Abstract: An improved ejector mechanism is disclosed in conjunction with a header connector into which an IC pack is loaded and from which it is ejected. The IC pack includes a shell having a vertically extending leading face and at least one row of contacts extending a horizontal distance defining a contact array. A unitary ejecting lever is pivotally mounted to the header connector, with one end of the lever being effective to engage and eject the IC pack from the header connector. A unitary push-rod is reciprocally axially movably mounted on an appropriate support at one side of the header connector. One end of the push rod is engageable with the opposite end of the ejecting lever for pivoting the lever in response to movement of the push-rod. The one end of the ejecting lever engages and ejects the IC pack along a leading face thereof in an area defined horizontally by the distance the row of contacts extends and vertically by the height of the leading face of the memory card.