Abstract: Novel thermoplastic adhesive components, prepared from inexpensive and readily available synthetic materials, having melting points between about 20.degree. C. to about 180.degree. C. and broad ranges of hardness, flexibility and compatibility are disclosed. The novel thermoplastic compounds useful in adhesive formulations are comprised of a resinous polyamide reaction product of a polyoxypropylene polyamine having an average molecular weight of from about 190 to about 3,000 and being selected from diamines, triamines, or mixtures thereof, piperazine and an aliphatic or aromatic dicarboxylic acid, ester or anhydride having from about 4 to about 20 carbon atoms per molecule. The resinous polyamide reaction product is prepared by mixing and reacting the polyoxypropylene polyamine, piperazine, and dicarboxylic acid materials in a total amine:acid molar ratio within the range of from about 0.25:1.0 to about 4.0:1.0 at a temperature of from about 175.degree. C. to about 270.degree. C.

Abstract: Covers a polymeric amine having the following structural formula: ##STR1## where x is an average number ranging from about 6 to 50, and y and z are average numbers ranging from about 1 to about 20, with the sum of y and z being from about 6 to about 40. Also covers a method of preparing said amine polymer.

Abstract: A process for the accelerated cure of an epoxy resin is disclosed. The resulting epoxy resin may be used in protective coatings, adhesives, seamless and terrazo flooring and caulking and sealing compositions. The resulting resin is also useful, for example, in casting, potting, in escapulating, grouting and patching. The process involves mixing an epoxy resin of the polyhydric phenol, polyglycidyl ether type with a curing agent comprising the reaction product of an epoxy resin with an excess of an aminoalkylene derivative of a polyoxyalkylenepolyamine.

Abstract: A water based epoxy resin is disclosed. The epoxy resin is useful in protective coatings. It should have little or no utility in casting, encapsulating, etc. applications because of difficulty in removal of solvent, i.e., water. The cured epoxy resin is made by curing an epoxy resin of the polyhydric phenol, polyglycidyl ether type by combining the resin with a reactive water-compatible polyamide in an aqueous medium. The polyamide is prepared from fatty acids and an aminopropyl derivative of a polyoxyalkylenepolyamine.

Abstract: An improved curable epoxy resin composition of a vicinalpolyepoxide and an effective amount of a novel polyether urea curing agent is disclosed. The improved curable epoxy resins which are useful as coatings, castings, sealants, and adhesives show improved tensile shear strength, flexural strength, and ultimate elongation. The novel polyether urea curing agents of the instant invention are characterized by terminal primary amino groups and are formed by reaction of polyoxyalkylenepolyamines with urea, urea forming compounds, or bifunctional isocyanates.A preferred curing agent includes a mixture of a novel polyether urea formed by reaction of a polyoxypropylenepolyamine having a molecular weight of from about 200-2000 and an effective amount of urea; and another known epoxy resin curing agent such as polyoxyalkylenepolyamine in ratios of from about 5:1 to 1:5 by weight.

Abstract: The adhesion properties of amine-cured epoxy resins are enhanced by addition of certain polyether diureide additives in combination with specific amine curing agents. The adhesively superior epoxy resin composition comprises a vincinal polyepoxide, a curing amount of an aminopropyl ethylenediamine curing agent, and an effective amount of a polyether diureide having terminal ureido or monosubstituted ureido groups and a molecular weight of from about 2000 to about 3000.

Abstract: Resistance to thermal shock of certain anhydride cured epoxy resins is unexpectedly enhanced by addition of a diamide of a polyoxyalkylenepolyamine-urea condensate. This superior resistance does not appreciably compromise heat deflection properties. The resins comprise a vicinal polyepoxide, a curing amount of a certain bicyclic anhydride and an effective amount of a diamide of a polyoxyalkylenepolyamine-urea condensate having a molecular weight of from about 4000 to 4500.

Abstract: A process for the water based cure of an epoxy resin is disclosed. The resulting epoxy resin is useful in protective coatings. The epoxy system of the patent application should be useful in coating formulations. It should have little or no utility in casting, encapsulating, etc. applications because of difficulty in removal of solvent, i.e., water. The process involves curing an epoxy resin of the polyhydric phenol, polyglycidyl ether type by combining the resin with a reactive water-compatible polyamide in an aqueous medium. The polyamide is prepared from fatty acids and an aminopropyl derivative of a polyoxyalkylenepolyamine.

Abstract: A process for the accelerated cure of an epoxy resin is disclosed. The resulting epoxy resin may be used in protective coatings, adhesives, seamless and terrazo flooring and caulking and sealing compositions. The resulting resin system is also useful, for example, in casting, potting, in escapulating, grouting and patching. The process involves mixing an epoxy resin of the polyhydric phenol, polyglycidyl ether type with a novel accelerator-hardener which is a condensation product of phenol, formaldehyde and an aminoalkylene derivative of a polyoxyalkylenepolyamine.

Abstract: Novel thermoplastic adhesive components, prepared from inexpensive and readily available synthetic materials, having melting points between about 20.degree. C. to about 180.degree. C. and broad ranges of hardness, flexibility and compatibility are disclosed. The novel thermoplastic compounds useful in adhesive formulations are comprised of a resinous polyamide reaction product of a polyoxypropylene polyamine having an average molecular weight of from about 190 to about 3,000 and being selected from diamines, triamines, or mixtures thereof, piperazine and an aliphatic or aromatic dicarboxylic acid, ester or anhydride having from about 4 to about 20 carbon atoms per molecule. The resinous polyamide reaction product is prepared by mixing and reacting the polyoxypropylene polyamine, piperazine, and dicarboxylic acid materials in a total amine:acid molar ratio within the range of from about 0.25:1.0 to about 4.0:1.0 at a temperature of from about 175.degree. C. to about 270.degree. C.

Abstract: A liquid methylene bridged polyaromatic amine curing agent for vicinal epoxide resins with high amine content is prepared by reacting an aromatic amine mixture of aniline containing two to eight mole percent of a mononuclear aromatic diamine having the amine groups bonded to nonadjacent carbon atoms of the aromatic ring, with formaldehyde. The resulting methylene bridged polyaromatic amine curing agent produces a cured epoxy resin having a higher heat distortion temperature than conventional curing agents produced by the reaction of aniline alone with formaldehyde.

Abstract: An adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of an amine curing agent, and an effective amount of an additive comprising a polyoxyalkylenepolyamine-maleic anhydride condensation product having thioureide, ureide or thioformamide or formamide end groups.

Abstract: An epoxy resin having superior resistance to thermal shock comprises a vicinal polyepoxide, a curing amount of a certain bicyclic anhydride and an effective amount of an additive comprising a polyoxyalkylenepolyamine-maleic anhydride condensation product having thioureide, ureide or thioformamide or formamide end groups.

Abstract: The adhesion properties of amine-cured epoxy resins are unexpectedly enhanced by addition of certain diamides of polyoxyalkylenepolyamine-urea condensates. The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of an amine curing agent, and an effective amount of a diamide of a polyoxyalkylenepolyamine-urea condensate having a molecular weight of from 4000 to about 4500.

Abstract: The resistance to thermal shock of anhydride cured epoxy resins is improved by the addition of a bis ureide of a polyoxyalkylene polyamine additive. The heat deflection properties of the epoxy resins are not appreciably compromised by the addition of the additive. The improved epoxy resin composition comprises a vicinal polyepoxide, an effective amount of a substituted bicyclic vicinal anhydride curing agent and an effective amount of a thermal shock resistance improving additive consisting essentially of a bis ureide of a polyoxyalkylene polyamine, said additive having an average molecular weight of at least 4,000.

Abstract: The adhesive strength of amine-cured epoxy resins are improved by the addition of a bis ureide of a polyoxyalkylene polyamine additive. The improved epoxy resin composition comprises a vicinal polyepoxide, an effective amount of a polyamine curing agent, and an effective amount of an adhesive strengthening additive consisting essentially of a bis ureide of a polyoxyalkylene polyamine, said additive having an average molecular weight of at least 4,000.

Abstract: Novel thermoplastic adhesive components, prepared from inexpensive and readily available synthetic materials, having melting points between about 20.degree. C. to about 180.degree. C. and broad ranges of hardness, flexibility and compatibility are disclosed. The novel thermoplastic compounds useful in adhesive formulations are comprised of a resinous polyamide reaction product of a polyoxypropylene polyamine having an average molecular weight of from about 190 to about 3,000 and being selected from diamines, triamines, or mixtures thereof, piperazine and an aliphatic or aromatic dicarboxylic acid, ester or anhydride having from about 4 to about 20 carbon atoms per molecule. The resinous polyamide reaction product is prepared by mixing and reacting the polyoxypropylene polyamine, piperazine, and dicarboxylic acid materials in a total amine:acid molar ratio within the range of from about 0.25:1.0 to about 4.0:1.0 at a temperature of from about 175.degree. C. to about 270.degree. C.

Abstract: A process for the accelerated cure of an epoxy resin is disclosed. The resulting epoxy resin may be used in protective coatings, adhesives, seamless and terrazo flooring and caulking and sealing compositions. The resulting resin is also useful, for example, in casting, potting, in escapulating, grouting and patching. The process involves mixing an epoxy resin of the polyhydric phenol, polyglycidyl ether type by mixing with an accelerator-hardener combination made up of (a) a liquid mixture of salicyclic acid and either iminobis(propylamine) or methyliminobis(propylamine) and (b) a polyoxyalkylenepolyamine and allowing the mixture to cure at ambient or elevated temperatures.

Abstract: Resistance to thermal shock of certain anhydride cured epoxy resins is unexpectedly enhanced by addition of certain polyether diureide additives. This superior resistance does not appreciably compromise heat deflection properties. The resins comprise a vicinal polyepoxide, a curing amount of a certain bicyclic anhydride and an effective amount of a polyether diureide having terminal ureido groups and a molecular weight of from about 2,000 to about 3,000.

Abstract: The adhesion properties of amine-cured epoxy resins are unexpectedly enhanced by addition of certain amino terminated polyether succinimide additives. The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of an amine curing agent, and an effective amount of a polyether succinimide having terminal amino groups and a molecular weight of from about 4000 to about 4500.