Patents by Inventor Harry Walter SAX

Harry Walter SAX has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210375792
    Abstract: A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Applicant: Infineon Technologies AG
    Inventors: Harry Walter SAX, Johann GATTERBAUER, Wolfgang LEHNERT, Evelyn NAPETSCHNIG, Michael ROGALLI