Patents by Inventor Harel Frish

Harel Frish has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190158209
    Abstract: There is disclosed in one example a fiberoptic communication circuit for wavelength division multiplexing (WDM) communication, including: an incoming waveguide to receive an incoming WDM laser pulse; an intermediate slab including a demultiplexer circuit to isolate n discrete modes from the incoming WDM laser pulse; n outgoing waveguides to receive the n discrete modes, the outgoing waveguides including fully-etched rib-to-channel waveguides; and an array of n photodetectors to detect the n discrete modes.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 23, 2019
    Applicant: Intel Corporation
    Inventors: Wenhua Lin, Judson Douglas Ryckman, Ling Liao, Kelly Christopher Magruder, Harel Frish, Assia Barkai, Han-din Liu, Yimin Kang
  • Publication number: 20190157837
    Abstract: There is disclosed in one example a fiberoptic communication device, including: a modulator to modulate data onto a laser pulse; and a semiconductor laser source including an active optical waveguide to provide optical gain and support an optical mode, the laser source further including a V-shaped current channel superimposed on the optical waveguide, and disposed to feed the active optical waveguide with electrical current along its length, the current channel having a proximate end to the optical mode, the proximate end having a width substantially matching a diameter of the optical mode, and a removed end from the optical mode, wherein the removed end is substantially wider than the proximate end.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 23, 2019
    Inventors: Pierre Doussiere, George A. Ghiurcan, Jonathan K. Doylend, Harel Frish
  • Publication number: 20190129095
    Abstract: Embodiments may relate to a silicon photonic chip, and particularly a back absorber within the silicon photonic chip. The back absorber may include a substrate material with a slab portion that includes a doped portion of the substrate material. The back absorber may be positioned at the backside of a laser that is configured to project light along a waveguide of the silicon photonic chip. Other embodiments may be described or claimed.
    Type: Application
    Filed: December 11, 2018
    Publication date: May 2, 2019
    Applicant: Intel Corporation
    Inventors: Kimchau Nhu Nguyen, George A. Ghiurcan, Yoel Chetrit, Jeffrey B. Driscoll, Richard Jones, Harel Frish, Reece A. Defrees, Wenhua Lin, Jung S. Park
  • Publication number: 20190123109
    Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 25, 2019
    Applicant: Intel Corporation
    Inventors: Boping Xie, Ansheng Liu, Olufemi Isiade Dosunmu, Alexander Krichevsky, Kelly Christopher Magruder, Harel Frish
  • Patent number: 10209449
    Abstract: A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 19, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Harel Frish
  • Publication number: 20190044003
    Abstract: In embodiments, an optoelectronic apparatus may include a substrate with a first side and a second side opposite the first side; a photodetector disposed on the first side of the substrate, the photodetector to convert a light signal into an electrical signal; and a dielectric metasurface lens etched into the second side of the substrate, the dielectric metasurface lens to collect incident light and focus it through the substrate onto the photodetector.
    Type: Application
    Filed: March 21, 2018
    Publication date: February 7, 2019
    Inventors: John Heck, Harel Frish, Paul R. West
  • Publication number: 20190025512
    Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.
    Type: Application
    Filed: July 16, 2018
    Publication date: January 24, 2019
    Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
  • Publication number: 20190025520
    Abstract: A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.
    Type: Application
    Filed: September 21, 2018
    Publication date: January 24, 2019
    Inventor: Harel Frish
  • Patent number: 10054740
    Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: August 21, 2018
    Assignee: INTEL CORPORATION
    Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
  • Publication number: 20180188453
    Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 5, 2018
    Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
  • Publication number: 20170357057
    Abstract: A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.
    Type: Application
    Filed: July 31, 2017
    Publication date: December 14, 2017
    Inventor: Harel Frish
  • Publication number: 20170336565
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a single mode optical coupler device. In some embodiments, the device may include a multi-stage optical taper to convert light from a first mode field diameter to a second mode field diameter larger than the first mode field diameter, and a mirror formed in a dielectric layer under an approximately 45 degree angle with respect to a plane of the dielectric layer to reflect light from the multi-stage optical taper substantially perpendicularly to propagate the light in a single mode fashion. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 30, 2016
    Publication date: November 23, 2017
    Inventors: Judson D. Ryckman, Harel Frish, George A. Ghiurcan, Ansheng Liu, Haisheng Rong, Pradeep Srinivasan, Carsten Brandt, Isako Hoshino, Michael A. Creighton
  • Patent number: 9753226
    Abstract: A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: September 5, 2017
    Assignee: Micron Technology, Inc.
    Inventor: Harel Frish
  • Patent number: 9709734
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: July 18, 2017
    Assignee: Intel Corporation
    Inventors: Mahesh Krishnamurthi, Judson Ryckman, Haisheng Rong, Ling Liao, Harel Frish, Oshrit Harel, Assia Barkai, Yun-Chung Na, Han-Din Liu
  • Publication number: 20160209589
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 30, 2016
    Publication date: July 21, 2016
    Inventors: Mahesh Krishnamurthi, Judson Ryckman, Haisheng Rong, Ling Liao, Harel Frish, Oshrit Harel, Assia Barkai, Yun-Chung Na, Han-Din Liu
  • Patent number: 9395494
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical device having a semiconductor layer to propagate light and a mirror disposed inside the semiconductor layer and having echelle grating reflective surface to substantially totally internally reflect the propagating light inputted by one or more input waveguides, to be received by one or more output waveguides. The waveguides may be disposed in the semiconductor layer under a determined angle relative to the mirror reflective surface. The determined angle may be equal to or greater than a total internal reflection angle corresponding to the interface, to provide substantially total internal reflection of light by the mirror. The mirror may be formed by an interface of the semiconductor layer comprising the mirror reflective surface and another medium filling the mirror, such as a dielectric. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: July 19, 2016
    Assignee: Intel Corporation
    Inventors: Mahesh Krishnamurthi, I-Wei Hsieh, Haisheng Rong, Oshrit Harel, Harel Frish, Assia Barkai, Wenhua Lin
  • Patent number: 9348099
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: May 24, 2016
    Assignee: Intel Corporation
    Inventors: Mahesh Krishnamurthi, Judson Ryckman, Haisheng Rong, Ling Liao, Harel Frish, Oshrit Harel, Assia Barkai, Yun-Chung Na, Han-Din Liu
  • Publication number: 20160109658
    Abstract: A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.
    Type: Application
    Filed: December 21, 2015
    Publication date: April 21, 2016
    Inventor: Harel Frish
  • Publication number: 20160103282
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical device having a semiconductor layer to propagate light and a mirror disposed inside the semiconductor layer and having echelle grating reflective surface to substantially totally internally reflect the propagating light inputted by one or more input waveguides, to be received by one or more output waveguides. The waveguides may be disposed in the semiconductor layer under a determined angle relative to the mirror reflective surface. The determined angle may be equal to or greater than a total internal reflection angle corresponding to the interface, to provide substantially total internal reflection of light by the mirror. The mirror may be formed by an interface of the semiconductor layer comprising the mirror reflective surface and another medium filling the mirror, such as a dielectric. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 16, 2015
    Publication date: April 14, 2016
    Inventors: MAHESH KRISHNAMURTHI, I-WEI HSIEH, HAISHENG RONG, OSHRIT HAREL, HAREL FRISH, ASSIA BARKAI, WENHUA LIN
  • Patent number: 9250388
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical device having a semiconductor layer to propagate light and a mirror disposed inside the semiconductor layer and having echelle grating reflective surface to substantially totally internally reflect the propagating light inputted by one or more input waveguides, to be received by one or more output waveguides. The waveguides may be disposed in the semiconductor layer under a determined angle relative to the mirror reflective surface. The determined angle may be equal to or greater than a total internal reflection angle corresponding to the interface, to provide substantially total internal reflection of light by the mirror. The mirror may be formed by an interface of the semiconductor layer comprising the mirror reflective surface and another medium filling the mirror, such as a dielectric. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: February 2, 2016
    Assignee: INTEL CORPORATION
    Inventors: Mahesh Krishnamurthi, I-Wei Hsieh, Haisheng Rong, Oshrit Harel, Harel Frish, Assia Barkai, Wenhua Lin