Patents by Inventor Harald Guenther

Harald Guenther has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220202566
    Abstract: The present invention generally relates to a system for two-photon or multi-photon irradiating an artificial lens, preferably an intraocular lens preferably arranged within an eye of a patient and a method for locally adjusting a polarizability and/or a refractive index of an artificial lens preferably an intraocular lens preferably arranged within an eye of a patient. The method relates in particular to fabrication of optical profiles by adjusting polarizability through two- or multi-photon processes in a non-destructive manner.
    Type: Application
    Filed: April 24, 2020
    Publication date: June 30, 2022
    Applicant: Merck Patent GmbH
    Inventors: Martin SCHRAUB, Lars DOBELMANN-MARA, Simon HELMSTETTER, David MOORE, Stefan RIEDMUELLER, Harald GUENTHER
  • Publication number: 20110012762
    Abstract: A method and a device are disclosed for digitizing an analog electrical signal, in which the signal is applied to a number of subchannels connected in parallel. In at least one embodiment, the amplitude ranges of immediately adjacent subchannels with respect to amplitude are in each case displaced overlapping one another, in which the overlapping amplitude ranges include the total amplitude range, in which a subchannel serves as reference channel, in which, on the basis of the reference channel, the digital output value of the immediately adjacent subchannel with respect to amplitude is corrected when the signal is in the overlap range of the two subchannels and the digital values differ from one another, and in which a total digital value is output by way of a digital output value, taking into consideration the displacements of the amplitude ranges with respect to one another.
    Type: Application
    Filed: July 14, 2010
    Publication date: January 20, 2011
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Thomas Driehorn, Harald Günther, Jürgen Haible
  • Patent number: 7653109
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: January 26, 2010
    Assignee: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim W. Li, Nina D. Morozova
  • Patent number: 7551084
    Abstract: The invention relates to a system and a method for identifying automation components, particularly sensors, actuators and wiring components. According to the invention, each component (sensor, actuator, cable, compensation box, etc.) that is to be identified is equipped with an identification unit in which a code for identifying the automation component is stored and which outputs said identification code when being activated. Preferably, the identification unit comprises an electronic circuit (e.g. an RFID chip or a discreet circuit) while being provided with galvanically insulating (inductive, capacitive, radio-based) or galvanically conducting coupling to the component that is to be identified. The identification unit can be subsequently mounted on a component or can be inseparably connected thereto already during the production of the component.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: June 23, 2009
    Assignee: Siemens Aktiengesellschaft
    Inventors: Harald Günther, Dieter Munz
  • Patent number: 7462041
    Abstract: An automation system and a method for identifying and correcting connection errors of field devices that are connected to an automation system are provided. A connecting unit is used to optionally connect field device connections of an automation system with connections of a feed or measuring component of the automation system.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: December 9, 2008
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ulf Bormann, Harald Günther, Dieter Munz, Torsten Vogt
  • Publication number: 20070248139
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Application
    Filed: June 25, 2007
    Publication date: October 25, 2007
    Applicant: Gemfire Corporation
    Inventors: William Bischel, David Wagner, Harald Guenther, Simon Field, Markus Hehlen, Richard Tompane, Andrew Ryan, C. Fanning, Jim Li, Nina Morozova
  • Patent number: 7235150
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: June 26, 2007
    Assignee: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim W. Li, Nina D. Morozova
  • Publication number: 20050046928
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Application
    Filed: July 23, 2004
    Publication date: March 3, 2005
    Inventors: William Bischel, David Wagner, Harald Guenther, Simon Field, Markus Hehlen, Richard Tompane, Andrew Ryan, C. Fanning, Jim Li, Nina Morozova
  • Publication number: 20040105611
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Application
    Filed: July 9, 2003
    Publication date: June 3, 2004
    Applicant: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim Weijian Li, Nina D. Morozova
  • Publication number: 20030133668
    Abstract: Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.
    Type: Application
    Filed: January 3, 2003
    Publication date: July 17, 2003
    Inventors: David K. Wagner, Harald Guenther, William K. Bischel, Jim Weijian Li, Nina D. Morozova
  • Publication number: 20020110328
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 15, 2002
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim Weijian Li, Nina D. Morozova
  • Publication number: 20020110335
    Abstract: Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 15, 2002
    Inventors: David K. Wagner, Harald Guenther, William K. Bischel, Jim Weijian Li, Nina D. Morozova