Patents by Inventor Hans Kruger

Hans Kruger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10164166
    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: December 25, 2018
    Assignee: SnapTrack, Inc.
    Inventors: Hans Krüger, Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl
  • Publication number: 20180097172
    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
    Type: Application
    Filed: November 22, 2017
    Publication date: April 5, 2018
    Inventors: Hans KRÜGER, Alois STELZL, Christian BAUER, Jürgen PORTMANN, Wolfgang PAHL
  • Patent number: 9853204
    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: December 26, 2017
    Assignee: SnapTrack, Inc.
    Inventors: Hans Krüger, Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl
  • Publication number: 20150325780
    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
    Type: Application
    Filed: October 14, 2013
    Publication date: November 12, 2015
    Inventors: Hans Krüger, Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl
  • Patent number: 9006868
    Abstract: The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: April 14, 2015
    Assignee: EPCOS AG
    Inventors: Christian Bauer, Hans Krüger, Jürgen Portmann, Alois Stelzl
  • Patent number: 8674498
    Abstract: An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich structure in such a way that a closed cavity which receives the MEMS structures is formed. Solderable or bondable electrical contact are arranged on the rear side of the chip or on the outer side of the covering plate which faces away from the chip, and are electrically conductively connected to at least one connection pad by means of an electrical connection structure.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: March 18, 2014
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Hans Krüger, Alexander Schmajew
  • Publication number: 20130341773
    Abstract: The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.
    Type: Application
    Filed: November 18, 2011
    Publication date: December 26, 2013
    Applicant: EPCOS AG
    Inventors: Christian Bauer, Hans Krüger, Jürgen Portmann, Alois Stelzl
  • Patent number: 8350221
    Abstract: The present invention relates to an apparatus (10) for generating countable pulses (30) from impinging X-ray (12, 14) in an imaging device (16), in particular in a computer tomograph, the apparatus (10) comprising a pre-amplifying element (18) adapted to convert a charge pulse (20) generated by an impinging photon (12, 14) into an electrical signal (22) and a shaping element (26) having a feedback loop (28) and adapted to convert the electrical signal (22) into an electrical pulse (30), wherein a delay circuit (38) is connected to the feedback loop (28) such that a time during which the feedback loop (28) collects charges of the electrical signal (22) is extended in order to improve an amplitude of the electrical pulse (30) at an output (56) of the shaping element (26). The invention also relates to a corresponding imaging device (16) and a corresponding method.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: January 8, 2013
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Roger Steadman Booker, Christian Baeumer, Christoph Herrmann, Guenter Zeitler, Hans Krüger, Walter Ruetten, Oliver Muelhens
  • Patent number: 8294535
    Abstract: A component includes a first substrate having a first front side for holding first component structures, and a second substrate having a second front side for holding second component structures. The first and second substrates are connected together electrically and mechanically. The first and second front sides face each other. The first and second component structures include SAW structures, FBAR structures, MEMS sensors or switches, or MEOPS components, or combinations thereof.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: October 23, 2012
    Assignee: EPCOS AG
    Inventors: Gregor Feiertag, Hans Krüger, Wolfgang Pahl, Alois Stelzl
  • Publication number: 20110006381
    Abstract: An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich structure in such a way that a closed cavity which receives the MEMS structures is formed. Solderable or bondable electrical contact are arranged on the rear side of the chip or on the outer side of the covering plate which faces away from the chip, and are electrically conductively connected to at least one connection pad by means of an electrical connection structure.
    Type: Application
    Filed: December 4, 2008
    Publication date: January 13, 2011
    Applicant: EPCOS AG
    Inventors: Gregor Feiertag, Hans Krüger, Alexander Schmajew
  • Publication number: 20100172467
    Abstract: The present invention relates to an apparatus (10) for generating countable pulses (30) from impinging X-ray (12, 14) in an imaging device (16), in particular in a computer tomograph, the apparatus (10) comprising a pre-amplifying element (18) adapted to convert a charge pulse (20) generated by an impinging photon (12, 14) into an electrical signal (22) and a shaping element (26) having a feedback loop (28) and adapted to convert the electrical signal (22) into an electrical pulse (30), wherein a delay circuit (38) is connected to the feedback loop (28) such that a time during which the feedback loop (28) collects charges of the electrical signal (22) is extended in order to improve an amplitude of the electrical pulse (30) at an output (56) of the shaping element (26). The invention also relates to a corresponding imaging device (16) and a corresponding method.
    Type: Application
    Filed: July 24, 2008
    Publication date: July 8, 2010
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Roger Steadman Booker, Christian Baeumer, Christoph Herrmann, Guenter Zeitler, Hans Krüger, Walter Ruetten, Oliver Muelhens
  • Patent number: 7608789
    Abstract: A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which is mounted on at least one side of the glass film. The component is covered and sealed by a cover layer mounted on the carrier substrate.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: October 27, 2009
    Assignee: EPCOS AG
    Inventors: Hans Krüger, Alois Stelzl
  • Publication number: 20090224851
    Abstract: What is proposed is a preferably surface mounted electrical component with sensitive component structures which are arranged on the front side of two substrates. The substrates are joined with their front sides facing each other in such a manner that a cavity will remain for the component structures. The outer electrical connections for all component structures are located on the surface of one of the two substrates, in particular on the back side of the upper, or on the front side of the lower substrate. Between the two substrates there is a suitably structured intermediate layer which is used both as a spacer and also for sealing of the housing of the cavity.
    Type: Application
    Filed: May 24, 2006
    Publication date: September 10, 2009
    Applicant: EPCOS AG
    Inventors: Gregor Feiertag, Hans Krüger, Wolfgang Pahl, Alois Stelzl
  • Patent number: 7518201
    Abstract: An arrangement having a component mounted on a carrier in a flip chip construction which is encapsulated by a film, in particular a plastic film, laminated over the entire surface of the component. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip.
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: April 14, 2009
    Assignee: EPCOS AG
    Inventors: Alois Stelzl, Hans Krüger, Gregor Feiertag
  • Publication number: 20080038577
    Abstract: A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which is mounted on at least one side of the glass film. The component is covered and sealed by a cover layer mounted on the carrier substrate.
    Type: Application
    Filed: August 2, 2004
    Publication date: February 14, 2008
    Applicant: EPCOS AG
    Inventors: Hans Kruger, Alois Stelzl
  • Publication number: 20060249802
    Abstract: An arrangement having a component mounted on a carrier in a flip chip construction which is encapsulated by a film, in particular a plastic film, laminated over the entire surface of the component. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip.
    Type: Application
    Filed: July 12, 2006
    Publication date: November 9, 2006
    Inventors: Alois Stelzl, Hans Kruger, Gregor Feiertag
  • Patent number: 7094626
    Abstract: An encapsulation method for sensitive composition is provided in which a film, in particular a plastic film, is laminated over the entire surface of an arrangement having a component mounted on a carrier in a flip chip construction. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip. Optionally, before the application of the plastic compound, the film can be removed in the area of structuring lines in such a way that the plastic compound can come into contact both with the carrier and with the chip surface.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: August 22, 2006
    Assignee: EPCOS AG
    Inventors: Alois Stelzl, Hans Krüger, Gregor Feiertag
  • Patent number: 6909183
    Abstract: For a component mounted with the flip-chip technique, in particular surface wave elements, it is proposed to use a low-shrinkage ceramic substrate over which (as needed) multi-layer metallizations are produced by metal deposition. The bumps can also be produced by self-aligning metal deposition.
    Type: Grant
    Filed: January 21, 2002
    Date of Patent: June 21, 2005
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Alois Stelzl, Hans Krüger
  • Patent number: 6838739
    Abstract: For labeling a component provided with a metallic cover layer, it is proposed that at least one additional contrast layer is arranged over the cover layer. The contrast layer produces an optical contrast with the metallic cover layer and is capable of being eroded by a laser for producing a label.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: January 4, 2005
    Assignee: Epcos AG
    Inventors: Alois Stelzl, Hans Krüger, Ernst Christi
  • Publication number: 20040239449
    Abstract: An encapsulation method for sensitive composition is provided in which a film, in particular a plastic film, is laminated over the entire surface of an arrangement having a component mounted on a carrier in a flip chip construction. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip. Optionally, before the application of the plastic compound, the film can be removed in the area of structuring lines in such a way that the plastic compound can come into contact both with the carrier and with the chip surface.
    Type: Application
    Filed: March 29, 2004
    Publication date: December 2, 2004
    Inventors: Alois Stelzl, Hans Kruger, Gregor Feiertag