Patents by Inventor Hans Magnus Emil Andersson
Hans Magnus Emil Andersson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240063593Abstract: A cable connector assembly comprises a cable connection module and a shell module connectable thereto. The cable connection module includes a center conductor, a first insulation housing in which the center conductor is disposed, and a second insulation housing slidably fitted around the first insulation housing. The first insulation housing includes a guiding member sized to slidably guide an inner conductor of a cable assembly therethrough and into the center conductor. The shell module includes a metal shell connectable with the second insulation member. The cable connection module and the shell module are adapted such that, when the cable connection module and the shell module are assembled together with the cable assembly, a braid of the cable assembly fitted around the inner conductor of the cable assembly is fixed outside of the first insulation housing.Type: ApplicationFiled: August 18, 2023Publication date: February 22, 2024Applicants: Tyco Electronics (Shanghai) Co., Ltd., TE Connectivity Svenska ABInventors: Yunhe (Bill) Wang, Wenke He, Stefan Borgas, Hans Magnus Emil Andersson, Songhua (Cedar) Liu
-
Patent number: 10627587Abstract: A connector assembly adapted to connect a plug to a communication device comprises a receptacle and a connection base. The receptacle is adapted to be fixed on a circuit board of the communication device and mated with the plug. The connection base is adapted to be fixed on a housing panel of the communication device. The connection base has a main body portion located outside the housing panel of the communication device and an insertion cavity adapted to receive at least a portion of the receptacle. The connection base is in thermal contact with the receptacle.Type: GrantFiled: April 17, 2019Date of Patent: April 21, 2020Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Svenska ABInventors: Qingquan Wan, Zhigang Song, Hans Magnus Emil Andersson, Haibo Zhang, Songhua Liu
-
Publication number: 20190324221Abstract: A connector assembly adapted to connect a plug to a communication device comprises a receptacle and a connection base. The receptacle is adapted to be fixed on a circuit board of the communication device and mated with the plug. The connection base is adapted to be fixed on a housing panel of the communication device. The connection base has a main body portion located outside the housing panel of the communication device and an insertion cavity adapted to receive at least a portion of the receptacle. The connection base is in thermal contact with the receptacle.Type: ApplicationFiled: April 17, 2019Publication date: October 24, 2019Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Svenska ABInventors: Qingquan WAN, Zhigang SONG, Hans Magnus Emil ANDERSSON, Haibo ZHANG, Songhua LIU
-
Patent number: 10141715Abstract: The present invention relates to an apparatus for damping arid monitoring emissions from a light emitting device, particularly a vertical cavity surface emitting laser (VCSEL), comprising: a semi transparent substrate, preferably glass; a light emitting device for generating light emission; a damping layer deposited on a surface of the substrate; and a pair of electrodes, each of which being in direct contact with the damping layer. The damping layer is adapted to decrease the power level of the light emission of the light emitting device by absorption, to a desired level, for instance, to a level that meets eye safety limits. In addition, the damping layer is photosensitive to the light emission of the light emitting device, thereby allowing the pair of electrodes to output an electric signal corresponding to the power level of the light emission of the light emitting device.Type: GrantFiled: January 20, 2017Date of Patent: November 27, 2018Assignee: Finisar CorporationInventors: Marek Grzegorz Chacinski, Nicolae Pantazi Chitica, Hans Magnus Emil Andersson, Lennart Per Olof Lundqvist, Andrei Kaikkonen
-
Publication number: 20170264077Abstract: The present invention relates to an apparatus for damping arid monitoring emissions from a light emitting device, particularly a vertical cavity surface emitting laser (VCSEL), comprising: a semi transparent substrate, preferably glass; a light emitting device for generating light emission; a damping layer deposited on a surface of the substrate; and a pair of electrodes, each of which being in direct contact with the damping layer. The damping layer is adapted to decrease the power level of the light emission of the light emitting device by absorption, to a desired level, for instance, to a level that meets eye safety limits. In addition, the damping layer is photosensitive to the light emission of the light emitting device, thereby allowing the pair of electrodes to output an electric signal corresponding to the power level of the light emission of the light emitting device.Type: ApplicationFiled: January 20, 2017Publication date: September 14, 2017Inventors: Marek Grzegorz Chacinski, Nicolae Pantazi Chitica, Hans Magnus Emil Andersson, Lennart Per Olof Lundqvist, Andrei Kaikkonen
-
Patent number: 9651749Abstract: An interposer comprising a substrate having at least a top surface and a bottom surface, the top and bottom surfaces being substantially parallel; at least one series of bottom cavities on the bottom surface; at least one expansion cavity contiguous with the at least one series of bottom cavities, the at least one expansion cavity being larger than each of the bottom cavities; a perimeter defined on the bottom surface around the bottom cavities; at least one alignment fiducial on the top surface for cooperating with a corresponding fiducial on the detachable optical interface to optically couple an optical conduit attached to the detachable optical interface with at least one optical device; and the at least one optical device mounted to the substrate on at least a portion of the perimeter, the optical device configured to emit a diverging light beam or receive a non-diverging light beam.Type: GrantFiled: March 31, 2016Date of Patent: May 16, 2017Assignee: Tyco Electronics Svenska Holdings ABInventors: Odd Robert Steijer, Hans Magnus Emil Andersson
-
Patent number: 8718479Abstract: Disclosed is an optical floating sub-assembly, comprising a thermally conductive non rigid substance between the heat sink carrier and external casing, to minimize mechanical stress on the optical assembly. Also disclosed is a printed circuit board as an electrical interface, comprising two modules capable of converting an electrical signal to an optical signal, transmitting the optical signal and then converting the optical signal back to an electrical signal. Also disclosed is an optical assembly, comprising a heat sink with mechanical features for optical alignment.Type: GrantFiled: February 13, 2008Date of Patent: May 6, 2014Assignee: Tyco Electronics Services GmbHInventors: Hans Magnus Emil Andersson, Asa Christina Johansson, John Krister Frode, Lars-Gote Svenson
-
Patent number: 8232142Abstract: Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding number of through holes in the silicon substrate to permit the passage of light therethrough and further providing guide holes in the silicon substrate to present means for passive alignment of an external optical connection; and dicing the optical device carrier assembly to form individual optical devices. Preferably, the step of attaching a number of optical dies comprises using self-alignment of solder bumps using gaseous flux, the through holes are dry etched into the silicon substrate, and/or the volume between the optical die and silicon substrate is filled with a transparent polymer. Preferably, the transparent polymer is silicone rubber or epoxy.Type: GrantFiled: September 14, 2009Date of Patent: July 31, 2012Assignee: Tyco Electronics Services GmbHInventors: Odd Robert Steijer, Hans Magnus Emil Andersson
-
Patent number: 7978940Abstract: Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.Type: GrantFiled: September 14, 2009Date of Patent: July 12, 2011Assignee: Tyco Electronics Services GmbHInventors: Odd Robert Steijer, Hans Magnus Emil Andersson
-
Publication number: 20110091168Abstract: There is provided an opto-electrical assembly. The assembly comprises an optical carrier and one or more optical elements and possibly also electrical elements, such as optical flip-chip die, attached to the optical carrier, and configured for electrical and optical communication with the optical carrier. The assembly further comprises a flexible electrical and optical connectors attached to the optical carrier, and configured to provide electrical and optical communication between the one or more optical and electrical elements and further circuitry. Wherein the flexible connectors are configured to allow for relative movement of the optical carrier and further circuitry during use of the assembly.Type: ApplicationFiled: October 19, 2009Publication date: April 21, 2011Applicant: ZARLINK SEMICONDUCTOR ABInventors: Odd Robert Steijer, Hans Magnus Emil Andersson, Maria Elisabeth Kãllén
-
Publication number: 20110089438Abstract: Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature.Type: ApplicationFiled: October 19, 2009Publication date: April 21, 2011Applicant: ZARLINK SEMICONDUCTOR ABInventors: Odd Robert Steijer, Hans Magnus Emil Andersson, Asa Christina Johansson, Lennart Per Olof Lundqvist, Sylvia Anna-Karin Ek, Maria Elisabeth Källén
-
Publication number: 20110064363Abstract: Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.Type: ApplicationFiled: September 14, 2009Publication date: March 17, 2011Applicant: ZARLINK SEMICONDUCTOR ABInventors: Odd Robert Steijer, Hans Magnus Emil Andersson
-
Publication number: 20110062572Abstract: Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding number of through holes in the silicon substrate to permit the passage of light therethrough and further providing guide holes in the silicon substrate to present means for passive alignment of an external optical connection; and dicing the optical device carrier assembly to form individual optical devices. Preferably, the step of attaching a number of optical dies comprises using self-alignment of solder bumps using gaseous flux, the through holes are dry etched into the silicon substrate, and/or the volume between the optical die and silicon substrate is filled with a transparent polymer. Preferably, the transparent polymer is silicone rubber or epoxy.Type: ApplicationFiled: September 14, 2009Publication date: March 17, 2011Applicant: ZARLINK SEMICONDUCTOR ABInventors: Odd Robert Steijer, Hans Magnus Emil Andersson
-
Patent number: 7513698Abstract: An optic fiber connection arrangement has a module mountable on a printed circuit board, and an optic fiber coupler including mating components. One of the mating components is adapted for coupling into the module. A frame supports one of the components. The frame is releasably latchable to the module so as to couple and decouple the mating component to the module. In this way, the optic fiber coupler can be removed from the module by releasing the frame. The other mating component can be removed from the one mating component after removal of the frame from the module.Type: GrantFiled: November 22, 2006Date of Patent: April 7, 2009Assignee: Zarlink Semiconductor ABInventor: Hans Magnus Emil Andersson
-
Publication number: 20080199187Abstract: Disclosed is an optical floating sub-assembly, comprising a thermally conductive non rigid substance between the heat sink carrier and external casing, to minimize mechanical stress on the optical assembly. Also disclosed is a printed circuit board as an electrical interface, comprising two modules capable of converting an electrical signal to an optical signal, transmitting the optical signal and then converting the optical signal back to an electrical signal. Also disclosed is an optical assembly, comprising a heat sink with mechanical features for optical alignment.Type: ApplicationFiled: February 13, 2008Publication date: August 21, 2008Applicant: ZARLINK SEMICONDUCTOR ABInventors: Hans Magnus Emil Andersson, Asa Christina Johansson, John Krister Frode, Lars-Gote Svensson
-
Publication number: 20080112674Abstract: An optic fiber connection arrangement has a module mountable on a printed circuit board, and an optic fiber coupler including mating components One of the mating components is adapted for coupling into the module. A frame supports one of the components. The frame is releasably latchable to the module so as to couple and decouple the mating component to the module. In this way, the optic fiber coupler can be removed from the module by releasing the frame. The other mating component can be removed from the one mating component after removal of the frame from the module.Type: ApplicationFiled: November 22, 2006Publication date: May 15, 2008Applicant: Zarlink Semiconductor ABInventor: Hans Magnus Emil Andersson