Patents by Inventor Harry Walter SAX

Harry Walter SAX has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
    Publication number: 20230395532
    Abstract: A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Applicant: Infineon Technologies AG
    Inventors: Harry Walter SAX, Johann GATTERBAUER, Wolfgang LEHNERT, Evelyn NAPETSCHNIG, Michael ROGALLI
  • Chip package and method of forming a chip package
    Patent number: 11735534
    Abstract: A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: August 22, 2023
    Assignee: Infineon Technologies AG
    Inventors: Harry Walter Sax, Johann Gatterbauer, Wolfgang Lehnert, Evelyn Napetschnig, Michael Rogalli
  • CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING A CHIP PACKAGE STRUCTURE
    Publication number: 20230064442
    Abstract: A chip package structure is disclosed. In one example, the chip package may include a chip, an encapsulation material, and an exposed pad that is electrically conductively connected to the chip. A layer of a porous or dendrite-comprising adhesion promoter is on a surface of the exposed pad. A thermal interface material that is attached to the exposed pad by the layer.
    Type: Application
    Filed: August 3, 2022
    Publication date: March 2, 2023
    Applicant: Infineon Technologies AG
    Inventors: Chan Whai Augustine KAN, Martin MAYER, Edmund RIEDL, Edward FUERGUT, Harry Walter SAX
  • METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, DIE, AND DIE PACKAGE
    Publication number: 20220230919
    Abstract: A method of manufacturing a semiconductor package is provided. The method may include singulating a wafer including a plurality of dies fixed to an auxiliary carrier to generate dies having released side surfaces, covering at least the side surfaces of the dies with a passivation layer using a deposition process at a temperature below the melting temperature of the auxiliary carrier, keeping a gap between the passivation layers at the side surfaces of adjacent dies of the plurality of dies.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 21, 2022
    Applicant: Infineon Technologies AG
    Inventors: Fabian CRAES, Wolfgang LEHNERT, Maik LOHMANN, Harry Walter SAX
  • CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
    Publication number: 20210375792
    Abstract: A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Applicant: Infineon Technologies AG
    Inventors: Harry Walter SAX, Johann GATTERBAUER, Wolfgang LEHNERT, Evelyn NAPETSCHNIG, Michael ROGALLI