Patents by Inventor Hans-Hermann Oppermann

Hans-Hermann Oppermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6093971
    Abstract: Chip module (20) with a chip carrier (21) and at least one chip (22), wherein the chip carrier is designed as a sheet with a carrier layer (23) of plastics material and a conductor path structure (24) with conductor paths (28), and the chip carrier is connected to the chip with interposition of a filling material (37), wherein the conductor paths are connected on their front to attachment faces (32) of the chip and, on their rear side (27), have external bonding regions (26) for forming a flatly distributed attachment face arrangement (34) for the connection of the chip module to an electronic component or a substrate (31), and the conductor paths (28) extend in a plane on the chip bonding side (35) of the carrier layer (23) facing the chip (22), the external bonding regions (26) are formed by recesses in the carrier layer (23) which extend toward the rear side (27) of the conductor paths (28) and the carrier layer (23) extends over the region of the attachment faces (30) of the chip.
    Type: Grant
    Filed: May 2, 1997
    Date of Patent: July 25, 2000
    Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung e.V.
    Inventors: Hans-Hermann Oppermann, Elke Zakel, Ghassem Azdasht, Paul Kasulke
  • Patent number: 5976302
    Abstract: A method for the temporary fixing of an electronic component (10) having elevated contact metallizations (11) to a substrate (17) provided with terminal surfaces (16) for a subsequent thermal connection of the contact metallizations to the terminal surfaces, wherein a bonding agent is applied to the component and/or the substrate and wherein the bonding agent used is an alcoholic liquid medium containing an alcohol (13) whose surface tension is used to form bonding forces between the contact metallizations and the terminal surfaces and whose boiling point is below the melting temperature of the contact metallizations (11).
    Type: Grant
    Filed: November 7, 1997
    Date of Patent: November 2, 1999
    Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Hans Hermann Oppermann, Elke Zakel, Christine Kallmayer, Achim Kloeser
  • Patent number: 5845838
    Abstract: Process for remelting a contact surface metallization (13) applied to a strate (10) in an inert or reducing medium, wherein the medium (18) is formed as alcoholic medium whose boiling point is the same as or above the melting point of the contact surface metallization (13), the medium (18) is applied to the contact surface metallization (13) applied to a contact surface (11, 12) of the substrate (10) outside the inert or reducing medium in such a way that the contact surface metallization (13) is screened with respect to the environment, and the medium (18) is tempered to a temperature which is the same as or higher than the melting point of the contact surface metallization (13).
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: December 8, 1998
    Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
    Inventors: Jorg Gwiasda, Elke Zakel, Hans Hermann Oppermann, Achim Kloeser, Stefan Weiss