Abstract: A method for packaging display panel is provided. The method comprises following steps: providing a first substrate; pasting a frit on the first substrate; pre-sintering the frit in a specific temperature; forming a color filter unit on the first substrate; providing a second substrate oppositely disposed on the first substrate after pre-sintering the frit; and assembling the first substrate and the second substrate with the frit by way of laser sealing.

Abstract: An OLED display is disclosed, which includes a substrate and a plurality of pixel groups arranged on the substrate. Each pixel group includes a first, a second, a third and a fourth sub-pixel. Arrangements of the first, second, third and fourth sub-pixels in two neighboring pixel groups are symmetrical with each other. In addition, the distance between the third sub-pixels and the distance between the fourth sub-pixels in two neighboring pixel group are greater than the distance between the first sub-pixels in the two neighboring pixel group.

Abstract: This disclosure provides a display apparatus and the sealing method thereof. The display apparatus includes: a substrate having a displaying region and a non-displaying region surrounding the displaying region; and a frit disposed on the non-displaying region to form a closed loop which surrounds the displaying region and has both a start portion and an end portion not overlapping each other; wherein a first light beam is applied to the frit to sinter it along the loop in a first direction, and a second light beam is applied to the frit to sinter it along the loop in a second direction, starting at the start portion and ending up at the end portion; wherein, the second direction is different from the first direction.

Abstract: An OLED display is provided. The OLED display includes a substrate, a first light-emissive layer, a second light-emissive layer, and two third light-emissive layers. The two third light-emissive layers corresponds a first sub-pixel and a second sub-pixel adjacent to the first sub-pixel. An axis passes through the first light-emissive layer and the second light-emissive layer. The axis is between the two third light-emissive layers. The configuration of the first sub-pixel and the second sub-pixel are symmetrical with respect to the axis.

Abstract: An organic electroluminescence display panel includes a substrate, an organic light-emitting layer disposed on the substrate, a first conductive pattern with a plurality of first meshes disposed on the substrate, a second conductive pattern with a plurality of second meshes disposed on the substrate and separated from the first conductive pattern, and a sealant dispensing area overlapped with the first conductive pattern and the second conductive pattern. A distance between two adjacent meshes of the first meshes is different from a distance between two adjacent meshes of the second meshes.

Abstract: An organic light emitting diode display panel is disclosed, which comprises: a first substrate having a first edge, a second edge, a third edge opposite to the first edge, and a fourth edge opposite to the second edge; a second substrate opposite to the first substrate; an organic light emitting diode unit disposed on the second substrate; a fit unit disposed between the first substrate and the second substrate and surrounding the organic light emitting diode unit; and a buffer unit disposed between the first substrate and the second substrate and between the frit unit facing to the first edge of the first substrate and the first edge thereof, wherein the buffer unit has a first end with a first cutting edge connecting to the second edge. In addition, the present invention also provides a method for manufacturing the same.

Abstract: An organic electroluminescence display panel comprises a first substrate, a second substrate assembled to the first substrate, an organic light-emitting layer positioned between the first and second substrates, a sealant positioned between the first and second substrates, a varying pattern zone, and supplemental pattern zone. The second substrate comprises a sealant dispensing area, a metal region, and a non-metal region adjacent to the metal region. The metal region includes plural traces. The sealant is formed in the sealant dispensing area of the second substrate. The varying pattern zone is formed at one of the traces of the metal region, and is corresponding to the sealant dispensing area. The varying pattern zone comprises plural conductive portions. The supplemental pattern zone comprising plural supplemental conductive portions is formed at the non-metal region. A width of the conductive portions is larger than a width of the supplemental conductive portions.

Abstract: A display device packaging method comprises steps of: providing a first substrate including a display region and a non-display region that surrounds the display region; providing an adhesive material which is disposed on the first substrate and formed into a closed curve surrounding the display region, wherein the closed curve has a start zone and an end zone connected to the start zone; providing a light-blocking element at least covering the end zone; providing a heating source radiating to the light-blocking element and moving the heating source to the start zone of the adhesive material; and scanning the adhesive material from the start zone to the end zone along the closed curve by the heating source. A display device is also disclosed.

Abstract: A display includes a substrate; an electrode layer formed on the substrate and having an electrode pattern; and an organic material layer formed on the electrode layer, wherein a plurality of pixel units are configured by the combination of the electrode pattern and the organic material layer. At least one of pixel units includes plural different colored sub-pixels arranged in delta. In one embodiment, the same colored sub-pixels of adjacent pixel units are arranged in delta. In another embodiment, the same colored sub-pixels of adjacent pixel units are arranged as a stripe. According to the embodiment, an opening of the shadow mask is corresponding to at least three sub-pixels with same color when the material is evaporated through the shadow mask.

Abstract: This disclosure provides a display apparatus and the sealing method thereof. The display apparatus includes: a substrate having a displaying region and a non-displaying region surrounding the displaying region; and a frit disposed on the non-displaying region to form a closed loop which surrounds the displaying region and has both a start portion and an end portion not overlapping each other; wherein a first light beam is applied to the frit to sinter it along the loop in a first direction, and a second light beam is applied to the frit to sinter it along the loop in a second direction, starting at the start portion and ending up at the end portion; wherein, the second direction is different from the first direction.

Abstract: An organic light emitting diode display and a manufacturing method thereof are provided. The organic light emitting diode display includes a first substrate, a second substrate, a plurality of organic light emitting diodes, and a frit layer. The organic light emitting diodes are disposed on the first substrate, and the frit layer adheres the first substrate and the second substrate to each other. The frit layer includes a first porous region having pores, a second porous region having pores, and a third porous region having pores. The number of the pores of the first porous region with a diameter of larger than or equal to 4 ?m and smaller than or equal to 15 ?m is greater than the number of the pores of the second porous region with the above-mentioned diameter range.

Abstract: An organic light-emitting diode device, including: a first substrate, wherein an organic light-emitting diode element is disposed on the first substrate; a second substrate, disposed to be opposite to the first substrate; a frit, disposed between the first substrate and the second substrate, having a laser pre-sintering start/end region and forming a closed space between the first substrate and the second substrate by laser sealing. At least one side of the laser pre-sintering start/end region has a gap, and the width of the gap is no bigger than 30% of the width of the frit.

Abstract: An OLED display is disclosed, which includes a substrate and a first and a second light emitting unit arranged on the substrate. A first, a second, a third and a fourth region are defined on the substrate, wherein the sub-pixels in the first and fourth regions and the sub-pixels in the second and third regions are symmetrical with each other. Alternatively, the sub-pixels in the first region and the sub-pixels in the third region are point symmetric to a center of the first light emitting unit, so as to improve displaying resolution of the OLED display.

Abstract: An OLED display is provided. The OLED display includes a substrate, a first light-emissive layer, a second light-emissive layer, and two third light-emissive layers. The two third light-emissive layers corresponds a first sub-pixel and a second sub-pixel adjacent to the first sub-pixel. An axis passes through the first light-emissive layer and the second light-emissive layer. The axis is between the two third light-emissive layers. The configuration of the first sub-pixel and the second sub-pixel are symmetrical with respect to the axis.

Abstract: An organic light emitting diode display and a manufacturing method thereof are provided. The organic light emitting diode display includes a first substrate, a second substrate, a plurality of organic light emitting diodes, and a frit layer. The organic light emitting diodes are disposed on the first substrate, and the frit layer adheres the first substrate and the second substrate to each other. The frit layer includes a first porous region having pores, a second porous region having pores, and a third porous region having pores. The number of the pores of the first porous region with a diameter of larger than or equal to 4 ?m and smaller than or equal to 15 ?m is greater than the number of the pores of the second porous region with the above-mentioned diameter range.

Abstract: A method of fabricating a pixel structure for an organic light-emitting display (OLED) is disclosed. A substrate having at least a sub-pixel region is provided. An auxiliary electrode layer and an insulating layer are formed on the substrate in the sub-pixel region, wherein the insulating layer has an opening to expose the auxiliary electrode layer. A lower electrode layer, an organic light emission layer, and an upper electrode layer are formed on the substrate, wherein the organic light emission layer fills the opening in the insulating layer. Another opening is formed in the upper electrode layer and the organic light emission layer directly on the opening in the insulating layer by performing a laser process, such that the upper electrode layer and the auxiliary electrode layer are welded together through the opening in the upper electrode layer and the organic light emission layer.

Abstract: An organic light emitting diode display panel is disclosed, which comprises: a first substrate having a first edge, a second edge, a third edge opposite to the first edge, and a fourth edge opposite to the second edge; a second substrate opposite to the first substrate; an organic light emitting diode unit disposed on the second substrate; a fit unit disposed between the first substrate and the second substrate and surrounding the organic light emitting diode unit; and a buffer unit disposed between the first substrate and the second substrate and between the frit unit facing to the first edge of the first substrate and the first edge thereof, wherein the buffer unit has a first end with a first cutting edge connecting to the second edge. In addition, the present invention also provides a method for manufacturing the same.

Abstract: An organic electroluminescence display panel comprises a first substrate, a second substrate assembled to the first substrate, an organic light-emitting layer positioned between the first and second substrates, a sealant positioned between the first and second substrates, a varying pattern zone, and supplemental pattern zone. The second substrate comprises a sealant dispensing area, a metal region, and a non-metal region adjacent to the metal region. The metal region includes plural traces. The sealant is formed in the sealant dispensing area of the second substrate. The varying pattern zone is formed at one of the traces of the metal region, and is corresponding to the sealant dispensing area. The varying pattern zone comprises plural conductive portions. The supplemental pattern zone comprising plural supplemental conductive portions is formed at the non-metal region. A width of the conductive portions is larger than a width of the supplemental conductive portions.

Abstract: A method for packaging display panel is provided. The method comprises following steps: providing a first substrate; pasting a frit on the first substrate; pre-sintering the frit in a specific temperature; forming a color filter unit on the first substrate; providing a second substrate oppositely disposed on the first substrate; and assembling the first substrate and the second substrate with the frit by way of laser sealing.

Abstract: An organic light emitting display device includes a first substrate, an organic light emitting diode array, a thin film encapsulation layer, a second substrate, a sealant member and a buffer layer. First substrate has a light emitting region and a non-light emitting region. OLED array is configured in light emitting region covered by encapsulation layer. Second substrate has a color filter array and is arranged opposite first substrate. Sealant member is disposed between first and second substrates. Buffer layer has a first light shielding layer disposed thereon, is arranged between first and second substrates, and is configured in light emitting region. Light shielding layer is arranged between buffer layer and encapsulation layer. The sum of the buffer layer's thickness and a gap distance from buffer layer to encapsulation layer has a range from 5 to 20 ?m. Buffer layer has hardness smaller than that of the color filter array.