Abstract: An example method performed by a wireless-power-transmitting device including an antenna array is provided. The method includes, based on a location of the wireless-power-receiving device, selecting a first value for a first transmission characteristic that is used for transmission of electromagnetic waves by a first antenna group, and a second value, distinct from the first value, for the first transmission characteristic that is used for transmission of electromagnetic waves by a second antenna group. The method also includes transmitting to the location of the wireless-power-receiving device, by the first antenna group, first electromagnetic waves with the first value for the first transmission characteristic, and transmitting to a focal point that is further from the wireless-power-transmitting device than the location of the wireless-power-receiving device, by the second antenna group, second electromagnetic waves with the second value for the first transmission characteristic.

Abstract: The present invention relates to a method for generating a low pressure plasma circulating in a planar direction within a process enclosure. The invention generates plasma having substantially uniform density characteristics across a planar axis. The invention achieves improved uniformity of the plasma density by delivering more radio frequency power toward the periphery of the circulating plasma than toward the center of the plasma. Increasing the periphery power to the circulating plasma compensates for increased plasma losses due to interaction with the side walls of the process containment enclosure.

Abstract: The present invention relates to an apparatus for generating a low pressure plasma circulating in a planar direction within a process enclosure. The invention generates plasma having substantially uniform density characteristics across a planar axis. The invention achieves improved uniformity of the plasma density by delivering more radio frequency power toward the periphery of the circulating plasma than toward the center of the plasma. Increasing the periphery power to the circulating plasma compensates for increased plasma losses due to interaction with the side walls of the process containment enclosure.