emitter and at least one second emitter.

Abstract: An assembly for providing a concentrated, vertically stacked array of laser beams from a horizontally offset array of electrically serially-connected metallic microchannel heat sinks each bearing a laser diode bar. The heat sinks are mounted on horizontally offset planes of the manifold which has coolant channels serving adjacent heat sinks that are separated from each to increase the electrical resistance of the fluid path between adjacent ones of said heat sinks. Stepped optical deflectors re-arrange the horizontally emitted laser beams into vertical stack.

Abstract: A laser bar is soldered to a conventional microchannel copper heat sink whose coefficient of thermal expansion (CTE) is locally modified in the area where the laser bar is soldered to better match the CTE of the laser bar. A strip of ceramic material having a CTE lower than that each of the laser bar and of the copper heat sink is soldered to portions of the metallic heat sink located adjacently to the surface area on which the laser bar is located. The inclusion of the ceramic strips enables a laser bar having a nominal CTE of 6.6×10?6/K, to be soldered directly to a copper heat sink having a nominal CTE of 16.5×10?6/K without incurring thermal distortions at the interface that would limit the useful life of the laser bar.

Abstract: An assembly for providing a concentrated, vertically stacked array of laser beams from a horizontally offset array of electrically serially-connected metallic microchannel heat sinks each bearing a laser diode bar. The heat sinks are mounted on horizontally offset planes of the manifold which has coolant channels serving adjacent heat sinks that are separated from each to increase the electrical resistance of the fluid path between adjacent ones of said heat sinks. Stepped optical deflectors re-arrange the horizontally emitted laser beams into vertical stack.

Abstract: A laser diode stack includes a serially connected plurality of laser diode bars mounted on heat sinks. Connected in parallel with each laser diode is a respective safety diode which has a higher band gap than its associated laser diode. The safety diode remains nonconductive so long as the associated laser diode is operational. Should the laser diode fail in an open circuit condition, the respective safety diode responds to the open circuit voltage to restore continuity to the serially connected chan of laser diodes.

Abstract: A laser bar is soldered to a conventional microchannel copper heat sink whose coefficient of thermal expansion (CTE) is locally modified in the area where the laser bar is soldered to better match the CTE of the laser bar. A strip of ceramic material having a CTE lower than that each of the laser bar and of the copper heat sink is soldered to portions of the metallic heat sink located adjacently to the surface area on which the laser bar is located. The inclusion of the ceramic strips enables a laser bar having a nominal CTE of 6.6×10−6/K, to be soldered directly to a copper heat sink having a nominal CTE of 16.5×10−6/K without incurring thermal distortions at the interface that would limit the useful life of the laser bar.

Abstract: A stack of parallel but laterally separated laser beams emitted from a pair of laterally separated laser diode bars are focused into a single vertical plane through the use of an interleaved array of stacked, angular glass plates. Successive plates oppositely refract laser beams from successive radiating levels of the stacks of laser bars so that beams emerging from the glass plates lie in the same vertical plane, thereby overcoming the lateral displacement among beams emerging from the laser bars.

Abstract: A method for processing moving workpieces with laser radiation that is focused on a to-be-processed workpiece surface by means of a laser beam that is moved but not relative to the workpiece. The laser beam is focused in a line-like manner and its beam spot corresponds practically exclusively and with full a real coverage to the work piece surface to be processed.

Abstract: A multiplicity of laser diodes aim laser light directly onto the surface of a workpiece and are disposed over and according to the to-be-shaped contour of a workpiece, so that a detector unit for determining the spatial shaping of the workpiece and an evaluation and control unit can determine process parameters for further illumination in dependence on a comparison of an actual state of shaping and a desired state of shaping of the workpiece.

Abstract: A method for the manufacture of a plastic window comprising a frame (2) and at least one pane (4a, 4b) of transparent plastic, in which method the pane (4a, 4b) is joined with the frame (2) at an abutment surface (3a, 3b) provided thereon. The joining is performed by welding with laser light (8), and while the welding is performed, an average abutment pressure of at least approx. 2 MPa is provide between the pane (4a, 4b) and the frame (2).

Abstract: A device for plating two or more metal plates, strips, etc., by the absoron of laser energy. The device is fitted with beam-forming optics which form the laser radiation into a beam with a rectangular cross-section. The radiation source is a laser-diode array in which several laser diodes are disposed next to each other in the same plane to give bars which can be laid next to each other, as well as stacked one on top of each other, in any numbers. In order to homogenize the laser radiation produced by the array to give a rectangular cross-section, the device proposed is fitted with special optics such as a prism which converges in the shape of a wedge, a glass plate, with a rectangular cross-section, reflective boundary drives, etc. The rectangular cross-section beam heats the two surfaces of the metal plates being plated only locally, over limited areas and to small depths, to the plastic state.